Patents by Inventor Hideki Yagi

Hideki Yagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210106566
    Abstract: The present invention provides in one embodiment a pharmaceutical composition for treating and/or preventing peripheral neuropathy or spinal cord injury comprising zonisamide or an alkali metal salt thereof as an active ingredient.
    Type: Application
    Filed: October 20, 2020
    Publication date: April 15, 2021
    Applicants: NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY, Sumitomo Dainippon Pharma Co., Ltd.
    Inventors: Kinji OHNO, Naoki ISHIGURO, Bisei OKAWARA, Hideki YAGI, Kyotaro OTA
  • Publication number: 20210098963
    Abstract: A wavelength tunable laser device includes a substrate including silicon, the substrate having a waveguide, a first semiconductor element bonded to the substrate, the first semiconductor element including an active layer of a group III-V compound semiconductor, and a second semiconductor element bonded to the substrate, the second semiconductor element facing to the first semiconductor element in a direction along which light emitted from the first semiconductor element propagates, the second semiconductor element including a grating formed of a group III-V compound semiconductor. The grating selects a wavelength of light.
    Type: Application
    Filed: September 24, 2020
    Publication date: April 1, 2021
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Hideki YAGI
  • Publication number: 20210066117
    Abstract: A method for producing a semiconductor device includes a step of bonding a chip to a SOI wafer, the chip being formed of a III-V group compound semiconductor and including a substrate and a first semiconductor layer; and a step of removing the substrate and the first semiconductor layer from the chip after the step of bonding. In the producing method, the first semiconductor layer has a tensile strain, and the SOI wafer and the chip are heated to a first temperature in the step of bonding, and are cooled to a second temperature lower than the first temperature after the step of bonding.
    Type: Application
    Filed: August 21, 2020
    Publication date: March 4, 2021
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takehiko KIKUCHI, Hideki YAGI, Nobuhiko NISHIYAMA
  • Patent number: 10859766
    Abstract: An optical semiconductor device comprises a semiconductor substrate, an optical 90-degree hybrid circuit provided on the substrate, a plurality of input optical waveguides provided on the substrate, and a plurality of output optical waveguides provided on the substrate. The plurality of input optical waveguides is optically coupled to input ends of the optical 90-degree hybrid circuit. The plurality of output optical waveguides is optically coupled to output ends of the optical 90-degree hybrid circuit. Each of the plurality of input optical waveguides includes a first curving portion and a first straight portion adjacent to the first curving portion, and each of the plurality of output optical waveguides includes a second curving portion. A central axis of the first curving portion is inwardly offset with respect to a central axis of the first straight portion, and a central axis of the second curving portion follows a raised sine curve.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: December 8, 2020
    Assignees: Sumitomo Electric Device Innovations, Inc., Sumitomo Electric Industries, Ltd.
    Inventors: Yoshihiro Yoneda, Takuya Okimoto, Koji Ebihara, Hideki Yagi
  • Patent number: 10823610
    Abstract: A method for fabricating a light receiving device includes: preparing a first substrate product which includes a semiconductor region having a common semiconductor layer, a first semiconductor laminate for a photodiode, a second semiconductor laminate for a waveguide, and a butt-joint between the first semiconductor laminate and the second semiconductor laminate, the first laminate and the second semiconductor laminate being disposed on the common semiconductor layer; etching the first substrate product with a first mask to form a second substrate product having a photodiode mesa structure produced from the first semiconductor laminate and a preliminary mesa structure produced from the second semiconductor laminate; etching the second substrate product with the first mask and a second mask, formed on the photodiode mesa structure; to produce a waveguide mesa structure from the preliminary mesa structure, and the waveguide mesa structure having a height larger than that of the preliminary mesa structure.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: November 3, 2020
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takamitsu Kitamura, Hideki Yagi
  • Publication number: 20200303903
    Abstract: A method for manufacturing an optical semiconductor device, includes the steps of: forming a plurality of compound semiconductor layers including a sacrificial layer, an absorption layer, and a core layer; forming a first mesa from the plurality of compound semiconductor layers; forming an embedding layer that is a semiconductor layer having the first mesa embedded therein; after the step of forming the embedding layer, etching the sacrificial layer to form a chip including the plurality of compound semiconductor layers and the embedding layer; bonding the chip to a substrate comprising silicon and having a waveguide; and etching a portion of the first mesa of the chip bonded to the substrate to form a second mesa adjacent to the first mesa. The second mesa includes the core layer and is optically coupled to the waveguide of the substrate.
    Type: Application
    Filed: February 26, 2020
    Publication date: September 24, 2020
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hideki YAGI, Naoko KONISHI, Takuo HIRATANI
  • Patent number: 10741591
    Abstract: A semiconductor integrated optical device includes: a supporting base including semi-insulating semiconductor; a first photoelectric convertor having first photodiode mesas; a second photoelectric convertor having second photodiode mesas; a first 90° optical hybrid having at least one first multimode waveguide mesa; a second 90° optical hybrid having at least one second multimode waveguide mesa; an optical divider mesa; first and second input waveguide mesas coupling the first and second 90° optical hybrids with the optical divider mesa, respectively; a conductive semiconductor region disposed on the supporting base, the conductive semiconductor region mounting the first photodiode mesas, the second photodiode mesas, the first multimode waveguide mesas, the second multimode waveguide mesas, and the optical divider mesa; a first island semiconductor mesa extending between the first and second multimode waveguide mesas; and a first groove extending through the first island semiconductor mesa and the conductive
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: August 11, 2020
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventors: Hideki Yagi, Naoko Konishi, Koji Ebihara, Takuya Okimoto
  • Publication number: 20200064571
    Abstract: An optical semiconductor device comprises a semiconductor substrate, an optical 90-degree hybrid circuit provided on the substrate, a plurality of input optical waveguides provided on the substrate, and a plurality of output optical waveguides provided on the substrate. The plurality of input optical waveguides is optically coupled to input ends of the optical 90-degree hybrid circuit. The plurality of output optical waveguides is optically coupled to output ends of the optical 90-degree hybrid circuit. Each of the plurality of input optical waveguides includes a first curving portion and a first straight portion adjacent to the first curving portion, and each of the plurality of output optical waveguides includes a second curving portion. A central axis of the first curving portion is inwardly offset with respect to a central axis of the first straight portion, and a central axis of the second curving portion follows a raised sine curve.
    Type: Application
    Filed: August 22, 2019
    Publication date: February 27, 2020
    Applicants: Sumitomo Electric Device Innovations, Inc, Sumitomo Electric Industries, Ltd.
    Inventors: Yoshihiro YONEDA, Takuya OKIMOTO, Koji EBIHARA, Hideki YAGI
  • Patent number: 10545285
    Abstract: A hybrid optical assembly includes: a photonic device having a waveguide structure including group IV semiconductor and oxide; and an optical source device including group III-V semiconductor. The source device is bonded to the photonic device. The source device and the waveguide structure are arranged in a direction of a first axis. The source device has a first semiconductor mesa including an upper core layer and a first upper cladding layer and a second semiconductor mesa including a lower core layer and a second upper cladding layer. The first and second semiconductor mesas extend in a direction of a second axis intersecting the first axis. The second semiconductor mesa has a length larger than that of the first semiconductor mesa. The lower core layer, the second upper cladding layer, and the upper core layer and the first upper cladding layer are arranged in the direction of the first axis.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: January 28, 2020
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hideki Yagi, Naoko Konishi
  • Publication number: 20200002233
    Abstract: Provided is a transparent rare earth aluminum garnet ceramic that has a highlight transmission rate and can be mass produced. The transparent rare earth aluminum garnet ceramic is represented by general formula R3Al5O12 (R is an element selected from the group consisting of rare earth elements having an atomic number of 65 to 71) and includes Si and Y as sintering aids, or is represented by general formula R3Al5O12 (R is an element selected from the group consisting of rare earth elements having an atomic number of 65 to 70) and includes Si and Lu as sintering aids.
    Type: Application
    Filed: September 9, 2019
    Publication date: January 2, 2020
    Inventors: Takagimi YANAGITANI, Hoshiteru NOZAWA, Hideki YAGI
  • Patent number: 10494307
    Abstract: Provided is a transparent rare earth aluminum garnet ceramic that has a high light transmission rate and can be mass produced. The transparent rare earth aluminum garnet ceramic is represented by general formula R3Al5O12 (R is an element selected from the group consisting of rare earth elements having an atomic number of 65 to 71) and comprises Si and Y as sintering aids, or is represented by general formula R3Al5O12 (R is an element selected from the group consisting of rare earth elements having an atomic number of 65 to 70) and comprises Si and Lu as sintering aids.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: December 3, 2019
    Assignee: Konoshima Chemical Co., Ltd.
    Inventors: Takagimi Yanagitani, Hoshiteru Nozawa, Hideki Yagi
  • Patent number: 10457053
    Abstract: A printer includes a first ink head including first nozzles arranged in a sub-scanning direction and a first nozzle surface on which the first nozzles are disposed, a second ink head disposed at a side of the first ink head in a main scanning direction and including second nozzles arranged in the sub-scanning direction and disposed partially at a position identical to a position of a portion of the first nozzles in the sub-scanning direction and a second nozzle surface on which the second nozzles are disposed, a first wiper that wipes the first nozzle surface at a first wiping position, and a second wiper that wipes the second nozzle surface at a second wiping position.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: October 29, 2019
    Assignee: ROLAND DG CORPORATION
    Inventors: Hiroshi Okuno, Hideki Yagi
  • Patent number: 10444851
    Abstract: The layout of character keys each having a plurality of characters allocated thereto is established on a virtual surface (first layer) including a detection position of a gesture that satisfies predetermined conditions, and when a gesture moving along the first layer is detected, a selection position with respect to the layout of character keys is moved in accordance with the gesture movement. When the movement direction of the gesture is switched to a direction away from the first layer under the condition that a prescribed character key in the layout is selected, each character allocated to the character key being selected is arranged outside the first layer at individually different positions relative to a virtual axis passing through the character key. Thereafter, in response to detection of a gesture moving toward any character, a character disposed at a moving destination is selected as an input character.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: October 15, 2019
    Assignee: OMRON CORPORATION
    Inventor: Hideki Yagi
  • Publication number: 20190267412
    Abstract: A semiconductor integrated optical device includes: a supporting base including semi-insulating semiconductor; a first photoelectric convertor having first photodiode mesas; a second photoelectric convertor having second photodiode mesas; a first 90° optical hybrid having at least one first multimode waveguide mesa; a second 90° optical hybrid having at least one second multimode waveguide mesa; an optical divider mesa; first and second input waveguide mesas coupling the first and second 90° optical hybrids with the optical divider mesa, respectively; a conductive semiconductor region disposed on the supporting base, the conductive semiconductor region mounting the first photodiode mesas, the second photodiode mesas, the first multimode waveguide mesas, the second multimode waveguide mesas, and the optical divider mesa; a first island semiconductor mesa extending between the first and second multimode waveguide mesas; and a first groove extending through the first island semiconductor mesa and the conductive
    Type: Application
    Filed: February 22, 2019
    Publication date: August 29, 2019
    Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventors: Hideki Yagi, Naoko Konishi, Koji Ebihara, Takuya Okimoto
  • Patent number: 10391799
    Abstract: A drive signal generator of an inkjet printer includes a first electronic component that generates a greater amount of heat than a second electronic component. A heat sink includes wall members and first and second ends. The wall members include first and second wall members having an outer wall. The heat sink has a tubular shape defined by the wall members and is open at the first and second ends. A portion of a cooling fan faces the first end of the heat sink, and another portion of the cooling fan protrudes at least from the first end toward the first wall member. The first electronic component is in contact with the outer wall of the first wall member, and the second electronic component is in contact with the outer wall of the second wall member.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: August 27, 2019
    Assignee: ROLAND DG CORPORATION
    Inventors: Ryota Sago, Sachie Muroga, Eiji Hanba, Hironobu Suzuki, Hideki Yagi
  • Publication number: 20190250328
    Abstract: A hybrid optical assembly includes: a photonic device having a waveguide structure including group IV semiconductor and oxide; and an optical source device including group III-V semiconductor. The source device is bonded to the photonic device. The source device and the waveguide structure are arranged in a direction of a first axis. The source device has a first semiconductor mesa including an upper core layer and a first upper cladding layer and a second semiconductor mesa including a lower core layer and a second upper cladding layer. The first and second semiconductor mesas extend in a direction of a second axis intersecting the first axis. The second semiconductor mesa has a length larger than that of the first semiconductor mesa. The lower core layer, the second upper cladding layer, and the upper core layer and the first upper cladding layer are arranged in the direction of the first axis.
    Type: Application
    Filed: February 8, 2019
    Publication date: August 15, 2019
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hideki YAGI, Naoko KONISHI
  • Publication number: 20190030899
    Abstract: A printer includes a first ink head including first nozzles arranged in a sub-scanning direction and a first nozzle surface on which the first nozzles are disposed, a second ink head disposed at a side of the first ink head in a main scanning direction and including second nozzles arranged in the sub-scanning direction and disposed partially at a position identical to a position of a portion of the first nozzles in the sub-scanning direction and a second nozzle surface on which the second nozzles are disposed, a first wiper that wipes the first nozzle surface at a first wiping position, and a second wiper that wipes the second nozzle surface at a second wiping position.
    Type: Application
    Filed: July 23, 2018
    Publication date: January 31, 2019
    Inventors: Hiroshi OKUNO, Hideki YAGI
  • Publication number: 20190003884
    Abstract: A method for fabricating a light receiving device includes: preparing a first substrate product which includes a semiconductor region having a common semiconductor layer, a first semiconductor laminate for a photodiode, a second semiconductor laminate for a waveguide, and a butt-joint between the first semiconductor laminate and the second semiconductor laminate, the first laminate and the second semiconductor laminate being disposed on the common semiconductor layer; etching the first substrate product with a first mask to form a second substrate product having a photodiode mesa structure produced from the first semiconductor laminate and a preliminary mesa structure produced from the second semiconductor laminate; etching the second substrate product with the first mask and a second mask, formed on the photodiode mesa structure; to produce a waveguide mesa structure from the preliminary mesa structure, and the waveguide mesa structure having a height larger than that of the preliminary mesa structure.
    Type: Application
    Filed: July 3, 2018
    Publication date: January 3, 2019
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takamitsu KITAMURA, Hideki Yagi
  • Publication number: 20180361765
    Abstract: A drive signal generator of an inkjet printer includes a first electronic component that generates a greater amount of heat than a second electronic component. A heat sink includes wall members and first and second ends. The wall members include first and second wall members having an outer wall. The heat sink has a tubular shape defined by the wall members and is open at the first and second ends. A portion of a cooling fan faces the first end of the heat sink, and another portion of the cooling fan protrudes at least from the first end toward the first wall member. The first electronic component is in contact with the outer wall of the first wall member, and the second electronic component is in contact with the outer wall of the second wall member.
    Type: Application
    Filed: June 13, 2018
    Publication date: December 20, 2018
    Inventors: Ryota SAGO, Sachie MUROGA, Eiji HANBA, Hironobu SUZUKI, Hideki YAGI
  • Patent number: 10149940
    Abstract: A connector which is detachably connected to a cylindrical section is prevented from unintentionally disconnecting and breaking. The connector has inner and outer cylinder members. The inner cylinder member has an engagement plate protruding from the inner peripheral surface of an inner cylinder body and engaging with a recess formed in the outer peripheral surface of the cylindrical section, and also has slits arranged radially and extending from the engagement plate to a part of the inner cylinder body. The engagement between the recess and the engagement plate restricts the axial movement of the inner cylinder member relative to the cylindrical section. When the outer cylinder member is mounted on the inner cylinder member, the inner peripheral surface of the outer cylinder member is in contact with the outer peripheral surface of the inner cylinder member, and the displacement of the engagement plate in the diameter expansion direction is restricted.
    Type: Grant
    Filed: July 9, 2013
    Date of Patent: December 11, 2018
    Assignee: NIPRO CORPORATION
    Inventors: Hideki Yagi, Naoaki Yasumura