Abstract: An integrated power supply air inlet unit (124) coupled to slidably insert into a first interspace region (120) of an embedded computer chassis (100), where the first interspace region is defined by a module portion (102), a rear surface (110) and a first side surface (112), includes a power supply (128) coupled to supply power to the embedded computer chassis, and a front surface (130) that is substantially perpendicular to the first side surface. A cooling air mass (140) is drawn into the embedded computer chassis through the front surface in a direction substantially perpendicular (150) to the front surface, where upon entering the integrated power supply air inlet unit the cooling air mass is turned substantially ninety degrees to flow over the module portion in a direction substantially parallel the front surface, and where the integrated power supply air inlet unit is hot-swappable in the embedded computer chassis.

Abstract: A method of directly transferring data across a CompactPCI™ backplane (170) via a fully meshed orthogonal network (370). The CompactPCI backplane (170) incorporates a different type connector at its P4 location, in conjunction with a standard family of IEC 61074 connectors at its P1, P2, P3, and P5 locations, to provide high speed data transfer with additional shielding and noise control.

Abstract: A method of cooling a module portion (202) of an embedded computer chassis (200), where the module portion comprises a front module (206) coupled to a front portion of a backplane (204), and a rear module (208) coupled to a rear portion of the backplane, where the front module and the rear module are horizontally disposed, the method includes drawing a cooling air mass (240) into the embedded computer chassis through a front surface (230) of a first interspace region (220) and an upper front surface (231) of a second interspace region (221) in a direction substantially perpendicular (250) to the front surface and the upper front surface. A third interspace region (222) receives a first portion of the cooling air mass (241), the cooling air mass exhausting from the embedded computer chassis through a rear surface (210) in a direction substantially perpendicular (256) to the rear surface.

Abstract: An integrated power supply air inlet unit (124) coupled to slidably insert into a first interspace region (120) of an embedded computer chassis (100), where the first interspace region is defined by a module portion (102), a rear surface (110) and a first side surface (112), includes a power supply (128) coupled to supply power to the embedded computer chassis, and a front surface (130) that is substantially perpendicular to the first side surface. A cooling air mass (140) is drawn into the embedded computer chassis through the front surface in a direction substantially perpendicular (150) to the front surface, where upon entering the integrated power supply air inlet unit the cooling air mass is turned substantially ninety degrees to flow over the module portion in a direction substantially parallel the front surface, and where the integrated power supply air inlet unit is hot-swappable in the embedded computer chassis.

Abstract: A method of cooling a module portion (202) of an embedded computer chassis (200), where the module portion comprises a front module (206) coupled to a front portion of a backplane (204), and a rear module (208) coupled to a rear portion of the backplane, where the front module and the rear module are horizontally disposed, the method includes drawing a cooling air mass (240) into the embedded computer chassis through a front surface (230) of a first interspace region (220) and an upper front surface (231) of a second interspace region (221) in a direction substantially perpendicular (250) to the front surface and the upper front surface. A third interspace region (222) receives a first portion of the cooling air mass (241), the cooling air mass exhausting from the embedded computer chassis through a rear surface (210) in a direction substantially perpendicular (256) to the rear surface.

Abstract: A rear transition module (220) includes a connector (230) in an RP0 mechanical envelope (242), and an RTM alignment and keying mechanism (232) in the RP0 mechanical envelope of the rear transition module that uniquely corresponds to a first signal path configuration (363) in a corresponding connector (234) on a backplane (202) of a VXS multi-service platform system chassis (103), where the rear transition module is coupled to operate within the VXS multi-service platform system chassis having a VMEbus network (108) and a switched fabric (110) coincident on the backplane.

Abstract: A latching apparatus (208, 408) for mounting a computer module (202, 402) in a holding fixture (103) is disclosed, where the computer module comprises a baseboard (204, 404) and a faceplate (206, 406). The latching apparatus includes a handle (210, 410) rotatably coupled to the baseboard, where the handle has an outer portion (214, 414) and an inner portion (216, 416), where the outer portion includes a locking pin (218, 418) substantially parallel to the faceplate, and where the handle is movable between a latched position (220, 420) and an unlatched position (221, 421). A retention spring mechanism (222, 422) having a latching portion (224, 424) and a positional portion (226, 426), where the latching portion springably retains the handle in the latched position by engaging the locking pin, and where the positional portion frictionally interfaces with the inner portion of the handle to engage the handle in any of a plurality of positions.

Abstract: A board module (401) can include a board module surface (420) and a connector (403) coupled to the board module surface, wherein the connector is coupled to provide at least one signal (112, 114) to the board module. The connector can include a connector lead surface (419) substantially perpendicular to the board module surface (420); a first row of leads (430) substantially parallel to and a first distance (451) from the board module surface extending substantially perpendicular from the connector lead surface (419) and shaped to connect substantially perpendicular to the board module surface at a second distance (452) from the connector lead surface; and a second row of leads (440) substantially parallel to and a third distance (453) from the board module surface extending substantially perpendicular from the connector lead surface (419) and shaped to connect substantially perpendicular to the board module surface (420) at a fourth distance (454) from the connector lead surface.

Abstract: A new game incorporating Mah Jongg playing tiles or cards for use in a casino or other wagering or playing location is provided. This game preferably gives every participating player the opportunity to win for every hand dealt. Players may compete against a dealer or “the house,” or may simply wager against the probability of obtaining certain hands. Games may be played for money or other stakes. Winning hands are preferably determined by obtaining certain designated combinations of playing units, and comparing these combinations against the hand of the dealer, or by determining whether the player's hand contains a predetermined group of winning combinations which provide winnings based on the probability in obtaining such combinations.

Abstract: Methods and apparatus are presented which converts a DC voltage into both a regulated boost voltage and a regulated inverter by means of switch-capacitors with feedback. Methods and apparatus may be fabricated as an integrated circuit, and/or may be fabricated with one and/or multiple communication line transceivers on a single silicon substrate.

Abstract: In a continuous burst memory read operation, a dynamic prefetch circuit compares a prefetched address with a received address. If the compared addresses are identical, the prefetched address is applied to the memory; else the prefetched address is preempted by the received address, the received address is coupled to the memory, and output data corresponding to the prefetched address is interrupted.

Abstract: An auto power saving device for multi-channel transceiver comprises at least one tier and five levels, in which the five levels comprises an input level for each tier having at least one input and producing a time delayed binary signal, a NAND gate level having one NAND gate for each tier, each NAND gate receiving a signal from its respective input and from the output of an upper neighboring NAND gate if such NAND gate exists and from the output of a lower neighboring NAND gate if such NAND gate exists, an inverter level comprising one inverter per tier receiving and inverting said signal from its respective NAND gate, and a NOR gate level comprising one NOR gate that receives all inputs from all inverters on all tiers, and an Output Level producing an output signal.

Abstract: A latching apparatus (208, 408) for mounting a computer module (202, 402) in a holding fixture (103) is disclosed, where the computer module comprises a baseboard (204, 404) and a faceplate (206, 406). The latching apparatus includes a handle (210, 410) rotatably coupled to the baseboard, where the handle has an outer portion (214, 414) and an inner portion (216, 416), where the outer portion includes a locking pin (218, 418) substantially parallel to the faceplate, and where the handle is movable between a latched position (220, 420) and an unlatched position (221, 421). A retention spring mechanism (222, 422) having a latching portion (224, 424) and a positional portion (226, 426), where the latching portion springably retains the handle in the latched position by engaging the locking pin, and where the positional portion frictionally interfaces with the inner portion of the handle to engage the handle in any of a plurality of positions.

Abstract: A method of directly transferring data across a CompactPCI™ backplane (170) via a fully meshed orthogonal network (370). The CompactPCI backplane (170) incorporates a different type connector at its P4 location, in conjunction with a standard family of IEC 61074 connectors at its P1, P2, P3, and P5 locations, to provide high speed data transfer with additional shielding and noise control.

Abstract: A VME multi-service platform system (100) includes a payload module (106) coupled to operate within a VME multi-service platform system chassis (202) having a VMEbus network (102) and a switched fabric network (104) that operate concurrently and includes the payload module having a first switched fabric connector (210) in a P0 mechanical envelope (218) and a payload module keying mechanism (222) in the P0 mechanical envelope of the payload module that uniquely corresponds to a first switched fabric network standard.

Abstract: A cabinet (100) for cooling electronic modules includes a first side surface (102), a second side surface (104), a front surface (106) and a rear surface (707). A plurality of chassis (108) is encompassed by the plurality of outer surfaces, wherein the plurality of chassis (108) and the first side surface (102) define a first interspace region (110), and wherein the plurality of chassis (108) and the second side surface (104) define a second interspace region (112). A plurality of electronic modules (114) is coupled to each of the plurality of chassis (108), where the plurality of electronic modules (114) are substantially horizontally disposed within each of the plurality of chassis (108), and wherein at least a portion of the plurality of electronic modules produce more than 150 Watts of thermal energy each.

Abstract: A method of directly transferring data across a CompactPCI™ backplane (170) via a fully meshed orthogonal network (370). The CompactPCI backplane (170) incorporates a different type connector at its P4 location, in conjunction with a standard family of IEC 61074 connectors at its P1, P2, P3, and P5 locations, to provide high speed data transfer with additional shielding and noise control.

Abstract: A wellhead isolation tool for use with a wellhead assembly from which a tubing string is suspended comprises a tubular mandrel which includes an axial passage that extends therethrough and lower end that is adapted to engage the tubing string, a pumping head which is connected over the wellhead assembly and which includes an internal chamber that is in fluid communication with the axial passage and a port that extends through the pumping head to the chamber, and an actuator which is connected over the pumping head for moving the mandrel axially through the pumping head and into engagement with the tubing string. When the mandrel is engaged with the tubing string, fluid may be communicated through the port, the chamber and the mandrel and into the tubing string.

Abstract: An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102) and a heat conductor (112) having a first portion (115) coupled to component (102) and a second portion (117) coupled to heat removal device (108).

Abstract: An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102) and a heat conductor (112) having a first portion (115) coupled to component (102) and a second portion (117) coupled to heat removal device (108).