Abstract: A multilayer electronic component includes a capacitor body, a plurality of external electrodes disposed on a mounting surface of the capacitor body to be spaced apart from each other, and a connection terminal including land portions formed of insulators. The land portions have conductor layers formed on surfaces thereof, and are disposed on respective external electrodes. A bridge portion is disposed between land portions adjacent to each other. Cut portions are formed in the land portions. The multilayer electronic component can optionally be mounted on a circuit board having a plurality of electrode pads such that each land portion is mounted to a respective electrode pad of the circuit board.

Abstract: A multi-layer ceramic capacitor assembly includes a multi-layer ceramic capacitor comprising a laminate, the laminate having dielectric layers and internal electrodes laminated alternately therein, and external electrodes being electrically connected with the internal electrodes and disposed at end portions of the laminate; and an electrode-forming substrate coupled to the multi-layer ceramic capacitor and having through-holes disposed to correspond to the external electrodes.

Abstract: A composite electronic component includes: a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body, and first and second external electrodes disposed on both end portions of the first ceramic body. The ceramic chip includes a second ceramic body disposed on a lower portion of the multilayer ceramic capacitor, and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes. A width of first regions of the second ceramic body in which the first and second terminal electrodes are disposed is wider than a width of a second region of the second ceramic body between the first regions.

Abstract: An electronic component includes an inductor including an inductor body and first and second external electrodes, the first and second external electrodes including first and second body portions and first and second band portions extended from the first and second body portions to portions of an upper surface of the inductor body in a thickness direction, respectively; and first and second metal frames including first and second upper horizontal portions bonded to the first and second band portions, respectively, first and second lower horizontal portions disposed below the inductor body to be spaced apart from each other, and first and second vertical portions connecting end portions of the first and second upper horizontal portions and end portions of the first and second lower horizontal portions to each other and disposed to be spaced apart from the first and second body portions, respectively.

Abstract: A capacitor includes a body including a dielectric layer, first internal electrodes and second internal electrodes. Each of the first internal electrodes and each of the second internal electrodes are alternately disposed with the dielectric layer interposed therebetween. A first connection electrode is disposed on a first end surface of the body to connect an end of the first internal electrodes. A second connection electrode is disposed on a second end surface of the body opposite to the first end surface to connect an end of the second internal electrodes. A first insulating layer is disposed on one surface of the body. A first terminal electrode and a second terminal electrode are respectively disposed on opposing end surfaces of the first insulating layer to connect the first connection electrode and the second connection electrode, respectively. A second insulating layer is disposed on another surface of the body.

Abstract: A multilayer electronic component includes a capacitor body, first and second external electrodes, first and second land portions, and first and second insulating portions. The first and second external electrodes are disposed and spaced apart from each other on a mounting surface of the capacitor body. The first and second land portions include a conductive material and are disposed on the first and second external electrodes, respectively. The first and second insulating portions are disposed between the first and second land portions on the mounting surface of the capacitor body to be spaced apart from each other and each have one end connected to a respective one of the first and second land portions. A board having a multilayer electronic component includes a circuit board having first and second electrode pads disposed on one surface thereof, and the multilayer electronic component mounted thereon.

Abstract: A capacitor component includes a body including a plurality of dielectric layers having a stacked structure and a plurality of first internal electrodes and a plurality of second internal electrodes alternately disposed with dielectric layers disposed therebetween. A first external electrode is on a first surface and a second surface of the body, on the opposing side of the body, and connected to the plurality of first internal electrodes. A second external electrode is on a third surface and a fourth surface of the body, opposing each other, and connected to one or more of the plurality of second internal electrodes.

Abstract: A multilayer ceramic electronic component includes a multilayer ceramic capacitor, first and second metal frames, and an insulating cover. The multilayer ceramic capacitor includes a ceramic body having a plurality of dielectric layers stacked together and first and second internal electrodes alternately disposed between pairs of adjacent dielectric layers, and external electrodes disposed on two end surfaces of the ceramic body opposite each other in a length direction orthogonal to the stacking direction. The first and second metal frames are each disposed along a respective one of two end surfaces of the multilayer ceramic capacitor opposite each other in the length direction, and are each disposed along upper and lower surfaces of the multilayer ceramic capacitor. The insulating cover is disposed to enclose the multilayer ceramic capacitor and upper surfaces of the first and second metal frames. A board can have the multilayer ceramic electronic component mounted thereon.

Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body in which internal electrodes are stacked to be parallel with respect to a mounting surface and external electrodes disposed on opposing end surfaces of the capacitor body, respectively, and a metal frame having a solder pocket and including a vertical portion, an upper horizontal portion extending from an upper end of the vertical portion, and a lower horizontal portion extending from a lower end of the vertical portion, the upper horizontal portion connected to an upper band portion of each of the external electrodes. 0.1?G/CT?0.7 is satisfied, in which CT is a height of the vertical portion and G is a distance between the lower band portion of each of the external electrodes and a lower end of the metal frame.

Abstract: A capacitor component includes a body including a plurality of dielectric layers having a layered structure and a first internal electrode and a second internal electrode alternately disposed with respective dielectric layers of the plurality of dielectric layers disposed therebetween. A first external electrode is disposed on a first surface and a second surface of the body opposing each other, and is connected to the first internal electrode. A second external electrode is disposed on at least one of a third surface and a fourth surface of the body connecting the first surface to the second surface and opposing each other, and is connected to the second internal electrode. The first internal electrode and the second internal electrode provide a plurality of resonance frequencies. In some examples, each of the first internal electrode and the second internal electrode is divided into a plurality of regions spaced apart from each other.

Abstract: A multilayer electronic component includes a capacitor body, a plurality of external electrodes disposed on a mounting surface of the capacitor body to be spaced apart from each other, and a connection terminal including land portions formed of insulators. The land portions have conductor layers formed on surfaces thereof, and are disposed on respective external electrodes. A bridge portion is disposed between land portions adjacent to each other. Cut portions are formed in the land portions. The multilayer electronic component can optionally be mounted on a circuit board having a plurality of electrode pads such that each land portion is mounted to a respective electrode pad of the circuit board.

Abstract: A multilayer electronic component includes: a capacitor body including an active region including first and second internal electrodes and upper and lower cover regions; first and second external electrodes including first and second connected portions connected to the first and second internal electrodes and first and second band portions, respectively; and first and second bump terminals having conductive layers and disposed on the first and second band portions, respectively, wherein BW/3?G?BW and T/5<ET<T/2, where BW is a width of each of the first and second band portions, T is a thickness of each of the first and second connected portions, G is a width of each of the first and second bump terminals, and ET is a thickness of each of the first and second bump terminals.

Abstract: A composite electronic component includes: a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body, and first and second external electrodes disposed on both end portions of the first ceramic body. The ceramic chip includes a second ceramic body disposed on a lower portion of the multilayer ceramic capacitor, and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes. A width of first regions of the second ceramic body in which the first and second terminal electrodes are disposed is wider than a width of a second region of the second ceramic body between the first regions.

Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic electronic component are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body comprising dielectric layers and internal electrodes, the internal electrodes having at least one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on first and second end portions of the first ceramic body. The ceramic electronic component includes a second ceramic body coupled to a lower portion of the multilayer ceramic capacitor and made of ceramic; and first and second terminal electrodes disposed on first and second end portions of the second ceramic body and connected to the first and second external electrodes, and the multilayer ceramic capacitor and the ceramic electronic component have different lengths.

Abstract: An electronic component includes: a multilayer capacitor having both ends on which external electrodes are disposed; connection terminals including vertical portions, lower horizontal portions having cut portions, respectively, and upper horizontal portions, respectively, lower surfaces of the upper horizontal portions being connected to the external electrodes; and a tantalum capacitor disposed on upper surfaces of the upper horizontal portions to be electrically connected thereto.

Abstract: A multilayer electronic component includes a capacitor body, first and second external electrodes, first and second land portions, and first and second insulating portions. The first and second external electrodes are disposed and spaced apart from each other on a mounting surface of the capacitor body. The first and second land portions include a conductive material and are disposed on the first and second external electrodes, respectively. The first and second insulating portions are disposed between the first and second land portions on the mounting surface of the capacitor body to be spaced apart from each other and each have one end connected to a respective one of the first and second land portions. A board having a multilayer electronic component includes a circuit board having first and second electrode pads disposed on one surface thereof, and the multilayer electronic component mounted thereon.

Abstract: The composite electronic component includes: a multilayer capacitor; an electrostatic discharge (ESD) protecting element; and first to fourth conductive resin layers, The multilayer capacitor includes: a capacitor body including dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween; first and second external electrodes connected to exposed portions of the first internal electrodes; and third and fourth external electrodes connected to exposed portions of the second internal electrodes. The ESD protecting element includes: a discharge portion disposed on the first surface of the capacitor body to be connected to the first to fourth external electrodes; and a protective layer. The first to fourth conductive resin layers are formed on the first to fourth external electrodes, respectively, and extend to portions of a first surface of the protective layer, respectively.

Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and a plurality of first and second internal electrodes exposed through the third and fourth surfaces, and having first to sixth surfaces; first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces, and first and second band portions extending from the first and second connection portions to portions of the first and second surfaces and the fifth and sixth surfaces; first and second conductive resin layers covering portions of the first and second band portions; an insulating layer disposed on the first surface; and first and second terminal electrodes spaced apart from each other, covering portions of the insulating layer, and connected to the first and second external electrodes.

Abstract: There are provided a multilayer electronic component and a board having the same. The multilayer electronic component includes: a capacitor body; external electrodes including band portions and connected portions; connection terminals formed of insulators and disposed on the band portions; and insulating portions disposed on at least some circumferential surfaces of the connection terminals. The connection terminals include conductive patterns formed on surfaces thereof facing the band portions and surfaces thereof opposing the surfaces, cut portions are formed in some the circumferential surfaces connecting between the conductive patterns facing each other, connection patterns are formed on the cut portions to electrically connect between the conductive patterns facing each other, and the insulating portions are disposed so as not to cover the cut portions.

Abstract: A multilayer capacitor includes a capacitor body, dielectric layers and a plurality of first internal electrodes and second internal electrodes forming a portion of the capacitor body, the plurality of first internal electrodes and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, the capacitor body further having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other, and a fifth surface and a sixth surface opposing each other, the first internal electrodes and the second internal electrodes being exposed through at least the third surface and the fourth surface, respectively, an insulating layer disposed in the first surface of the capacitor body, a buffer layer at least partially covering the insulating layer, and a first terminal electrode and a second terminal electrode spaced apart from each other.