Patents by Inventor Hidekazu Hayashi

Hidekazu Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8771429
    Abstract: According to one embodiment, a supercritical drying method for a semiconductor substrate, comprises introducing the semiconductor substrate into a chamber in a state, a surface of the semiconductor substrate being wet with alcohol, substituting the alcohol on the semiconductor substrate with a supercritical fluid of carbon dioxide by impregnating the semiconductor substrate to the supercritical fluid in the chamber, and discharging the supercritical fluid and the alcohol from the chamber and reducing a pressure inside the chamber. The method further comprises performing a baking treatment by supplying an oxygen gas or an ozone gas to the chamber after the reduction of the pressure inside the chamber.
    Type: Grant
    Filed: March 15, 2012
    Date of Patent: July 8, 2014
    Assignees: Kabushiki Kaisha Toshiba, Tokyo Electron Limited
    Inventors: Linan Ji, Hidekazu Hayashi, Hiroshi Tomita, Hisashi Okuchi, Yohei Sato, Takayuki Toshima, Mitsuaki Iwashita, Kazuyuki Mitsuoka, Gen You, Hiroki Ohno, Takehiko Orii
  • Publication number: 20140174482
    Abstract: In one embodiment, after rinsing a semiconductor substrate having a fine pattern formed thereon with pure water, the pure water staying on the semiconductor substrate is substituted with a water soluble organic solvent, and then, the semiconductor substrate is introduced into a chamber in a state wet with the water soluble organic solvent. Then, the water soluble organic solvent is turned into a supercritical state by increasing a temperature inside of the chamber. Thereafter, the inside of the chamber is reduced in pressure while keeping the inside of the chamber at a temperature enough not to liquefy the pure water (i.e., rinsing pure water mixed into the water soluble organic solvent), and further, the water soluble organic solvent in the supercritical state is changed into a gaseous state, to be discharged from the chamber, so that the semiconductor substrate is dried.
    Type: Application
    Filed: February 28, 2014
    Publication date: June 26, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Yohei Sato, Hisashi Okuchi, Hiroshi Tomita, Hidekazu Hayashi, Yukiko Kitajima
  • Patent number: 8760655
    Abstract: A method is disclosed for inspecting a mold which has a porous alumina layer over its surface. The method includes providing, based on a relationship between a first parameter indicative of a thickness of the porous alumina layer and a color parameter indicative of a color of reflected light from the porous alumina layer, first color information which represents a tolerance of the first parameter of a porous alumina layer which has an uneven structure that is within a tolerance; providing a mold which is an inspection subject, the mold having a porous alumina layer over its surface; obtaining a color parameter which is indicative of a color of reflected light from the porous alumina layer of the inspection subject mold; and determining a suitability of the first parameter of the inspection subject mold based on the obtained color parameter and the first color information.
    Type: Grant
    Filed: May 17, 2011
    Date of Patent: June 24, 2014
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Hidekazu Hayashi, Takao Imaoku
  • Patent number: 8758589
    Abstract: An antireflection film of the present invention includes a plurality of first raised portions, each of which has a two-dimensional size of not less than 1 ?m and less than 100 ?m when seen in a direction normal to the film, and a plurality of second raised portions, each of which has a two-dimensional size of not less than 10 nm and less than 500 nm when seen in a direction normal to the film. In at least one embodiment, the antireflection film has a first surface shape or a second surface shape that is inverse to the first surface shape relative to a film surface. In the first surface shape, the second raised portions are provided on the first raised portions and between the plurality of first raised portions, and the elevation angle ? of a surface of the first raised portions relative to the film surface is about 90° or more. The antireflection film of the present invention has a more excellent antiglare function than conventional ones.
    Type: Grant
    Filed: June 4, 2009
    Date of Patent: June 24, 2014
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Hidekazu Hayashi, Tokio Taguchi, Akiyoshi Fujii, Nobuaki Yamada
  • Publication number: 20140170307
    Abstract: According to one embodiment, provided is a method for cleaning an imprinting mask including a template having an uneven pattern, a base layer disposed on the template, and a sacrificial film disposed on the base layer. In the method for cleaning the imprinting mask, the sacrificial film is removed, and a contaminant adhered on the sacrificial film is removed from the template pattern.
    Type: Application
    Filed: July 10, 2013
    Publication date: June 19, 2014
    Inventors: Hiroshi TOMITA, Hidekazu HAYASHI
  • Patent number: 8709170
    Abstract: In one embodiment, after rinsing a semiconductor substrate having a fine pattern formed thereon with pure water, the pure water staying on the semiconductor substrate is substituted with a water soluble organic solvent, and then, the semiconductor substrate is introduced into a chamber in a state wet with the water soluble organic solvent. Then, the water soluble organic solvent is turned into a supercritical state by increasing a temperature inside of the chamber. Thereafter, the inside of the chamber is reduced in pressure while keeping the inside of the chamber at a temperature enough not to liquefy the pure water (i.e., rinsing pure water mixed into the water soluble organic solvent), and further, the water soluble organic solvent in the supercritical state is changed into a gaseous state, to be discharged from the chamber, so that the semiconductor substrate is dried.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: April 29, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yohei Sato, Hisashi Okuchi, Hiroshi Tomita, Hidekazu Hayashi, Yukiko Kitajima
  • Publication number: 20140090983
    Abstract: An electrode structure of the present invention includes: an aluminum electrode which is to be in contact with a surface of an aluminum base; a fixing member for fixing the aluminum electrode on the surface of the aluminum base; an elastic member provided between the fixing member and the aluminum base; a lead wire which is electrically connected to the aluminum electrode at least under a certain condition; and a cover member which is tightly closed with the lead wire penetrating through an opening.
    Type: Application
    Filed: November 25, 2011
    Publication date: April 3, 2014
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Hidekazu Hayashi, Kiyoshi Minoura, Akinobu Isurugi
  • Publication number: 20140087236
    Abstract: One aspect according to the present invention includes a battery pack and a shock absorbing device interposed between a battery cell holder and a case body and capable of keeping the battery cell holder and the battery cells not to directly contact with an inner surface of the case body.
    Type: Application
    Filed: December 4, 2013
    Publication date: March 27, 2014
    Applicant: MAKITA CORPORATION
    Inventors: Tsuyoshi MURAYAMA, Hideyuki TAGA, Kazutoshi OGINO, Hidekazu HAYASHI, Hitoshi SUZUKI
  • Patent number: 8673193
    Abstract: A roller nanoimprint apparatus is disclosed which is capable of preventing a workpiece film with nanostructures having been transferred from the mold roller from being uneven in thickness and allowing easy replacement of the mold roller. At least one embodiment of the present invention is directed to a roller nanoimprint apparatus including a mold roller and continuously transferring nanosized protrusions to a surface of a workpiece film by rotating the mold roller, wherein the mold roller is a cylindrical body having an outer circumference surface with nanosized recesses formed thereon, the roller nanoimprint apparatus further includes a fluid container having an elastic film inflatable by injecting fluid into the container, the fluid container being arranged in a region defined by an inner circumference surface of the mold roller, the mold roller is mounted or demounted when the elastic film is shrunken, and the mold roller is supported from the inside when the elastic film is inflated.
    Type: Grant
    Filed: November 19, 2008
    Date of Patent: March 18, 2014
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Nobuaki Yamada, Akiyoshi Fujii, Hidekazu Hayashi, Tokio Taguchi
  • Patent number: 8641884
    Abstract: A method of fabricating a motheye mold according to the present invention includes the steps of: (a) anodizing a surface of an aluminum film (10a) via an electrode (32a) that is in contact with the surface, thereby forming a porous alumina layer which has a plurality of very small recessed portions; (b) after step (a), allowing the porous alumina layer to be in contact with an etchant, thereby enlarging the very small recessed portions of the porous alumina layer; and (c) after step (b), further anodizing the surface to grow the plurality of very small recessed portions. The aluminum film is made of aluminum with a purity of 99.99 mass % or higher. The electrode includes a first electrode portion (32a1) which is made of aluminum with a purity of 99.50 mass % or lower and a second electrode portion (32a2) which is made of aluminum with a higher purity than the aluminum of the first electrode portion and which is interposed between the surface and the first electrode portion.
    Type: Grant
    Filed: March 2, 2010
    Date of Patent: February 4, 2014
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Hidekazu Hayashi, Tokio Taguchi, Kazuhiko Tsuda
  • Publication number: 20140020721
    Abstract: A substrate processing method and apparatus for preventing evaporation of an anti-drying fluorine-containing organic solvent from a substrate during transportation of the substrate into a processing container and can prevent decomposition of a fluorine-containing organic solvent in the processing container. A substrate, the surface of which is covered with a first fluorine-containing organic solvent, is carried into a processing container. The first fluorine-containing organic solvent is removed from the substrate surface by forming a high-pressure fluid atmosphere of a mixture of the first fluorine-containing organic solvent and a second fluorine-containing organic solvent, having a lower boiling point than the first fluorine-containing organic solvent, in the processing container e.g. by supplying a high-pressure fluid of the second fluorine-containing organic solvent into the processing container.
    Type: Application
    Filed: July 15, 2013
    Publication date: January 23, 2014
    Inventors: Hidekazu HAYASHI, Yohei SATO, Hisashi OKUCHI, Hiroshi TOMITA, Kazuyuki MITSUOKA, Gen YOU, Hiroki OHNO, Takehiko ORII, Takayuki TOSHIMA
  • Patent number: 8624552
    Abstract: One aspect according to the present invention includes a battery pack and a shock absorbing device interposed between a battery cell holder and a case body and capable of keeping the battery cell holder and the battery cells not to directly contact with an inner surface of the case body.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: January 7, 2014
    Assignee: Makita Corporation
    Inventors: Tsuyoshi Murayama, Hideyuki Taga, Kazutoshi Ogino, Hidekazu Hayashi, Hitoshi Suzuki
  • Publication number: 20130341823
    Abstract: A mold is disclosed, which is capable of producing a nanoimprint film without a problem of clogging of irregularities of the mold with a resin material. A method for producing the mold and a method for producing a nanoimprint film using the mold are further disclosed. In an embodiment, the mold includes: a first surface having a nanostructure including plural recesses spaced at an interval of less than 1 ?m between bottom points of adjacent recesses; and at least two second surfaces substantially not having the nanostructure, wherein the first surface is coplanar with the at least two second surfaces and is positioned between two second surfaces.
    Type: Application
    Filed: March 1, 2012
    Publication date: December 26, 2013
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Kenichiro Nakamatsu, Hidekazu Hayashi, Kiyoshi Minoura, Akinobu Isurugi
  • Patent number: 8597767
    Abstract: To provide an optical element having excellent adhesion to a lamination film, a roller nanoimprint apparatus, and a production method of a mold roller are disclosed. In at least one embodiment of the present invention, an optical element includes a nanostructure film including recesses and protrusions in nanometer size formed continuously on a surface of the nanostructure film and a lamination film laminated on the nanostructure film. The nanostructure film includes a nanostructure-free region free from the recesses and protrusions in nanometer size in both ends along a longitudinal direction of the nanostructure film.
    Type: Grant
    Filed: November 19, 2008
    Date of Patent: December 3, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Nobuaki Yamada, Akiyoshi Fujii, Tokio Taguchi, Hidekazu Hayashi
  • Patent number: 8580135
    Abstract: A mold of the present invention includes: a base 12 made of glass or plastic; an inorganic underlayer 14 provided on a surface of the base 12; a buffer layer 16 provided on the inorganic underlayer 14, the buffer layer 16 containing aluminum; an aluminum layer 18a provided on a surface of the buffer layer 16; and a porous alumina layer 20 provided on a surface of the aluminum layer 18a. The porous alumina layer 20 has a plurality of recessed portions 22 whose two-dimensional size viewed in a direction normal to the surface is not less than 10 nm and less than 500 nm. The mold of the present invention has excellent adhesion between the aluminum layer and the base.
    Type: Grant
    Filed: April 6, 2010
    Date of Patent: November 12, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Hidekazu Hayashi, Kiyoshi Minoura, Akinobu Isurugi
  • Patent number: 8563163
    Abstract: A battery housing of a tool battery has a hook accommodation chamber and a battery cell accommodation chamber defined therein. A hook is accommodated within the hook accommodation chamber and is operable to lock and unlock the tool battery against a tool body of a power tool. Battery cells are disposed within the battery cell accommodation chamber. The hook accommodation chamber and the battery cell accommodation chamber are partitioned from each other.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: October 22, 2013
    Assignee: Makita Corporation
    Inventors: Hidekazu Hayashi, Eiji Kondo, Hironori Ogura, Hideyuki Taga
  • Patent number: 8545708
    Abstract: A mold of the present invention includes: a flexible polymer film; a curable resin layer provided on a surface of the polymer film; and a porous alumina layer provided on the curable resin layer, the porous alumina layer having an inverted moth-eye structure in its surface, the inverted moth-eye structure having a plurality of recessed portions whose two-dimensional size viewed in a direction normal to the surface is not less than 10 nm and less than 500 nm. According to the present invention, a method for easily forming a flexible moth-eye mold which can be deformed into the form of a roll is provided.
    Type: Grant
    Filed: April 26, 2010
    Date of Patent: October 1, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Akiyoshi Fujii, Kiyoshi Minoura, Akinobu Isurugi, Hidekazu Hayashi
  • Publication number: 20130206600
    Abstract: A method for manufacturing an anodized film according to an embodiment of the present invention includes the steps of: (a) providing a multilayer structure that includes a base, a sacrificial layer which is provided on the base and which contains aluminum, and an aluminum layer which is provided on a surface of the sacrificial layer; (b) partially anodizing the aluminum layer to form a porous alumina layer which has a plurality of minute recessed portions; and (c) after step (b), separating the porous alumina layer from the multilayer structure. According to an embodiment of the present invention, a self-supporting anodized film which includes a porous alumina layer can be manufactured more conveniently as compared with the conventional methods.
    Type: Application
    Filed: October 6, 2011
    Publication date: August 15, 2013
    Inventor: Hidekazu Hayashi
  • Publication number: 20130153537
    Abstract: An anodized layer formation method includes: providing an aluminum film provided on a support or an aluminum base; and forming a porous alumina layer which has minute recessed portions by applying a voltage between an anode which is electrically coupled to a surface of the aluminum film or the aluminum base and a cathode which is provided in an electrolytic solution with the surface of the aluminum film or the aluminum base being in contact with the electrolytic solution. The forming of the porous alumina layer includes increasing the voltage to a target value and, before the voltage is increased to the target value, increasing the voltage to a first peak value which is lower than the target value and thereafter decreasing the voltage to a value which is lower than the first peak value. As such, an anodized layer with reduced variation of recessed portions can be formed.
    Type: Application
    Filed: August 22, 2011
    Publication date: June 20, 2013
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Akinobu Isurugi, Kiyoshi Minoura, Hidekazu Hayashi, Kenichiro Nakamatsu
  • Publication number: 20130122706
    Abstract: According to one embodiment, a method of manufacturing of a semiconductor device is provided. In the method, a front surface of a semiconductor substrate and a front surface of a support substrate are bonded to each other by an adhesive. A part of a circumferential part of the support substrate is subjected to water-repellent treatment to thereby form a water-repellent area on the part of the circumferential part in such a manner that the water-repellent area and an end face of the adhesive are in contact with each other. The semiconductor substrate is removed from a rear surface side by wet etching.
    Type: Application
    Filed: March 23, 2012
    Publication date: May 16, 2013
    Inventors: Hisashi OKUCHI, Hidekazu Hayashi, Kentaro Shimayama, Hiroshi Tomita