Abstract: A hard disk drive slider has an air bearing surface that uses the ambient air in the disk drive as a heat source for thermal-assisted recording. Incoming air between the slider and the disk surface is pressurized to produce heat sufficient to heat the recording media. A very small thermal pad is located at the trailing end of the air bearing surface and wraps around the magnetic recording head. The thermal pad includes small pockets to contain the heated air to provide heat to the recording media. The air can be pressurized to approximately 80 atm, which is sufficient to raise the air temperature to approximately 800 degrees C. at isentropic conditions. The heated air transfers the heat energy to the recording media by conduction to elevate a disk recording layer temperature for thermomagnetic recording.

Abstract: A method for patterning a recording medium selectively thermally couples a recording medium and a heat source to alter a chemical composition of the recording medium. An apparatus for patterning a recording medium has a heat source for generating and directing an incident thermal wave to a recording medium so as to alter a chemical composition of the recording medium, and a controller for coordinating a mutual position of the incident thermal wave and the recording medium for inducing a direct thermal coupling between the recording medium and the heat source.

Abstract: A method for patterning a recording medium selectively thermally couples a recording medium and a heat source to alter a chemical composition of the recording medium. An apparatus for patterning a recording medium has a heat source for generating and directing an incident thermal wave to a recording medium so as to alter a chemical composition of the recording medium, and a controller for coordinating a mutual position of the incident thermal wave and the recording medium for inducing a direct thermal coupling between the recording medium and the heat source.

Abstract: An assembly and method for recording and/or reading high-density data includes a phase change media, an antenna placed adjacent the phase change media, and a source of electromagnetic radiation.

Abstract: A thermally-assisted magnetic recording (TAMR) write head simultaneously generates heat and a magnetic write field to the recording layer on a magnetic recording disk. The write head is located on the trailing face of a head carrier in a TAMR disk drive and comprises a single turn coil, part of which is a current strip having an edge located at the disk-facing surface of the head carrier. When write current is passed through the current strip heat is generated at the edge of the strip and a magnetic write field is induced at the disk surface. The strip edge has a predetermined width that substantially corresponds to the desired track width of the data bits. Because both heat and the magnetic write field are generated by the same element, the heat gradient and the magnetic write field gradient are co-located on the spot where the data bit is written.

Abstract: An article of manufacture including an organic structure and inorganic atoms bonded to specific locations on the organic structure.

Abstract: A method for patterning a recording medium selectively thermally couples a recording medium and a heat source to alter a chemical composition of the recording medium. An apparatus for patterning a recording medium has a heat source for generating and directing an incident thermal wave to a recording medium so as to alter a chemical composition of the recording medium, and a controller for coordinating a mutual position of the incident thermal wave and the recording medium for inducing a direct thermal coupling between the recording medium and the heat source.

Abstract: A device and method for providing precision alignment and support for an optical film measurement probe in the wafer rinse tank of a CMP polish tool. The device includes of a probe carrier, and spring loaded support guides attached to a support ring that supports and locates the mechanism in the rinse tank of the CMP tool. The probe carrier has multiple beveled bearing pads (three or more) that contact the rim of the rotating wafer chuck. Pressure from the chuck against these pads forces the probe carrier to maintain a fixed distance and orientation relative to the wafer while allowing the smooth rotation and motion of the wafer and chuck. Further, an integrated the wafer spray nozzles can be attached to the probe carrier that is located so as to minimize interference between wafer spraying and the probe carrier.

Abstract: A memory device including at least one pair of spaced apart conductors and a ferroelectric material between the pair of conductors. The pair of conductors is spaced apart a distance sufficient to permit a tunneling current therebetween.

Abstract: A thermally-assisted magnetic recording (TAMR) write head simultaneously generates heat and a magnetic write field to the recording layer on a magnetic recording disk. The write head is located on the trailing face of a head carrier in a TAMR disk drive and comprises a single turn coil, part of which is a current strip having an edge located at the disk-facing surface of the head carrier. When write current is passed through the current strip heat is generated at the edge of the strip and a magnetic write field is induced at the disk surface. The strip edge has a predetermined width that substantially corresponds to the desired track width of the data bits. Because both heat and the magnetic write field are generated by the same element, the heat gradient and the magnetic write field gradient are co-located on the spot where the data bit is written.

Abstract: A device and method for providing precision alignment and support for an optical film measurement probe in the wafer rinse tank of a CMP polish tool. The device includes of a probe carrier, and spring loaded support guides attached to a support ring that supports and locates the mechanism in the rinse tank of the CMP tool. The probe carrier has multiple beveled bearing pads (three or more) that contact the rim of the rotating wafer chuck. Pressure from the chuck against these pads forces the probe carrier to maintain a fixed distance and orientation relative to the wafer while allowing the smooth rotation and motion of the wafer and chuck. Further, an integrated the wafer spray nozzles can be attached to the probe carrier that is located so as to minimize interference between wafer spraying and the probe carrier.

Abstract: An article of manufacture including an organic structure and inorganic atoms bonded to specific locations on the organic structure.

Abstract: A memory device including at least one pair of spaced apart conductors and a ferroelectric material between the pair of conductors. The pair of conductors is spaced apart a distance sufficient to permit a tunneling current therebetween.

Abstract: A structure including a substrate. A first electrode and a second electrode are arranged spaced apart from each other on the substrate. A polymer string is positioned on the substrate between the two electrodes, the polymer line has a width of less than about 50 nm.

Abstract: A structure including a substrate. A first electrode and a second electrode are arranged spaced apart from each other on the substrate. A polymer string is positioned on the substrate between the two electrodes, the polymer line has a width of less than about 50 nm.

Abstract: A structure and method for polishing a device include oscillating a carrier over an abrasive surface (the carrier bringing a polished surface of the device into contact with the abrasive surface, the oscillating allowing a portion of the polished surface to periodically oscillate off the abrasive surface), optically determining a reflective measure of a plurality of locations of the polished surface as the portion of the device oscillates off the abrasive surface and calculating depths of the locations of the polished surface based of the reflective measure.

Abstract: A system and method that integrates film thickness measurements with a chemical-mechanical polishing (CMP) spin-dry tool. By doing so, each wafer can be measured as it comes out of the previous CMP process. Thickness measurement feedback is provided, which controls processing of the wafer and also monitor operational status of a CMP polishing unit prior to completion of the wafer being polished, resulting in significant cost and cycle time reduction through the elimination of tool infrastructure and wafer handling by assuring proper tolerances of the CMP polishing unit are maintained.

Abstract: A structure including a substrate. A first electrode and a second electrode are arranged spaced apart from each other on the substrate. A polymer string is positioned on the substrate between the two electrodes, the polymer line has a width of less than about 50 nm.

Abstract: An assembly suitable for identifying a code sequence of a biomolecule. The assembly includes means comprising a near-field probe for generating a super-resolution chemical analysis of the portion of a biomolecule; and means for correlating the super-resolution chemical analysis of the portion of the biomolecule with a broad spectral content of a referent biomolecule, for generating a code sequencing of the portion of the biomolecule.

Abstract: A method for deriving physical properties of a workpiece. The method comprises the steps of sampling an electromagnetic wave packet representative of workpiece properties and comprising encoded scattered wave information derivable from a multi-pole interactive coupling between a probe tip and the workpiece; decoding said electromagnetic wave packet by interrogating at least one of its phase and amplitude information; and, correlating this information to referent physical-chemical properties of the workpiece.