Patents by Inventor Heung Kil PARK
Heung Kil PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11776753Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body and a plurality of external electrodes spaced apart from each other on a mounting surface of the capacitor body, and a connection terminal including a plurality of land portions disposed on the plurality of external electrodes, respectively. When a thickness of the multilayer capacitor is defined as T1 and a distance from an uppermost end of the plurality of external electrodes to a bottom of the connection terminal is defined as T2, T1/T2 is 0.6 to 0.9.Type: GrantFiled: September 28, 2022Date of Patent: October 3, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Woo Chul Shin, Ji Hong Jo
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Patent number: 11769633Abstract: An electronic component includes a board having first and second electrode pads on one surface of the board; and a multilayer capacitor. The multilayer capacitor comprises: a capacitor body comprising a dielectric layer and a plurality of internal electrodes, disposed horizontally with respect to a mounting surface of the capacitor body facing the one surface of the board, and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. The electronic component satisfies Lp/Lc?1.35, where a distance between outer edges of the first and second electrode pads is defined as Lp, and a length of the multilayer capacitor is defined as Lc.Type: GrantFiled: June 16, 2021Date of Patent: September 26, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Gu Won Ji, Heung Kil Park, Sang Soo Park, Young Ghyu Ahn
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Patent number: 11749462Abstract: A multilayer ceramic electronic component includes a multilayer capacitor including a capacitor body, and first and second external electrodes disposed on both side surfaces of the capacitor body, respectively; first and second metal frames disposed on both side surfaces and upper and lower surfaces of the multilayer capacitor; and an exterior insulating portion disposed to surround upper surfaces of the multilayer capacitor and the first and second metal frames. A shortest distance from an upper end of the exterior insulating portion to the external electrodes is defined as G1, a shortest distance from a lower end of the exterior insulating portion to the external electrodes is defined as G2, a maximum distance from upper ends of the external electrodes to lower ends is defined as T, and G1, G2, and T satisfy G1?G2?T/2.Type: GrantFiled: November 30, 2021Date of Patent: September 5, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Gu Won Ji, Sang Soo Park
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Patent number: 11665825Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal electrodes; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2?SA1/BW1?0.5 and 0.2?SA2/BW2?0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.Type: GrantFiled: October 4, 2021Date of Patent: May 30, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Woo Chui Shin, Ji Hong Jo
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Patent number: 11640877Abstract: An electronic component includes: a multilayer capacitor including a capacitor body and first and second external electrodes respectively disposed on opposing end surfaces of the capacitor body; and an ESD member disposed on a first side surface of the multilayer capacitor perpendicular to a mounting surface of the multilayer capacitor, such that the ESD of the multilayer capacitor may be effectively controlled.Type: GrantFiled: May 4, 2021Date of Patent: May 2, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Gu Won Ji, Sang Soo Park
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Publication number: 20230053343Abstract: A device for detecting whether a plurality of electronic components having one or more defective electronic components includes: an energy source generating energy and transferring the generated energy to the plurality of electronic components in a non-contact manner to cause the plurality of electronic components to vibrate; a mechanical resonance detector detecting vibration resonances of the plurality of electronic components; and a post-processing processor comparing the detected vibration resonances of the plurality of electronic components with a reference vibration resonance of a normal product to determine whether the plurality of electronic components have one or more defective electronic components and then extracting determined information.Type: ApplicationFiled: August 12, 2022Publication date: February 23, 2023Applicants: SAMSUNG ELECTRO-MECHANICS CO., LTD., UIF (University Industry Foundation), Yonsei UniversityInventors: Heung Kil PARK, Seong Hoon KIM, Won Suk OHM, Seong Hun IM
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Patent number: 11581147Abstract: An electronic component includes: an ESD discharge member including a substrate having first and second surfaces opposing each other, first and second through-holes penetrating through the substrate, and first and second conductors; and a multilayer capacitor disposed on the first surface of the substrate, in which the multilayer capacitor may include: a capacitor body; and first and second external electrodes disposed outside the capacitor body and connected to the first and second conductors, respectively, and the first and second conductors may include first and second via electrodes coated on inner walls of the first and second through-holes, respectively.Type: GrantFiled: April 14, 2021Date of Patent: February 14, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Gu Won Ji, Sang Soo Park
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Publication number: 20230013554Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body and a plurality of external electrodes spaced apart from each other on a mounting surface of the capacitor body, and a connection terminal including a plurality of land portions disposed on the plurality of external electrodes, respectively. When a thickness of the multilayer capacitor is defined as T1 and a distance from an uppermost end of the plurality of external electrodes to a bottom of the connection terminal is defined as T2, T1/T2 is 0.6 to 0.9.Type: ApplicationFiled: September 28, 2022Publication date: January 19, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil PARK, Se Hun PARK, Hun Gyu PARK, Woo Chul SHIN, Ji Hong JO
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Patent number: 11488778Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body and a plurality of external electrodes spaced apart from each other on a mounting surface of the capacitor body, and a connection terminal including a plurality of land portions disposed on the plurality of external electrodes, respectively. When a thickness of the multilayer capacitor is defined as T1 and a distance from an uppermost end of the plurality of external electrodes to a bottom of the connection terminal is defined as T2, T1/T2 is 0.6 to 0.9.Type: GrantFiled: January 30, 2020Date of Patent: November 1, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Woo Chul Shin, Ji Hong Jo
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Publication number: 20220216010Abstract: A multilayer ceramic electronic component includes a multilayer capacitor including a capacitor body, and first and second external electrodes disposed on both side surfaces of the capacitor body, respectively; first and second metal frames disposed on both side surfaces and upper and lower surfaces of the multilayer capacitor; and an exterior insulating portion disposed to surround upper surfaces of the multilayer capacitor and the first and second metal frames. A shortest distance from an upper end of the exterior insulating portion to the external electrodes is defined as G1, a shortest distance from a lower end of the exterior insulating portion to the external electrodes is defined as G2, a maximum distance from upper ends of the external electrodes to lower ends is defined as T, and G1, G2, and T satisfy G1?G2?T/2.Type: ApplicationFiled: November 30, 2021Publication date: July 7, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Gu Won Ji, Sang Soo Park
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Publication number: 20220189697Abstract: An electronic component includes: an ESD discharge member including a substrate having first and second surfaces opposing each other, first and second through-holes penetrating through the substrate, and first and second conductors; and a multilayer capacitor disposed on the first surface of the substrate, in which the multilayer capacitor may include: a capacitor body; and first and second external electrodes disposed outside the capacitor body and connected to the first and second conductors, respectively, and the first and second conductors may include first and second via electrodes coated on inner walls of the first and second through-holes, respectively.Type: ApplicationFiled: April 14, 2021Publication date: June 16, 2022Inventors: Heung Kil Park, Gu Won Ji, Sang Soo Park
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Publication number: 20220130613Abstract: An electronic component includes: a multilayer capacitor including a capacitor body and first and second external electrodes respectively disposed on opposing end surfaces of the capacitor body; and an ESD member disposed on a first side surface of the multilayer capacitor perpendicular to a mounting surface of the multilayer capacitor, such that the ESD of the multilayer capacitor may be effectively controlled.Type: ApplicationFiled: May 4, 2021Publication date: April 28, 2022Inventors: Heung Kil Park, Gu Won Ji, Sang Soo Park
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Patent number: 11309133Abstract: The multilayer electronic component includes a capacitor body having first to sixth surfaces; first and second external electrodes including first and second connecting portions, and first and second band portions; first and second connection terminals connected to the first band portion; and third and fourth connection terminals connected to the second band portion. The first and second connection terminals include a first connection surface facing the first band portion, a second connection surface opposing the first connection surface, and a first circumferential surface connecting the first and second connection surfaces, a cross section of the first circumferential surface being circular.Type: GrantFiled: April 28, 2020Date of Patent: April 19, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Hun Gyu Park, Se Hun Park, Gu Won Ji
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Publication number: 20220102056Abstract: A coil component includes a body; a coil disposed in the body; first and second external electrodes disposed on a first surface of the body, which is a lower surface of the body, spaced apart from each other, and connected to the coil; and first and second terminals disposed on lower surfaces of the first and second external electrodes, respectively, to be in contact with the first and second external electrodes.Type: ApplicationFiled: December 11, 2020Publication date: March 31, 2022Inventors: Heung Kil Park, Gu Won Ji, Sang Soo Park
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Patent number: 11276532Abstract: An electronic component includes a capacitor array in which a plurality of multilayer capacitors are disposed in a row in a first direction connecting fifth and sixth surfaces, each of the plurality of multilayer capacitors including a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes, and first and second external electrodes respectively including first and second connection portions and first and second band portions, respectively; a first bump terminal connected to the first band portions of the plurality of first external electrodes on a first surface of the capacitor array; and a second bump terminal spaced apart from the first bump terminal and connected to the second band portions of the plurality of second external electrodes on the first surface of the capacitor array.Type: GrantFiled: September 6, 2019Date of Patent: March 15, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Heung Kil Park
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Publication number: 20220030719Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2?SA1/BW1?0.5 and 0.2?SA2/BW2?0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.Type: ApplicationFiled: October 4, 2021Publication date: January 27, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Woo Chul Shin, Ji Hong Jo
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Patent number: 11166376Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2?SA1/BW1?0.5 and 0.2?SA2/BW2?0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.Type: GrantFiled: April 13, 2020Date of Patent: November 2, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Woo Chul Shin, Ji Hong Jo
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Publication number: 20210313115Abstract: An electronic component includes a board having first and second electrode pads on one surface of the board; and a multilayer capacitor. The multilayer capacitor comprises: a capacitor body comprising a dielectric layer and a plurality of internal electrodes, disposed horizontally with respect to a mounting surface of the capacitor body facing the one surface of the board, and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. The electronic component satisfies Lp/Lc?1.35, where a distance between outer edges of the first and second electrode pads is defined as Lp, and a length of the multilayer capacitor is defined as Lc.Type: ApplicationFiled: June 16, 2021Publication date: October 7, 2021Inventors: Gu Won JI, Heung Kil PARK, Sang Soo PARK, Young Ghyu AHN
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Patent number: 11139113Abstract: An electronic component includes: a capacitor body; first and second external electrodes disposed on both ends of the capacitor body in a length direction; and first and second connection terminals disposed on a mounting surface of the capacitor body and electrically connected to the first and second external electrodes, respectively, and having first and second cut portions on surfaces facing each other in the length direction of the capacitor body, respectively.Type: GrantFiled: November 16, 2018Date of Patent: October 5, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Gu Won Ji, Se Hun Park, Young Ghyu Ahn
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Patent number: 11133132Abstract: A multilayer electronic component includes a capacitor body having first to six surfaces, the capacitor body including a dielectric layer and first and second internal electrodes having one ends exposed through the third and fourth sides, respectively, first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces of the capacitor body, respectively, and first and second band portions spaced apart from each other on the first surface of the capacitor body, respectively, a first connection terminal disposed on the first band portion and having a first cutout disposed in a lower surface thereof, open toward the third surface of the capacitor body, and a second connection terminal disposed on the second band portion and having a second cutout formed in a lower surface thereof, open toward the fourth surface of the capacitor body.Type: GrantFiled: April 21, 2020Date of Patent: September 28, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Tae Hoon Kim, Gu Won Ji