Abstract: The present invention relates to a support assembly for an electronic component, at least including a metallic heat sink, and a plastic element with a receiving section for accommodating the electronic component. The plastic element is connected to the heat sink in a form-fit manner. The receiving section of the plastic element covers a heat input side of the heat sink. The plastic element includes a thermosetting plastic with fillers for increasing the thermal conductivity.

Abstract: A radiant heating tube device with a fuel-heated burner and a flame tube located inside the radiant heating tube often shows an undesirable increase in temperature in the area of the closed end of the radiant tube. This temperature rise can be reduced by installing an additional tube or other flow body in the area of the end of the flame tube. This achieves a more uniform radiant tube surface temperature.

Abstract: The invention relates to an actuation device for at least one fluidically drivable load (10), such as a hydraulic actuator, consisting of at least one valve controller (V1) for controlling an alternating movement of each load (10) and at least one suspension device (14) which is connected between the valve controller (V1) and each load (10), wherein the suspension device (14) has an additional valve controller (V2), the valve piston (20) of which can be moved in a corresponding valve housing in a continuously adjustable manner. The invention is characterized in that a storage device (16) of the suspension device (14) is connected to the respective load (10) via a fluid path by means of the additional valve controller (V2) in a suspension position (V2.IV) of the valve piston (20) of the additional valve controller (V2).

Abstract: Embodiments of the present invention provide computer-implemented methods, computer program products, and computer systems. Specifically, embodiments of the present invention can dynamically adjust individual message retention times in a messaging system is disclosed. Embodiments of the present invention can then receive a plurality of messages, store the plurality of messages in a storage system, determine continuously, by the messaging system, interactions with messages stored by the messaging system, and determine dynamically, by the messaging system, a retention score value for selected messages based on a sum of weighted interactions type count values of the determined interactions. Finally, embodiments of the present invention can delete by the messaging system, messages for which the retention score value is below a predetermined retention threshold value.

Abstract: The present invention relates to a support assembly for an electronic component, at least including a metallic heat sink, and a plastic element with a receiving section for accommodating the electronic component. The plastic element is connected to the heat sink in a form-fit manner. The receiving section of the plastic element covers a heat input side of the heat sink. The plastic element includes a thermosetting plastic with fillers for increasing the thermal conductivity.

Abstract: A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface.

Abstract: An apparatus for connecting a field device to a communication system includes a field device interface for connecting the apparatus to the field device, a communication interface for connecting the apparatus to the communication system, a protocol conversion unit, and a switching unit. The switching unit is configured to recognize a protocol used by the field device and to establish a connection between the field device and the communication interface via the protocol conversion unit depending on the recognized protocol. Further, a method of connecting a field device to a communication system includes recognizing a protocol used by the connected field device, performing a protocol conversion depending on the recognized protocol, and establishing a connection between the connected field device and the communication system.

Abstract: An apparatus and method for filling bulk materials into open-mouth bags is provided, which includes the following steps: a) an open-mouth bag is placed beneath a filling spout of a filling station; b) the filling spout is lowered and the open-mouth bag is appended to the filling spout; c) the filling spout with the appended open-mouth bag travels upwardly so that the bottom end of the open-mouth bag is freely suspended; and d) the filling process is started and bulk material is introduced into the open-mouth bag so that the freely suspended bottom end of the open-mouth bag unfolds.

Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.

Abstract: Embodiments of the present invention provide computer-implemented methods, computer program products, and computer systems. Specifically, embodiments of the present invention can dynamically adjust individual message retention times in a messaging system is disclosed. Embodiments of the present invention can then receive a plurality of messages, store the plurality of messages in a storage system, determine continuously, by the messaging system, interactions with messages stored by the messaging system, and determine dynamically, by the messaging system, a retention score value for selected messages based on a sum of weighted interactions type count values of the determined interactions. Finally, embodiments of the present invention can delete by the messaging system, messages for which the retention score value is below a predetermined retention threshold value.

Abstract: A control device for an oscillating axle suspension, in particular a front axle suspension, includes at least of one hydraulic accumulator device (10), a suspension device (12) and a proportional valve (14) having a valve piston (26). The proportional valve (14) is connected to the accumulator and suspension devices (10, 12) via fluid ports (16, 18, 20, 22). The valve piston (26) is actuatable by an electric motor (28), is longitudinally guided in a valve housing (24) of the proportional valve (14) and controls the fluid ports (16, 18, 20, 22) such that, in at least one functional position of the valve piston (26), the axle oscillation is provided while the suspension is blocked and, in at least one further second functional position of the valve piston (26), the suspension is provided while the axle oscillation is blocked.

Abstract: An apparatus for connecting a field device to a communication system includes a field device interface for connecting the apparatus to the field device, a communication interface for connecting the apparatus to the communication system, a protocol conversion unit, and a switching unit. The switching unit is configured to recognize a protocol used by the field device and to establish a connection between the field device and the communication interface via the protocol conversion unit depending on the recognized protocol. Further, a method of connecting a field device to a communication system includes recognizing a protocol used by the connected field device, performing a protocol conversion depending on the recognized protocol, and establishing a connection between the connected field device and the communication system.

Abstract: A method, computer program product, and computer system for retaining messages. Bins for having messages stored for different retention periods are provided. Each message is of a message type. Messages are received and each received message is assigned to a bin. For each message determined to have an age exceeding a retention period of the message's assigned bin, the message is reassigned to a bin having a next higher retention period.

Abstract: Provided is an ad-hoc proxy for a batch processing task within a cloud environment. The proxy may reduce overhead that results from authentication between a jobs of the processing task and a third-party service. An example operation may include one or more of dividing a processing task for a target service into a plurality of jobs that each access data from the target service, establishing an authenticated communication channel between one or more proxies on a host platform and the target service, executing, via the one or more proxies, the plurality of jobs in parallel and accessing data from the target service via the authenticated communication channel established between the one or more proxies and the target service, and returning results of the execution to the plurality of jobs.

Abstract: A furnace heating device is provided for the heating a furnace chamber, comprising: at least one radiant tube, configured to heat the furnace chamber and which can be heated using a burner, which can be operated in a first operating mode with a flame and in a second operating mode with flameless combustion, a burner control device, configured to control on and off states and operating mode setting for the burner of the radiant tube, wherein said burner control device is configured to determine when a temperature (T) of the furnace chamber lies above a critical temperature (Tk), which must at least be present in a combustion chamber for safe operation of flameless combustion, wherein there is a single safety monitor for monitoring the temperature within said furnace chamber and communicating said temperature to said burner control device and wherein said burner control device is configured to send a signal to not send a signal to start said flameless combustion when it is determined that said temperature (T) o

Abstract: A method, computer program product, and computer system for retaining messages. Bins for having messages stored for different retention periods are provided. Each message is of a message type. Messages are received and each received message is assigned to a bin. For each message determined to have an age exceeding a retention period of the message's assigned bin, the message is reassigned to a bin having a next higher retention period.

Abstract: An control device for an oscillating axle suspension, in particular a front axle suspension, consisting at least of one hydraulic accumulator device (10), a suspension device (12) and a proportional valve (14) having a valve piston (26), wherein to said proportional valve (14) the two devices (10, 12) are connected via fluid ports (16, 18, 20, 22), is characterized in that the valve piston (26), actuatable by an electric motor (28), is longitudinally guided in a valve housing (24) of the proportional valve (14) and controls the fluid ports (16, 18, 20, 22) such that, in at least one functional position (1) of the valve piston (26), the axle oscillation is provided while the suspension is blocked and, in at least one further second functional position (2) of the valve piston (26), the suspension is provided while the axle oscillation is blocked.

Abstract: A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface.

Abstract: A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface.

Abstract: A mobile working machine, in particular an agricultural device such as a self-propelled sprayer, comprising a structure which is hydraulically supported with respect to an undercarriage by means of cylinders (2, 4) having a piston chamber (6) and a rod chamber (8), wherein a switching device (18, 22, 36, 38) is provided which, in a switching position, fluidically connects the piston chamber (6) of a cylinder (2, 4) to the rod chamber (8) of another cylinder (2, 4), and vice versa, characterised in that, as part of the switching device, first valves (18, 22) and second valves (36, 38) are connected on the fluid-conveying connection (12, 14) between the piston chamber (6) of the one cylinder (2, 4) and the rod chamber (8) of the other cylinder (2, 4), the first valves (18, 22) each being connected on the input side to the piston chamber (6) and to a first hydraulic accumulator (28, 30) and the second valves (36, 38) being connected on the input side to the rod chamber (8) and on the output side to a second hydr