Patents by Inventor Hideaki Takeda

Hideaki Takeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10163593
    Abstract: A temperature switch 1 includes first terminal unit 2 having a first terminal 5 and a first fixed contact 6, a switch body unit 3 including a bimetal element 22 in which both ends engage a movable plate 15 holding, via an tongue portion 17, first and second fixed contacts 6 and 8 arranged in an internal center portion of an insulation material 10 at prescribed intervals and also holding a movable contact 18 arranged above them, and a second terminal unit 4 having a second terminal 7 and the second fixed contact 8. The first terminal unit 2, the switch body unit 3, and the second terminal unit 4 are sequentially arranged in line. At an ambient temperature, the bimetal element 22 deforms into a convex shape in the contact direction so as to push out the tongue portion 17 and the movable contact 18 at the center of the convex shape, and the movable contact 18 is closed with respect to the first and second fixed contacts 6 and 8 so that a current flows between the first and second terminals 5 and 7.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: December 25, 2018
    Assignee: Uchiya Thermostat Co., Ltd.
    Inventor: Hideaki Takeda
  • Publication number: 20180053613
    Abstract: A thermal protector (1) that switches an electric circuit of an electrical product includes first and second terminals (2,3) that are each connected to an external circuit, a first insulating block (4) that holds the first terminal (2), a second insulating block (5) that holds the second terminal (3), a base (6) that connects the first insulating block (4) and the second insulating block (5), a fixed contact (7) that is connected to the first terminal (2), a movable contact (8) that is arranged in a position that faces the fixed contact (7), a bimetal (9) whose curvature is reversed at a set temperature, and an elastically-deformable movable plate (10) that engages the bimetal (9) and on which the movable contact (8) is fixed, the movable plate (10) being connected to the second terminal (3) so as to be fixed on the base (6), wherein the bimetal (9) and the movable plate (10) are arranged to be within an area situated between the first insulating block (4) and the second insulating block (5), and are arranged
    Type: Application
    Filed: December 10, 2015
    Publication date: February 22, 2018
    Inventor: Hideaki Takeda
  • Publication number: 20180009965
    Abstract: Provided are a polyamide resin composition prepared by blending a polyamide resin (A) and a polyalcohol (B), wherein the proportion of the number of the amide groups to the number of the carbon atoms in the polyamide resin (A) is 0.080 to 0.140 and the blending amount of the polyalcohol (B) is 1 to 10 parts by mass relative to 100 parts by mass of the polyamide resin (A); and a molded article of the resin composition.
    Type: Application
    Filed: December 16, 2015
    Publication date: January 11, 2018
    Applicant: KURARAY CO., LTD.
    Inventors: Kensuke KAMOSHIDA, Hideaki TAKEDA, Go TAZAKI
  • Publication number: 20180002573
    Abstract: Provided are a multilayer film, a method for producing the multilayer film, and a method for producing a molded body. The multilayer film has excellent three-dimensional overlaying formability and adhesiveness after being formed; can easily be used when being bonded to an adherend; maintains adhesive strength. Specifically, the multilayer film has: an adhesive layer comprising a thermoplastic polymer composition containing a thermoplastic elastomer (A) which is a block copolymer or a hydrogenated product thereof having a polymer block (a1) containing aromatic vinyl compound units and having a polymer block (a2) containing conjugated diene compound units; and a base layer comprising an amorphous resin which has a modulus of elasticity of 2 to 600 MPa at an arbitrary temperature of 110 to 160° C. The tensile elongation at break of the multilayer film at a temperature 5° C. lower than the glass transition temperature of the amorphous resin is at least 160%.
    Type: Application
    Filed: January 28, 2016
    Publication date: January 4, 2018
    Applicant: KURARAY CO., LTD.
    Inventors: Hiroshi KAWAKITA, Kirihiro NAKANO, Hideaki TAKEDA
  • Publication number: 20170365428
    Abstract: A thermal protector includes, in a fixed manner, a first terminal and a second terminal that are respectively connected to external circuits, at lower left/right ends of the longitudinal directions of a base, and a right end at which a movable plate and a bimetal are superimposed is fixed to the right end of the upper surface of the base and is connected to the second terminal. A fixed contact is fixed to an internal end of the first terminal that is exposed in the left end of the base. A movable contact is fixed at a position facing the fixed contact on the lower surface of the left end of the movable plate. A partition wall that encloses the movable contact and the fixed contact from three directions is provided and bent plate planes are formed on both sides of the movable plate in the vicinity of the movable contact. The bent plate planes adjust the flow direction of hot air in cooperation with the partition wall so as to prevent a malfunction of a breaking arc flying to surrounding conductive members.
    Type: Application
    Filed: October 19, 2015
    Publication date: December 21, 2017
    Inventor: Hideaki Takeda
  • Patent number: 9829388
    Abstract: A temperature detection element of a temperature sensor is connected to a print wire and three print wires for an input and output of a print substrate, one end of a lead wire for a connection is connected and fixed with solder to an external circuit for connection electrodes of the print wire, and the other end is externally drawn out of a sealing member of a hardened resin. Within the housing, the entire bottom surface of the print substrate is supported by a lower fixed member, and an end, closer to an opening part of the housing, of the print substrate, is sandwiched and fixed by an upper fixed member and the lower fixed member. The housing is configured with the same material and size as the housing of the temperature control element, and the temperature detection element inside is placed at a position approximated to a placement of a thermal response element of the temperature control element.
    Type: Grant
    Filed: July 26, 2013
    Date of Patent: November 28, 2017
    Assignee: Uchiya Thermostat Co., Ltd.
    Inventor: Hideaki Takeda
  • Publication number: 20170294281
    Abstract: A temperature switch 1 includes first terminal unit 2 having a first terminal 5 and a first fixed contact 6, a switch body unit 3 including a bimetal element 22 in which both ends engage a movable plate 15 holding, via an tongue portion 17, first and second fixed contacts 6 and 8 arranged in an internal center portion of an insulation material 10 at prescribed intervals and also holding a movable contact 18 arranged above them, and a second terminal unit 4 having a second terminal 7 and the second fixed contact 8. The first terminal unit 2, the switch body unit 3, and the second terminal unit 4 are sequentially arranged in line. At an ambient temperature, the bimetal element 22 deforms into a convex shape in the contact direction so as to push out the tongue portion 17 and the movable contact 18 at the center of the convex shape, and the movable contact 18 is closed with respect to the first and second fixed contacts 6 and 8 so that a current flows between the first and second terminals 5 and 7.
    Type: Application
    Filed: July 9, 2015
    Publication date: October 12, 2017
    Inventor: Hideaki Takeda
  • Patent number: 9768152
    Abstract: A method for producing a light emitting device includes a first bonding step including disposing a first bonding member a mounting substrate, placing a light emitting element on the mounting substrate such that the first bonding member is located between a mounting face of the light emitting element and the mounting substrate, and hardening the first bonding member thereby bonding the light emitting element and the mounting substrate such that, in a plan view, an entirety of the first bonding member is contained within an area of the mounting face of the light emitting element; and a second bonding step including disposing a second bonding member on the upper face of the mounting substrate such that, in a plan view, the second bonding member is located at at least a portion of an outer edge of the mounting face of the light emitting element, and hardening the second bonding member.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: September 19, 2017
    Assignee: NICHIA CORPORATION
    Inventor: Hideaki Takeda
  • Patent number: 9714343
    Abstract: The present invention is a polyamide resin composition containing a polyamide resin (A) that contains from 95 to 99.95% by mass of a polyamide (a-1) having a number-average molecular weight of 2000 or more and from 0.05 to 5% by mass of a polyamide oligomer (a-2) having a number-average molecular weight of from 500 to less than 2000, in which at least 25 mol % of all the monomer units constituting the polyamide (a-1) and the polyamide oligomer (a-2) are structural units derived from a specific alicyclic monomer and the content ratio of the trans isomer structural units derived from the alicyclic monomer is from 50 to 85 mol %, and containing an inorganic filler (B). The polyamide resin composition is excellent in heat resistance, low water absorption, high-temperature rigidity and flowability, and exhibits the effects of securing sufficient crystallization even when molded in a mold at 80° C. and causing minimal mold deposit during production.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: July 25, 2017
    Assignee: KURARAY CO., LTD.
    Inventors: Nobuhiro Oya, Hideaki Takeda
  • Patent number: 9601293
    Abstract: A base member includes a terminal fixing part for blocking an entire surface of an opening part of a housing at a position further inner than an opening end part of the housing when the base member is inserted in the housing. A first electrode part formed by a tip part of two bent stages that are composed of a horizontal part, a vertical part, and a horizontal part and configured by bending a portion of a part of the fixed side fixed a conductive member, which is continuous with a first external connection terminal, in a direction perpendicular to a continuous direction.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: March 21, 2017
    Assignee: Uchiya Thermostat Co., Ltd.
    Inventor: Hideaki Takeda
  • Publication number: 20170062161
    Abstract: A movable flat surface portion, which rises in conjunction with the upward movement of a facing surface, first causes an edge of the movable flat surface portion to abut a flat surface portion, second brings an entirety of a surface of the movable flat surface portion into intimate contact with the fixed flat surface portion as a result of the movable flat surface portion acting against elastic resistance thereof in accordance with upward inertia, third forms, in accordance with a restoring force resulting from the elastic resistance thereof, a gap in the intimate contact with the fixed flat surface portion in a manner such that the forming of the gap starts with an end side continuous with the end of the facing surface, and fourth stabilizes a position shape such that the edge of the movable flat surface portion is a portion that ultimately comes into contact with the fixed flat surface portion.
    Type: Application
    Filed: October 9, 2014
    Publication date: March 2, 2017
    Inventor: Hideaki Takeda
  • Publication number: 20170040302
    Abstract: A method for producing a light emitting device includes a first bonding step including disposing a first bonding member a mounting substrate, placing a light emitting element on the mounting substrate such that the first bonding member is located between a mounting face of the light emitting element and the mounting substrate, and hardening the first bonding member thereby bonding the light emitting element and the mounting substrate such that, in a plan view, an entirety of the first bonding member is contained within an area of the mounting face of the light emitting element; and a second bonding step including disposing a second bonding member on the upper face of the mounting substrate such that, in a plan view, the second bonding member is located at at least a portion of an outer edge of the mounting face of the light emitting element, and hardening the second bonding member.
    Type: Application
    Filed: October 25, 2016
    Publication date: February 9, 2017
    Applicant: NICHIA CORPORATION
    Inventor: Hideaki TAKEDA
  • Patent number: 9515237
    Abstract: A method for producing a light emitting device includes a first bonding step including disposing a first bonding member a mounting substrate, placing a light emitting element on the mounting substrate such that the first bonding member is located between a mounting face of the light emitting element and the mounting substrate, and hardening the first bonding member thereby bonding the light emitting element and the mounting substrate such that, in a plan view, an entirety of the first bonding member is contained within an area of the mounting face of the light emitting element; and a second bonding step including disposing a second bonding member on the upper face of the mounting substrate such that, in a plan view, the second bonding member is located at at least a portion of an outer edge of the mounting face of the light emitting element, and hardening the second bonding member.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: December 6, 2016
    Assignee: NICHIA CORPORATION
    Inventor: Hideaki Takeda
  • Patent number: 9484171
    Abstract: A thermal protector has superiority in current responsiveness or thermal responsiveness with a simple configuration that does not need a separate manufacturing step of incorporating a resistor. At a stage of press processing for cutting from an original material, a movable plate body part of a movable plate is partitioned into a narrow-width part and a wide-width part by a slim hole. The movable plate is assembled to a fixed conductor with columns of an insulator, a bimetal is assembled to the movable plate, the entire configuration is pressed down by a resinous block, and the entire fixing part is fixed by melting tips of the columns. The wide-width part serves as a normal movable plate, whereas the narrow-width part serves as a conductor in a normal state and as a resistor against an overcurrent.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: November 1, 2016
    Assignee: Uchiya Thermostat Co., Ltd.
    Inventor: Hideaki Takeda
  • Patent number: 9472363
    Abstract: A thermal protector has superiority in current responsiveness or thermal responsiveness with a simple configuration that does not need a separate manufacturing step of incorporating a resistor. At a stage of press processing for cutting from an original material, a movable plate body part of a movable plate is partitioned into a narrow-width part and a wide-width part by a slim hole. The movable plate is assembled to a fixed conductor with columns of an insulator, a bimetal is assembled to the movable plate, the entire configuration is pressed down by a resinous block, and the entire fixing part is fixed by melting tips of the columns. The wide-width part serves as a normal movable plate, whereas the narrow-width part serves as a conductor in a normal state and as a resistor against an overcurrent.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: October 18, 2016
    Assignee: Uchiya Thermostat Co., Ltd.
    Inventor: Hideaki Takeda
  • Publication number: 20160284952
    Abstract: A method for producing a light emitting device includes a first bonding step including disposing a first bonding member a mounting substrate, placing a light emitting element on the mounting substrate such that the first bonding member is located between a mounting face of the light emitting element and the mounting substrate, and hardening the first bonding member thereby bonding the light emitting element and the mounting substrate such that, in a plan view, an entirety of the first bonding member is contained within an area of the mounting face of the light emitting element; and a second bonding step including disposing a second bonding member on the upper face of the mounting substrate such that, in a plan view, the second bonding member is located at at least a portion of an outer edge of the mounting face of the light emitting element, and hardening the second bonding member.
    Type: Application
    Filed: March 23, 2016
    Publication date: September 29, 2016
    Applicant: NICHIA CORPORATION
    Inventor: Hideaki TAKEDA
  • Publication number: 20160221238
    Abstract: The present invention provides a method for producing molded articles by joining primary molded parts by injection welding, by which a molded article composed of primary molded parts that are joined with high weld strength can be produced. The present invention relates to a method for producing molded articles including a welding step of injecting an injection welding material containing a polyamide around or between butt weld portions of primary molded parts disposed in face-to-face contact, so as to weld the primary molded parts together to form a molded article. The polyamide contains dicarboxylic acid units and diamine units. This polyamide further contains triamine units in an amount of 0.05 to 1 mol % with respect to the total dicarboxylic acid units.
    Type: Application
    Filed: September 18, 2014
    Publication date: August 4, 2016
    Applicant: KURARAY CO., LTD.
    Inventor: Hideaki TAKEDA
  • Publication number: 20150292954
    Abstract: A temperature detection element of a temperature sensor is connected to a print wire and three print wires for an input and output of a print substrate, one end of a lead wire for a connection is connected and fixed with solder to an external circuit for connection electrodes of the print wire, and the other end is externally drawn out of a sealing member of a hardened resin. Within the housing, the entire bottom surface of the print substrate is supported by a lower fixed member, and an end, closer to an opening part of the housing, of the print substrate, is sandwiched and fixed by an upper fixed member and the lower fixed member. The housing is configured with the same material and size as the housing of the temperature control element, and the temperature detection element inside is placed at a position approximated to a placement of a thermal response element of the temperature control element.
    Type: Application
    Filed: July 26, 2013
    Publication date: October 15, 2015
    Applicant: UCHIYA THERMOSTAT CO., LTD.
    Inventor: Hideaki Takeda
  • Publication number: 20150240078
    Abstract: The present invention is a polyamide resin (A) that contains from 95 to 99.95% by mass of a polyamide (a-1) having a number-average molecular weight of 2000 or more and from 0.05 to 5% by mass of a polyamide oligomer (a-2) having a number-average molecular weight of from 500 to less than 2000, in which at least 25 mol % of all the monomer units constituting the polyamide (a-1) and the polyamide oligomer (a-2) are structural units derived from a specific alicyclic monomer, and the content ratio of the trans isomer structural units derived from the alicyclic monomer is from 50 to 85 mol %. The polyamide resin (A) is excellent in heat resistance, low water absorption, high-temperature rigidity, chemical resistance and flowability, and exhibits the effects of securing sufficient crystallization even when molded in a mold at 80° C. and causing minimal mold deposit during production.
    Type: Application
    Filed: September 6, 2013
    Publication date: August 27, 2015
    Applicant: KURARAY CO., LTD.
    Inventor: Hideaki Takeda
  • Publication number: 20150240079
    Abstract: The present invention is a polyamide resin composition containing a polyamide resin (A) that contains from 95 to 99.95% by mass of a polyamide (a-1) having a number-average molecular weight of 2000 or more and from 0.05 to 5% by mass of a polyamide oligomer (a-2) having a number-average molecular weight of from 500 to less than 2000, in which at least 25 mol % of all the monomer units constituting the polyamide (a-1) and the polyamide oligomer (a-2) are structural units derived from a specific alicyclic monomer and the content ratio of the trans isomer structural units derived from the alicyclic monomer is from 50 to 85 mol %, and containing an inorganic filler (B). The polyamide resin composition is excellent in heat resistance, low water absorption, high-temperature rigidity and flowability, and exhibits the effects of securing sufficient crystallization even when molded in a mold at 80° C. and causing minimal mold deposit during production.
    Type: Application
    Filed: September 27, 2013
    Publication date: August 27, 2015
    Applicant: KURARAY CO., LTD.
    Inventors: Nobuhiro Oya, Hideaki Takeda