Abstract: A data processing system in which application nodes capable of executing a program are provided at sites at a plurality of locations, and storage nodes for storing data are also provided at the plurality of locations, with these locations being coupled to one another via a network, wherein: a first application node stores a program I/O history; a second application node reproduces I/O events on the basis of the I/O history, thereby estimating data processing performance; and the first application node determines, on the basis of the data processing performance estimation, whether or not to transfer the program to the second application node.

Abstract: A semiconductor device includes a wiring substrate, a first semiconductor element, a second semiconductor element, a bump, a bonding portion, and a resin portion. The second semiconductor element is between the wiring substrate and the first semiconductor element. The bump is between the first and second semiconductor elements and electrically connects the first and second semiconductor elements. The bonding portion is between the first and second semiconductor elements, bonds the first semiconductor element to the second semiconductor element, and has a first elastic modulus. The resin portion has a second elastic modulus higher than the first elastic modulus. The resin portion is between the first and second semiconductor elements. The first semiconductor element is between a second portion of the resin portion and the wiring substrate. A third portion of the resin portion is overlapped with the first and second semiconductor elements.

Abstract: A semiconductor device includes a wiring substrate, a first semiconductor element, a second semiconductor element, a bump, a bonding portion, and a resin portion. The second semiconductor element is between the wiring substrate and the first semiconductor element. The bump is between the first and second semiconductor elements and electrically connects the first and second semiconductor elements. The bonding portion is between the first and second semiconductor elements, bonds the first semiconductor element to the second semiconductor element, and has a first elastic modulus. The resin portion has a second elastic modulus higher than the first elastic modulus. The resin portion is between the first and second semiconductor elements. The first semiconductor element is between a second portion of the resin portion and the wiring substrate. A third portion of the resin portion is overlapped with the first and second semiconductor elements.

Abstract: A computer for executing processing through use of a database, the computer comprising: a processor including a cache memory; and a non-volatile memory coupled to the processor, the non-volatile memory having the database constructed thereon. The computer comprises: a database management module configured to execute processing on the database; and a write processing module configured to write data stored in the cache memory into the database. The write processing module writes data that is operated in the transaction processing into the database among data stored in the cache memory, in a case of receiving a commit request for transaction processing that uses the database.

Abstract: An index tree search method, by a computer, for searching an index tree included in a database provided by the computer which includes processors executing a plurality of threads and a memory, the index tree search method comprising: a first step of allocating, by the computer, search ranges in the index tree to the plurality of threads; a second step of receiving, by the computer, a search key; a third step of selecting, by the computer, a thread corresponding to the received search key; and a fourth step of searching, by the computer, the index tree with the selected thread using the received search key.

Abstract: A light emitting device includes a first lead frame having a top surface including a first region and a second region, a first metal layer disposed on the first region of the top surface, a reflector layer in contact with the second region of the top surface, a light emitting element mounted on the first metal layer and electrically connected to the first lead frame, and a transparent resin layer covering the light emitting element and in contact with the first metal layer.

Abstract: According to one embodiment, a semiconductor module has a substrate, two nonvolatile memories disposed on a first surface of the substrate, a controller to control the nonvolatile memories, disposed on the first surface of the substrate and between the two nonvolatile memories, and a plurality of terminals that are electrically connected to the two nonvolatile memories and to the controller, disposed on a second surface of the substrate.

Abstract: According to one embodiment, a semiconductor module includes a substrate, which has a first surface and a second surface opposite to the first surface, a controller device and a memory device formed on the first surface, and a metal plate bonded on the second surface. The metal plate is formed at least at a portion of the second surface corresponding to the controller device so that heat generated at the controller device conducts away from the memory device.

Abstract: According to one embodiment, a semiconductor module includes a substrate, which has a first surface and a second surface opposite to the first surface, a controller device and a memory device formed on the first surface, and a metal plate bonded on the second surface. The metal plate is formed at least at a portion of the second surface corresponding to the controller device so that heat generated at the controller device conducts away from the memory device.

Abstract: According to one embodiment, a semiconductor module has a substrate, two nonvolatile memories disposed on a first surface of the substrate, a controller to control the nonvolatile memories, disposed on the first surface of the substrate and between the two nonvolatile memories, and a plurality of terminals that are electrically connected to the two nonvolatile memories and to the controller, disposed on a second surface of the substrate.

Abstract: An image forming apparatus includes a recording head to eject ink droplets through a nozzle onto a recording medium, a replaceable ink cartridge to contain ink to be supplied to the recording head, a replaceable waste-ink tank to store waste ink ejected from the recording head, a cartridge mounting portion provided on a front side of the image forming apparatus and configured to accommodate the ink cartridge, including a first opening through which the ink cartridge is inserted, a tank mounting portion provided on the front side of the image forming apparatus, adjacent to the cartridge mounting portion, and configured to accommodate the waste-ink tank and to include a second opening through which the waste-ink tank is inserted, and an openably closable cartridge cover disposed on the front side of the image forming apparatus, configured to cover both the first opening and the second opening.

Abstract: An image forming apparatus is disclosed that includes a substantially flat top face and a slanted front face, the bottom side of which recedes backward. The image forming apparatus may includes a paper discharge tray disposed at a lower portion of the slanted front face, the paper discharge tray protruding forward. The paper discharge tray may be tiltable upward and downward. Because the bottom side of the slanted front face recedes backward, the flat top face can be provided, and simultaneously, enough space for the feeding and discharging of paper can be secured.

Abstract: According to a manufacturing method of one embodiment, a first solder bump and a second solder bump are aligned and placed in contact with each other, and thereafter, the first and second solder bumps are heated to a temperature equal or higher than a melting point of the solder bumps and melted, whereby a partially connection body of the first solder bump and the second solder bump is formed. The partially connection body is cooled. The cooled partially connection body is heated to a temperature equal to or higher than the melting point of the solder bump in a reducing atmosphere, thereby to form a permanent connection body by melting the partially connection body while removing an oxide film existing on a surface of the partially connection body.

Abstract: Disclosed are a powdery processing aid for polyolefin resins, containing an alkyl methacrylate polymer which has alkyl methacrylate units having an alkyl group with 2 to 6 carbon atoms as a main component and has a mass average molecular weight of 150,000 to 20,000,000, having good handling properties as a powder, having good dispersibility in polyolefin resins, and being able to improve shaping processability of polyolefin resins; and a polyolefin resin composition having improved shaping processability, which contains a powdery processing aid for polyolefin resins and a polyolefin resin.

Abstract: According to one mode of the present invention, metal-containing resin particles composed of a resin containing 50 wt % or more of a thermosetting resin and having a ratio of weight of absorbed moisture to weight of resin from 500 to 14500 ppm, and fine metal particles contained in said resin, is provided.

Abstract: In one embodiment, a first substrate having first solder bumps and a second substrate having second solder bumps are stacked while temporarily tacking the solder bumps to each other, and then a stack is disposed inside a furnace. The gas in the furnace is exhausted to be in a reduced pressure atmosphere, and then a carboxylic acid gas is introduced into the furnace. While increasing a temperature inside the furnace where the carboxylic acid gas is introduced, the gas in the furnace is exhausted to be in a reduced pressure atmosphere at a temperature in a range from a reduction temperature of oxide films by the carboxylic acid gas to lower than a melting temperature of the solder bumps. By increasing the temperature inside the furnace up to a temperature in a range of the melting temperature of the solder bumps and higher, the first solder bumps and the second solder bumps are melted and joined.

Abstract: An image forming apparatus is disclosed that includes a substantially flat top face and a slanted front face, the bottom side of which recedes backward. The image forming apparatus may includes a paper discharge tray disposed at a lower portion of the slanted front face, the paper discharge tray protruding forward. The paper discharge tray may be tiltable upward and downward. Because the bottom side of the slanted front face recedes backward, the flat top face can be provided, and simultaneously, enough space for the feeding and discharging of paper can be secured.

Abstract: In a semiconductor integrated circuit device having plural layers of buried wirings, it is intended to prevent the occurrence of a discontinuity caused by stress migration at an interface between a plug connected at a bottom thereof to a buried wiring and the buried wiring. For example, in the case where the width of a first Cu wiring is not smaller than about 0.9 ?m and is smaller than about 1.44 ?m, and the width of a second Cu wiring and the diameter of a plug are about 0.18 ?m, there are arranged two or more plugs which connect the first wirings and the second Cu wirings electrically with each other.

Abstract: In one embodiment, a semiconductor device includes a circuit substrate, and first and second semiconductor chips mounted on it. The first semiconductor chip and the second semiconductor chip are flip-chip connected, and an underfill resin is filled between them. The underfill resin has a fillet portion. A thickness T1 of the first semiconductor chip and a thickness T2 of the second semiconductor chip satisfy a relationship of T1/(T1+T2)?0.6.

Abstract: An image forming apparatus is disclosed that includes a substantially flat top face and a slanted front face, the bottom side of which recedes backward. The image forming apparatus may includes a paper discharge tray disposed at a lower portion of the slanted front face, the paper discharge tray protruding forward. The paper discharge tray may be tiltable upward and downward. Because the bottom side of the slanted front face recedes backward, the flat top face can be provided, and simultaneously, enough space for the feeding and discharging of paper can be secured.