Abstract: A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface.

Abstract: A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface.

Abstract: A mobile working machine, in particular an agricultural device such as a self-propelled sprayer, comprising a structure which is hydraulically supported with respect to an undercarriage by means of cylinders (2, 4) having a piston chamber (6) and a rod chamber (8), wherein a switching device (18, 22, 36, 38) is provided which, in a switching position, fluidically connects the piston chamber (6) of a cylinder (2, 4) to the rod chamber (8) of another cylinder (2, 4), and vice versa, characterised in that, as part of the switching device, first valves (18, 22) and second valves (36, 38) are connected on the fluid-conveying connection (12, 14) between the piston chamber (6) of the one cylinder (2, 4) and the rod chamber (8) of the other cylinder (2, 4), the first valves (18, 22) each being connected on the input side to the piston chamber (6) and to a first hydraulic accumulator (28, 30) and the second valves (36, 38) being connected on the input side to the rod chamber (8) and on the output side to a second hydr

Abstract: A control apparatus for supplying at least one hydraulic consumer with fluid has a variable displacement pump (10) controlled by a load-sensing pressure (LS). For a case-by-case increase in the volume flow in the supply of fluid (22) to the hydraulic consumer, the load-sensing pressure (LS) is passed via a control line (28) to a control circuit (2) that ensures the increase in the supply (22) by connecting in a constant-displacement pump (16) as soon as an operator calls for the relevant function by operating the control circuit (2).

Abstract: The present invention relates to an asphalt composition comprising asphalt or an asphalt mixture and to a silicon carbide-containing binder that can be heated by means of microwaves. The silicon carbide is present in the binder in particle form, the equivalent diameter of silicon carbide particles contained in the binder is less than 60 ?m. The invention also relates to a method for producing and/or renovating road surfaces or asphalt surfaces comprising at least one asphalt surface layer.

Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.

Abstract: Apparatus and method for filling bulk materials into open-mouth bags, including the following steps: a) an open-mouth bag is appended from beneath to a filling spout of a filling station by way of an at least partially upwardly motion, so that the bottom end of the open-mouth bag is freely suspended; b) the filling process is started and bulk material is introduced into the open-mouth bag so that the freely suspended bottom end of the open-mouth bag unfolds; and c) the filling spout is lowered, so that the unfolded bottom end of the open-mouth bag is supported.

Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.

Abstract: A recuperative gas burner for industrial applications can include a combustion chamber and a burner tip providing an outlet opening of the combustion chamber. The gas burner includes a gas supply for combustion gas having a first gas supply duct and a second gas supply duct. The combustion gas can be provided to the combustion chamber through the first gas supply duct. The combustion gas can also be provided to the burner tip through the second gas supply duct. The gas burner can include an air supply for combustion air and an exhaust gas flow channel for exhaust gas, wherein the exhaust gas flow channel and the air supply are configured such that combustion air can be heated by the exhaust gas.

Abstract: A decoupling sheet (1) having a carrier plate (2) and a plurality of nubs (4) protruding from the carrier plate plane (3), wherein adjacent nubs (4) are arranged transversely to the lengthwise direction (5) and in the lengthwise direction (5) of the carrier plate (2). It is provided according to the invention that immediately adjacent nubs (4) transversely to the lengthwise direction (5) and in the lengthwise direction (5) of the carrier plate (2) have a nub base (10) of triaxial shape, especially with at least three leg sides (6b).

Abstract: A decoupling sheet (1) having a carrier plate (2) and a plurality of nubs (4) protruding from the carrier plate plane (3), wherein adjacent nubs (4) are arranged transversely to the lengthwise direction (5) and in the lengthwise direction (5) of the carrier plate (2). It is provided according to the invention that immediately adjacent nubs (4) transversely to the lengthwise direction (5) and in the lengthwise direction (5) of the carrier plate (2) have a nub base (10) of triaxial shape, especially with at least three leg sides (6b).

Abstract: An agricultural machine for discharging liquid includes a boom, a frame to which the boom is fixed such that the boom can be rotated about an axis of rotation pointing in the direction of travel, an actuating cylinder for rotating the boom about the axis of rotation, and a measurement and control system for the actuation of the actuating cylinder, wherein the actuating cylinder is mechanically connected to the frame on one side. The actuating cylinder is mechanically connected to the boom on the other side for the direct introduction of force. The actuating cylinder is formed as a double-acting actuating cylinder having a piston, to which pressure can be applied on both sides in order to move the boom in opposite directions of rotation.

Abstract: A plastics material component for an aircraft includes (i) a substrate, which comprises one or more thermosetting plastics materials, and (ii) one or more layers which are applied to the substrate, at least one layer S1 comprising mica. A method for producing the plastics material component includes providing a substrate including at least one thermosetting plastics material or one polymer which is crosslinked to form a thermosetting plastics material, and applying one or more layers to the substrate, wherein at least one layer includes mica. The mica-containing layer is applied directly to the substrate and the application is carried out before and/or during the curing of the thermosetting plastics material.

Abstract: The invention relates to a decoupling sheet (1) having a carrier plate (2) and a plurality of nubs (4) protruding from the carrier plate plane (3). According to the invention, a plurality of protrusions (21a) and/or recesses (21b) is provided on the side of the nub base (10) of at least one nub (4) facing toward the nub interior space (20) and/or a plurality of protrusions (21c) and/or recesses (21d) is provided on the side of the carrier plate (2) facing toward the nub interior space (20), especially wherein the protrusion (21a) and/or the recess (21b) on the nub base (10) and/or the protrusion (21c) and/or the recess (21d) on the carrier plate (2) has a height and/or a depth greater than 1 ?m, preferably greater than 100 ?m, further preferably between 100 and 1000 ?m and especially at least substantially between 300 and 500 ?m.

Abstract: The invention relates to a control apparatus for supplying at least one hydraulic consumer with fluid having a variable displacement pump (10) which may be controlled by means of a loadsensing pressure (LS), characterized in that, for a case-by-case increase in the volume flow in the supply (22) to the hydraulic consumer, the loadsensing pressure (LS) is passed via a control line (28) to a control device (2) which ensures the increase in the supply (22) by connecting in a constant-displacement pump (16) as soon as an operator calls for the relevant function by operating the control device (2).

Abstract: A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface.

Abstract: An apparatus and method for filling bulk materials into open-mouth bags is provided, which includes the following steps: a) an open-mouth bag is placed beneath a filling spout of a filling station; b) the filling spout is lowered and the open-mouth bag is appended to the filling spout; c) the filling spout with the appended open-mouth bag travels upwardly so that the bottom end of the open-mouth bag is freely suspended; and d) the filling process is started and bulk material is introduced into the open-mouth bag so that the freely suspended bottom end of the open-mouth bag unfolds.

Abstract: A suspension device, in particular for axle suspensions in tractors, having at least one suspension cylinder, the piston rod unit (12) of which separates a piston side (18) from an annular side (14) in a cylinder housing (20), is characterized in that a pressure relief valve (26) is used to limit a maximum pressure at the annular side (14) of the relevant suspension cylinder.