Abstract: The invention provides LM-1 antibodies, functional fragments, modified and variant forms, nucleic acid and other compositions. The invention also provides antibodies, functional fragments, modified and variant forms that bind to LM-1 antigen (e.g., NONO/nmt55). Antibodies, functional fragments, modified and variant forms, nucleic acid and other compositions are useful in treatment and diagnostic methods. One method includes treating metastasis of a neoplasia, tumor or cancer in a subject in need of treatment by administering to the subject an amount of a LM-1 antibody, an antibody that binds to LM-1 antigen, or a functional fragment thereof, effective to treat metastasis of the neoplasia, tumor or cancer in the subject.

Abstract: The invention creates a single-track or multiple-track device and a corresponding method for conveying lumpy products in such a way that the products are separated from a product stream on each of the tracks and are subsequently conveyed further spaced apart uniformly and/or in groups. For this purpose, arrangements for supplying the products as a single-row product stream are provided in each track as well as arrangements for discharging the separated products distanced from one another in a row, wherein the products are transferred from the supplying arrangements to the discharging arrangements.

Abstract: A hermetically sealed HF front end (e.g. a transmission/reception module) in a multilayer structure that includes electronic components is provided. The multilayer structure contains a plurality of substrates stacked one above the other and carrying the components. Grooves are formed in the substrates and sealing elements are provided between the substrates, which sealing elements engage in the grooves, and the substrates are soldered together.

Abstract: The invention relates to a process for the preparation of water-absorbent polymer particles, comprising the process steps of preparing an aqueous monomer solution comprising at least partially neutralized, monoethylenically unsaturated monomers bearing carboxylic acid groups (?1) and at least one crosslinker (?3), and at least partially neutralizing acrylic acid by mixing acrylic acid with an aqueous solution of sodium hydroxide, thereby obtaining an aqueous solution of the at least partially neutralized acrylic acid; cooling the aqueous solution with a cooling liquid in a heat exchanger, wherein the cooling liquid used in the heat exchanger has been cooled in an absorption chiller in which at least a part of the heat of the heated cooling liquid obtained in the heat exchanger is consumed by the evaporation of a refrigerant liquid in a vacuum that is created by the absorption of a refrigerant vapor into an absorbent.

Abstract: The present invention discloses a drive device for a rotor of s carousel door, In addition to a main drive motor (10), which has a main-drive-motor shaft (12), the drive device according to the invention comprises a secondary drive motor (12) with a secondary-drive-motor shaft (22). The main-drive-motor shaft (12) is coupled at least indirectly to the secondary-drive-motor shaft (22, 62) in terms of rotation, and therefore the secondary-drive-motor shaft (22, 62) is coupled to the rotor in terms of movement.

Abstract: The present invention discloses a drive apparatus for a rotor of a revolving door, wherein the drive apparatus comprises a drive device, which is motion-coupled to the rotor via a drive belt. The drive apparatus further comprises a tensioning device for tensioning and deflecting the drive belt, wherein the drive belt runs via the drive device and via the tensioning device. The tensioning device and/or the drive device are mounted with a variable distance between one another, so that an extension of the drive belt caused by acceleration or deceleration of the rotor is compensated by varying the distance between the tensioning device and the drive device.

Abstract: The invention relates to a method and a device for separating sheet-shaped objects (P), for example preliminary chewing-gum products or intermediate chewing-gum products in the form of chewing-gum sheets, into strip-shaped or slab-shaped object sub-units (S), for example preliminary chewing-gum products or intermediate chewing-gum products in the form of elongated chewing-gum strips or smaller chewing-gum slabs. According to the invention, the following method steps and device features are provided: providing the sheet-shaped objects (P), wherein each sheet-shaped object (P) has at least one weakening region (R); successively separating individual strip-shaped or slab-shaped object sub-units (S) one after another from the provided sheet-shaped objects (P), wherein separating takes place on the weakening regions (R) of the sheet-shaped objects (P) by means of a conveying and separating device (10); and onward conveying of the individual, formed strip-shaped or slab-shaped object sub-units (S).

Abstract: The invention relates to a method and a device for conveying strip-shaped or plate-shaped products (P), said method and device having the following method steps and features: supply (10, 20) the products (P) out of a continuously operating device, by means of which the products are produced, to the conveying device; convey (30, 40) the products (P) with conveying means in succession in the conveying device; and transfer (60) the products (P) from the conveying device to a device, by means of which the products (P) are continuously further processed.

Abstract: The present invention discloses drive device for a rotor of s carousel door, In addition to a main drive motor (10), which has a main-drive-motor shaft (12), the drive device according to the invention comprises a secondary drive motor (12) with a secondary-drive-motor shaft (22). The main-drive-motor shaft (12) is coupled at least indirectly to the secondary-drive-motor shaft (22, 62) in terms of rotation, and therefore the secondary-drive-motor shaft (22, 62) is coupled to the rotor in terms of movement.

Abstract: A multilayer system includes first and second functional layers, for example, semiconductor layers. A third or intermediate layer is disposed between the first and second functional layers and adheres relatively well to the first and second layers yet has relatively little or no detrimental effect on the functionality of the first and second layers. The third layer is applied to the first layer. Anchoring elements are provided which are partly embedded in the third layer, and the second layer is secured to the third layer by the anchoring elements. This structure yields good adhesion between the three layers, because the third layer adheres relatively well to the first layer and the third layer and the second layer are mechanically bonded together relatively strongly by the anchoring elements.

Abstract: The present invention features a polypeptide, such as an antibody produced by the hybridoma SAM-6 and its use in the treatment and diagnosis of neoplasms.

Abstract: A press device for the energy-efficient curing of a sandwich component for an aircraft, includes an open and mechanically adequately loadable core structure with cover layers applied to one side or to both sides. The sandwich component is restrained between a pressure piston, an abutment and sidewalls of the press device, thus forming an essentially closed interior space. At least one of at least one cover layer and the core structure includes a curable duroplastic plastic material. A conveying device feeds heated air through the core structure of the sandwich component in a closed heated-air circuit or preferably in an open heated-air circuit in order to ensure energy-efficient curing of the sandwich component from the inside out. The heated air is temperature-controlled by a heater. In the case of an open heated-air circuit, heat recovery by a heat exchanger is provided.

Abstract: The invention relates to a method and a device for producing and packing individual strip-type objects, especially strips of chewing gum, comprising the following method steps and features: provision of rectangular sheets from which the strips are to be formed, the length of the shorter sides of the sheets corresponding to the length of a strip to be formed; formation of individual strips from the sheets provided; packing of the formed individual strips using a first packaging material; formation of a group of the individual packed strips; and packing of the formed group of strips using a second packaging material.

Abstract: The present invention relates to a polymerizate in the form of an aqueous polymer dispersion, the polymerizate being obtainable by radical polymerization of monomers in an aqueous medium in the presence of a free radical initiator and a protective colloid, wherein the monomers comprise a) 50-99.99 wt. % of at least one vinyl monomer chosen from the group of vinyl esters, (meth)acrylic esters, vinyl aromatic compounds, vinyl halides, and olefins, and b) 0.01-30 wt. % of at least one macromonomer M, the macromonomer M being a reaction product of components (i), (ii), and (iii), said —component (i) having at least one olefinically unsaturated group and at least one hydroxyl, amine and/or thiol group, —component (ii) being a di- or triisocyanate, and —component (iii) having at least two terminal groups selected from hydroxyl, amine and/or thiol groups, c) 0-20 wt % of at least one vinyl monomer with at least one functional group, wherein the monomers a), b), and c) sum up to 100 wt. % of total monomers employed.

Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.

Abstract: A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface.

Abstract: The invention relates to a packing method, according to which a packaging is produced, wherein a plurality of stacks (20) or layers of individual packed strip-type objects (12) are packed as a group (10) in a second packaging material (52). One of the front surfaces (16) of the individual strips (12) is stuck to the bottom (54) of the formed packaging (50). The strip packaging material and the adhesive are produced such that respectively one strip (12) can be removed from the external packaging (50). The remaining strips (12) remain arranged in the original position thereof in the packaging (50) without sliding and falling into each other, when individual strips (12) have already been removed from the packaging (50). A package band or a half-wrapper for holding and fixing the strips (12) inside the packaging (50) is rendered superfluous. The strips (12) are preferably respectively packed in a piece of packaging material that has a perforation (32) for separation into a first part and a second part.

Abstract: A fastening device is provided that includes a semiconductor body with an integrated circuit, and a dielectric passivation layer formed on the surface of the semiconductor body, and a trace formed underneath the passivation layer, and an oxide layer formed beneath the trace, and a connecting component that forms a frictional connection between a component formed above the passivation layer and the semiconductor body, wherein a formation passing through the passivation layer and the oxide layer and having a bottom surface is formed, and a conductive layer is formed on the bottom surface and the connecting component forms an electrical connection between the conductive layer and the component.

Abstract: The invention relates to a method for the production of sandwich components with an open core structure and a cover layer applied to each side, wherein the cover layers are formed with a curable plastic material, and the sandwich component is cured in a closed device under pressure. A charging gas, which may be nitrogen or air, is introduced to the core structure prior to at least partial solidification of the cover layers, wherein a charging gas pressure p Charging gas is selected that is less than or equal to an operating pressure p operating of the closed device in order to, in particular, at least largely prevent the formation of sink marks in the cover layers. Furthermore, the invention relates to a press for implementing the method.

Abstract: A heating system according to the invention comprises a heating layer that is integrated into a prepreg layer of a high-resistance prepreg material. The heating layer may comprise a bonded heating fabric, a metal oxide coating or electrically conductive threads. According to the invention, the heating system is integrated into a component to be heated. This component may consist, for example, of a floor panel for an aircraft.