Patents by Inventor Heung Kil PARK

Heung Kil PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10192682
    Abstract: The composite electronic component includes: a multilayer capacitor; an electrostatic discharge (ESD) protecting element; and first to fourth conductive resin layers, The multilayer capacitor includes: a capacitor body including dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween; first and second external electrodes connected to exposed portions of the first internal electrodes; and third and fourth external electrodes connected to exposed portions of the second internal electrodes. The ESD protecting element includes: a discharge portion disposed on the first surface of the capacitor body to be connected to the first to fourth external electrodes; and a protective layer. The first to fourth conductive resin layers are formed on the first to fourth external electrodes, respectively, and extend to portions of a first surface of the protective layer, respectively.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: January 29, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Jong Hwan Park
  • Patent number: 10192685
    Abstract: A multilayer capacitor includes a capacitor body including a plurality of first and second internal electrodes alternately disposed therein and a dielectric layer interposed therebetween, and having first to sixth surfaces, opposing each other, respectively; a plurality of external electrodes connected to the first and second internal electrodes; an insulating layer disposed on the first surface; first and second terminal electrodes spaced apart from each other in a direction in which the third and fourth surfaces are connected, on the insulating layer; and a connecting member electrically connecting the first and second terminal electrodes and the external electrodes.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: January 29, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Jong Hwan Park, Se Hun Park, Young Ghyu Ahn
  • Publication number: 20190008036
    Abstract: A multilayer electronic component includes: a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed between each pair of first and second internal electrodes, the capacitor body having third and fourth surfaces opposing each other, an end of each the first and second internal electrodes being exposed through the third and fourth surfaces, respectively; first and second external electrodes disposed on the third and fourth surfaces of the capacitor body, respectively; and first and second connection terminals connected to the first and second external electrodes, respectively, wherein each of the first and second connection terminals includes a vertical portion disposed to face the external electrode, a horizontal portion extended from a lower end of the vertical portion, and a cut portion formed in a portion connecting the vertical portion and the horizontal portion to each other.
    Type: Application
    Filed: November 15, 2017
    Publication date: January 3, 2019
    Inventors: Heung Kil PARK, Se Hun PARK, Gu Won JI
  • Publication number: 20180359859
    Abstract: A capacitor component includes a body including a plurality of dielectric layers having a stacked structure and a plurality of first internal electrodes and a plurality of second internal electrodes alternately disposed with dielectric layers disposed therebetween. A first external electrode is on a first surface and a second surface of the body, on the opposing side of the body, and connected to the plurality of first internal electrodes. A second external electrode is on a third surface and a fourth surface of the body, opposing each other, and connected to one or more of the plurality of second internal electrodes.
    Type: Application
    Filed: August 21, 2018
    Publication date: December 13, 2018
    Inventors: Heung Kil PARK, Jong Hwan PARK
  • Patent number: 10143085
    Abstract: A multilayer electronic component includes a first multilayer capacitor electrically connected to a first surface of a support plate formed of an insulating material; and first and second metal frames electrically connected to first and second ends of the support plate, respectively. The first and second metal frames extend in an amount greater than a thickness of the first multilayer capacitor so that a first end of the first and second metal frames constitutes a mounting part.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: November 27, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Jong Hwan Park, Young Ghyu Ahn
  • Patent number: 10128050
    Abstract: A composite electronic component includes: a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body, and first and second external electrodes disposed on both end portions of the first ceramic body. The ceramic chip includes a second ceramic body disposed on a lower portion of the multilayer ceramic capacitor, and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes. A width of first regions of the second ceramic body in which the first and second terminal electrodes are disposed is wider than a width of a second region of the second ceramic body between the first regions.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: November 13, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Se Hun Park, Gu Won Ji, Heung Kil Park
  • Patent number: 10128048
    Abstract: A multilayer capacitor includes a body including a capacitor body formed by layering a plurality of dielectric layers and a plurality of first and second internal electrodes in a width direction, the first and second internal electrodes including body portions overlapping each other and lead portions exposed to a mounting surface of the capacitor body and disposed to be spaced apart from each other, respectively; and first, second and third external electrodes disposed on the mounting surface of the capacitor body to be connected to the lead portions, respectively, wherein the first, second and third external electrodes each include first, second and third electrode layers which are sequentially stacked, the first and second electrode layers containing metal and glass particles, and the third electrode layer containing a conductive resin.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: November 13, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Jong Hwan Park
  • Publication number: 20180323010
    Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween. One end of each of the first and second internal electrodes extends, respectively, to a third or fourth surface of the capacitor body. First and second external electrodes respectively include first and second connected portions disposed on the third and fourth surfaces, and first and second band portions respectively extended from the first and second connected portions to portions of a first surface of the capacitor body. A first connection terminal is disposed on the first band portion to provide a first solder accommodating portion, and a second connection terminal is disposed on the second band portion to provide a second solder accommodating portion.
    Type: Application
    Filed: November 13, 2017
    Publication date: November 8, 2018
    Inventors: Heung Kil PARK, Jae Yeol CHOI, Young Ghyu AHN, Soo Hwan SON, Se Hun PARK, Gu Won JI
  • Publication number: 20180286593
    Abstract: A capacitor component includes a capacitor body including dielectric layers and first and second internal electrodes alternately stacked; and a connection terminal coupled to the capacitor body and including a buffer member having insulating properties and at least one conductive fiber portion penetrating through the buffer member.
    Type: Application
    Filed: June 7, 2018
    Publication date: October 4, 2018
    Inventors: Heung Kil PARK, Young Key KIM
  • Patent number: 10074481
    Abstract: A capacitor component includes a capacitor body including dielectric layers and first and second internal electrodes alternately stacked; and a connection terminal coupled to the capacitor body and including a buffer member having insulating properties and at least one conductive fiber portion penetrating through the buffer member.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: September 11, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Young Key Kim
  • Patent number: 10062511
    Abstract: A multilayer electronic component includes a capacitor body with first and second external electrodes on a mounting surface of the capacitor body. First and second connection terminals include insulators and are respectively connected to the first and second external electrodes. The first connection terminal includes first to third conductive patterns and a first cut portion a side surface. The second connection terminal includes fourth to sixth conductive patterns and a second cut portion in a side surface.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: August 28, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Se Hun Park, Gu Won Ji
  • Patent number: 10062513
    Abstract: A capacitor component includes a body having a first surface, a second surface, a third surface, a fourth surface, a stack structure including a plurality of dielectric layers, and a first internal electrode and a second internal electrode, a first external electrode formed on the first surface and the fourth surface, and a second external electrode formed on the second surface and the fourth surface. The first internal electrode includes a first region and a second region, the first region being connected to the first external electrode by a lead extending to the fourth surface, and the second region being connected to the first external electrode by a lead extending to the first surface. The second internal electrode includes a third region and a fourth region, the fourth region being connected to the second external electrode by a lead extending to the second surface.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: August 28, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Jong Hwan Park
  • Patent number: 10028386
    Abstract: A composite electronic component includes a multilayer capacitor; a tantalum capacitor; a lead frame disposed between the multilayer capacitor and the tantalum capacitor and electrically connecting the multilayer capacitor and the tantalum capacitor to each other; and an encapsulation member encapsulating the multilayer capacitor and the tantalum capacitor so that a portion of the lead frame is exposed.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: July 17, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Jong Hwan Park, Young Ghyu Ahn
  • Publication number: 20180182545
    Abstract: A multilayer capacitor includes a capacitor body, dielectric layers and a plurality of first internal electrodes and second internal electrodes forming a portion of the capacitor body, the plurality of first internal electrodes and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, the capacitor body further having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other, and a fifth surface and a sixth surface opposing each other, the first internal electrodes and the second internal electrodes being exposed through at least the third surface and the fourth surface, respectively, an insulating layer disposed in the first surface of the capacitor body, a buffer layer at least partially covering the insulating layer, and a first terminal electrode and a second terminal electrode spaced apart from each other.
    Type: Application
    Filed: July 7, 2017
    Publication date: June 28, 2018
    Inventors: Heung Kil PARK, Se Hun PARK
  • Publication number: 20180182554
    Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and a plurality of first and second internal electrodes exposed through the third and fourth surfaces, and having first to sixth surfaces; first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces, and first and second band portions extending from the first and second connection portions to portions of the first and second surfaces and the fifth and sixth surfaces; first and second conductive resin layers covering portions of the first and second band portions; an insulating layer disposed on the first surface; and first and second terminal electrodes spaced apart from each other, covering portions of the insulating layer, and connected to the first and second external electrodes.
    Type: Application
    Filed: July 7, 2017
    Publication date: June 28, 2018
    Inventors: Heung Kil Park, Jong Hwan PARK, Se Hun PARK
  • Patent number: 9984827
    Abstract: A capacitor component includes a body including a plurality of dielectric layers having a layered structure, and first internal electrodes and second internal electrodes alternately disposed with respective dielectric layers of the plurality of dielectric layers interposed therebetween, a first external electrode formed on a first surface and a second surface of the body opposing each other, and connected to the first internal electrodes, and a second external electrode formed on at least one of a third surface and a fourth surface of the body connecting the first surface to the second surface and opposing each other, and connected to the second internal electrodes. The capacitor component is divided into a plurality of capacitor units each including a portion of the first internal electrodes and a portion of the second internal electrodes, and the plurality of capacitor units include a first capacitor unit and a second capacitor unit.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: May 29, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Heung Kil Park
  • Publication number: 20180144868
    Abstract: A multilayer capacitor includes a capacitor body including a plurality of first and second internal electrodes alternately disposed therein and a dielectric layer interposed therebetween, and having first to sixth surfaces, opposing each other, respectively; a plurality of external electrodes connected to the first and second internal electrodes; an insulating layer disposed on the first surface; first and second terminal electrodes spaced apart from each other in a direction in which the third and fourth surfaces are connected, on the insulating layer; and a connecting member electrically connecting the first and second terminal electrodes and the external electrodes.
    Type: Application
    Filed: July 10, 2017
    Publication date: May 24, 2018
    Inventors: Heung Kil PARK, Jong Hwan PARK, Se Hun PARK, Young Ghyu AHN
  • Publication number: 20180144864
    Abstract: A capacitor includes a body including a dielectric layer, first internal electrodes and second internal electrodes. Each of the first internal electrodes and each of the second internal electrodes are alternately disposed with the dielectric layer interposed therebetween. A first connection electrode is disposed on a first end surface of the body to connect an end of the first internal electrodes. A second connection electrode is disposed on a second end surface of the body opposite to the first end surface to connect an end of the second internal electrodes. A first insulating layer is disposed on one surface of the body. A first terminal electrode and a second terminal electrode are respectively disposed on opposing end surfaces of the first insulating layer to connect the first connection electrode and the second connection electrode, respectively. A second insulating layer is disposed on another surface of the body.
    Type: Application
    Filed: March 8, 2017
    Publication date: May 24, 2018
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil PARK, Jong Hwan PARK, Se Hun PARK
  • Publication number: 20180144867
    Abstract: A multilayer capacitor includes a capacitor body including a first surface and a second surface opposing each other, a third surface and a fourth surface connected to the first surface and the second surface and opposing each other, and a fifth surface and a sixth surface, a first internal electrode of the first internal electrodes being exposed through the third surface and the fourth surface, a second internal electrode of the second internal electrodes being exposed through the fifth surface and the sixth surface, a first external electrode and a second external electrode disposed in the third surface and the fourth surface of the capacitor body, respectively, the first external electrode and the second external electrode connected to an exposed portion of the first internal electrode, a third external electrode and a fourth external electrode disposed in the fifth surface and the sixth surface of the capacitor body, respectively.
    Type: Application
    Filed: June 13, 2017
    Publication date: May 24, 2018
    Inventors: Heung Kil PARK, Jong Hwan PARK
  • Patent number: 9978525
    Abstract: A multilayer ceramic electronic component includes: a capacitor set including a plurality of multilayer ceramic capacitors connected in series and accommodated in an insulation case while exposing external electrodes provided on both end portions thereof; and a pair of metal terminals connected to the external electrodes exposed outside of the insulation case, respectively. One end portion of the capacitor set is elastically supported by one of the pair of metal terminals.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: May 22, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Heung Kil Park