Patents by Inventor Hideo Sakai
Hideo Sakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230311381Abstract: By using a forming die having a fixed die and a movable die moving along a parting surface on the fixed die and by moving the movable die along the parting surface, to press and hold a sintered part between the movable die and the fixed die, to form a cavity around the sintered part except parts which abut on the fixed die and the movable die by the forming die, and to fill the cavity with melted material which becomes an exterior part, so that the sintered part and the exterior part are integrated by insert molding.Type: ApplicationFiled: June 6, 2023Publication date: October 5, 2023Applicant: DIAMET CORPORATIONInventors: Shinichi Takezoe, Tsuneo Maruyama, Hideo Sakai
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Publication number: 20230241601Abstract: A biochip is described having a substrate that has disposed on a surface at least one spot containing a complex between a solid carrier modified by a reactive group and a substance to be immobilized that has been modified via a spacer by a group that reacts with the reactive group. A method for producing the biochip and a method for detecting a target substance using the biochip are also described.Type: ApplicationFiled: September 6, 2021Publication date: August 3, 2023Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Erika SAWANO, Yuki TAKASE, Haruka SAKAI, Hideo TASHIRO, Tomoko TASHIRO
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Patent number: 11694296Abstract: An information processing device includes a processor configured to detect whether or not a vehicle that is about to use a facility is under share ride by a plurality of persons, and permit the vehicle to use the facility or providing an economic merit associated with usage of the facility to the vehicle, when having detected that the vehicle is under share ride.Type: GrantFiled: June 27, 2019Date of Patent: July 4, 2023Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Shinichi Okabe, Hiroaki Sakurai, Kazuaki Takemura, Kengo Takeuchi, Kaori Sakai, Hideo Hasegawa
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Publication number: 20230033850Abstract: By using a forming die having a fixed die and a movable die moving along a parting surface on the fixed die and by moving the movable die along the parting surface, to press and hold a sintered part between the movable die and the fixed die, to form a cavity around the sintered part except parts which abut on the fixed die and the movable die by the forming die, and to fill the cavity with melted material which becomes an exterior part, so that the sintered part and the exterior part are integrated by insert molding.Type: ApplicationFiled: January 25, 2021Publication date: February 2, 2023Applicant: DIAMET CORPORATIONInventors: Shinichi Takezoe, Tsuneo Maruyama, Hideo Sakai
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Patent number: 11498127Abstract: A die having a cavity and a lower punch fitted into the cavity. The cavity is divided and the parts slide along a division plane passing through the cavity parallel to the fitting direction of the die and the lower punch. The divided cavity parts are placed in a state of alignment along the division plane. The divided cavity parts are each filled with raw material powder. The die and the lower punch are then slid along the division plane, whereby the divided cavity parts are combined as the original cavity. The raw material powder in the cavity in a combined state is compressed by an upper punch and the lower punch.Type: GrantFiled: August 10, 2017Date of Patent: November 15, 2022Assignee: DIAMET CORPORATIONInventors: Tsuneo Maruyama, Shinichi Takezoe, Hideo Sakai
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Patent number: 11446737Abstract: The molding die of the invention includes: a first die having a through-hole; a second die inserted into the through-hole and capable of moving relative to the first die; and a first punch and a second punch each insertable into the through-hole. A cavity surrounded by the second die, the first punch, and the second punch to compression-mold a molding object is formed in the through-hole. An undercut molding part is formed in the surface of the second die facing the cavity. The second die is formed so as to be splittable into two or more split bodies.Type: GrantFiled: August 15, 2017Date of Patent: September 20, 2022Assignee: Diamet CorporationInventors: Tsuneo Maruyama, Yoshiki Tamura, Hideo Sakai
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Publication number: 20220001446Abstract: A sintered component forming step is for forming a sintered component by powder molding. An insert forming step is for forming a sintered insert component in which an exterior component is integrated on an outer peripheral portion of the sintered component. One or more grooves or ridges are formed on an outer peripheral portion of a region except for one end portion of the sintered component in the sintered component forming step. The insert forming step includes a step for bringing the outer peripheral portion of the end portion into contact with an inner peripheral surface of an insert forming mold along a circumferential direction and covering the one or more grooves or ridges by the insert forming mold with an interval to form a cavity on an outer peripheral portion of the sintered component and a step for filling a melted material in the cavity.Type: ApplicationFiled: February 21, 2020Publication date: January 6, 2022Applicant: DIAMET CORPORATIONInventors: Tsuneo Maruyama, Shinichi Takezoe, Hideo Sakai
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Patent number: 10908595Abstract: A device includes a catalog storage unit that stores a catalog having versatility; a catalog control unit that specifies the catalog corresponding to a target machine tool to be subjected to state determination based on machine tool information including an item of facility type and acquires the catalog from the catalog storage unit; a feature quantity extraction unit that extracts a feature quantity from sensor data detected from the target machine tool; a sensor data processing unit that performs state determination of the target machine tool based on the feature quantity distribution included in the acquired catalog and the feature quantity extracted from the sensor data; a feature quantity tuning unit that performs tuning of the feature quantity distribution by mapping the extracted feature quantity to the feature quantity distribution; and a catalog updating unit that updates the catalog based on the feature quantity distribution after tuning.Type: GrantFiled: April 26, 2019Date of Patent: February 2, 2021Assignee: Hitachi, Ltd.Inventors: Yuichi Sakurai, Masaaki Maeda, Masayoshi Takahashi, Hideo Sakai
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Patent number: 10845794Abstract: A state identification device includes: a feature amount extraction unit that extracts a feature amount from physical data of a machine tool unit which shifts to a plurality of operation states; a feature amount storage unit in which a region is provided as a storage destination of the extracted feature amount for each of the plurality of operation states to which the machine tool unit shifts; a similarity calculation unit that calculates a similarity between the extracted feature amount and a feature amount stored in the feature amount storage unit; a state determination unit that determines an operation state of the machine tool unit based on the calculated similarity; and a storage destination determination unit that determines the region serving as the storage destination of the extracted feature amount based on a determination result of the state determination unit.Type: GrantFiled: April 12, 2019Date of Patent: November 24, 2020Assignee: HITACHI, LTD.Inventors: Hideo Sakai, Masaaki Maeda, Yuichi Sakurai, Masayoshi Takahashi
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Patent number: 10843264Abstract: A molding die includes a first die having a through-hole; a second die inserted into the through-hole and configured to be movable relative to the first die; and first and second punches configured to be insertable into the through-hole, wherein an undercut molding part is provided on the second die, and a molding target is compression-molded in a cavity surrounded by inner side walls of the through-hole, the second die, the first punch, and the second punch.Type: GrantFiled: March 3, 2017Date of Patent: November 24, 2020Assignee: Diamet CorporationInventors: Tsuneo Maruyama, Yoshiki Tamura, Hideo Sakai
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Patent number: 10731704Abstract: The oil-impregnated sintered bearing of the present invention is an oil-impregnated sintered bearing having a Fe—Cu-based sintered body being impregnated with, a bearing hole being formed in the Fe—Cu-based sintered body and configured to be penetrated by and support a rotating shaft, in which an inner circumferential surface of the bearing hole includes a first region forming a central portion in a shaft direction, a second region from a first end portion of the first region to a first opening of the bearing hole, and a third region from a second end portion of the first region to a second opening of the bearing hole, and an area ratio of the Cu phase of the second region in a center along the shaft direction is 80% or more and 100% or less of an area ratio of the Cu phase of the third region in a center along the shaft direction.Type: GrantFiled: October 18, 2017Date of Patent: August 4, 2020Assignee: Diamet CorporationInventors: Yoshiki Tamura, Hideo Sakai, Osamu Sakai
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Publication number: 20200049198Abstract: The oil-impregnated sintered bearing of the present invention is an oil-impregnated sintered bearing having a Fe—Cu-based sintered body being impregnated with, a bearing hole being formed in the Fe—Cu-based sintered body and configured to be penetrated by and support a rotating shaft, in which an inner circumferential surface of the bearing hole includes a first region forming a central portion in a shaft direction, a second region from a first end portion of the first region to a first opening of the bearing hole, and a third region from a second end portion of the first region to a second opening of the bearing hole, and an area ratio of the Cu phase of the second region in a center along the shaft direction is 80% or more and 100% or less of an area ratio of the Cu phase of the third region in a center along the shaft direction.Type: ApplicationFiled: October 18, 2017Publication date: February 13, 2020Applicant: Diamet CorporationInventors: Yoshiki TAMURA, Hideo SAKAI, Osamu SAKAI
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Publication number: 20190384268Abstract: A device includes a catalog storage unit that stores a catalog having versatility; a catalog control unit that specifies the catalog corresponding to a target machine tool to be subjected to state determination based on machine tool information including an item of facility type and acquires the catalog from the catalog storage unit; a feature quantity extraction unit that extracts a feature quantity from sensor data detected from the target machine tool; a sensor data processing unit that performs state determination of the target machine tool based on the feature quantity distribution included in the acquired catalog and the feature quantity extracted from the sensor data; a feature quantity tuning unit that performs tuning of the feature quantity distribution by mapping the extracted feature quantity to the feature quantity distribution; and a catalog updating unit that updates the catalog based on the feature quantity distribution after tuning.Type: ApplicationFiled: April 26, 2019Publication date: December 19, 2019Inventors: Yuichi SAKURAI, Masaaki Maeda, Masayoshi Takahashi, Hideo Sakai
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Publication number: 20190344349Abstract: The molding die of the invention includes: a first die having a through-hole; a second die inserted into the through-hole and capable of moving relative to the first die; and a first punch and a second punch each insertable into the through-hole. A cavity surrounded by the second die, the first punch, and the second punch to compression-mold a molding object is formed in the through-hole. An undercut molding part is formed in the surface of the second die facing the cavity. The second die is formed so as to be splittable into two or more split bodies.Type: ApplicationFiled: August 15, 2017Publication date: November 14, 2019Applicant: Diamet CorporationInventors: Tsuneo MARUYAMA, Yoshiki TAMURA, Hideo SAKAI
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Publication number: 20190324428Abstract: A state identification device includes: a feature amount extraction unit that extracts a feature amount from physical data of a machine tool unit which shifts to a plurality of operation states; a feature amount storage unit in which a region is provided as a storage destination of the extracted feature amount for each of the plurality of operation states to which the machine tool unit shifts; a similarity calculation unit that calculates a similarity between the extracted feature amount and a feature amount stored in the feature amount storage unit; a state determination unit that determines an operation state of the machine tool unit based on the calculated similarity; and a storage destination determination unit that determines the region serving as the storage destination of the extracted feature amount based on a determination result of the state determination unit.Type: ApplicationFiled: April 12, 2019Publication date: October 24, 2019Applicant: HITACHI, LTD.Inventors: Hideo SAKAI, Masaaki MAEDA, Yuichi SAKURAI, Masayoshi TAKAHASHI
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Publication number: 20190232374Abstract: A die having a cavity and a lower punch fitted into the cavity. The cavity is divided and the parts slide along a division plane passing through the cavity parallel to the fitting direction of the die and the lower punch. The divided cavity parts are placed in a state of alignment along the division plane. The divided cavity parts are each filled with raw material powder. The die and the lower punch are then slid along the division plane, whereby the divided cavity parts are combined as the original cavity. The raw material powder in the cavity in a combined state is compressed by an upper punch and the lower punch.Type: ApplicationFiled: August 10, 2017Publication date: August 1, 2019Applicant: DIAMET CORPORATIONInventors: Tsuneo MARUYAMA, Shinich TAKEZOE, Hideo SAKAI
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Publication number: 20190091767Abstract: A molding die includes a first die having a through-hole; a second die inserted into the through-hole and configured to be movable relative to the first die; and first and second punches configured to be insertable into the through-hole, wherein an undercut molding part is provided on the second die, and a molding target is compression-molded in a cavity surrounded by inner side walls of the through-hole, the second die, the first punch, and the second punch.Type: ApplicationFiled: March 3, 2017Publication date: March 28, 2019Applicant: Diamet CorporationInventors: Tsuneo MARUYAMA, Yoshiki TAMURA, Hideo SAKAI
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Patent number: 10184790Abstract: The presently disclosed subject matter provides a pattern measurement method and device for achieving highly accurate measurement in the depth direction of a pattern. The method involves a focused ion beam irradiated to form an inclined surface in a sample area; a field of view of a SEM set to include the boundary between the inclined surface and a sample surface; and an image of the field of view obtained on the basis of a detection signal. Such an acquired image is used to specify a first position, the boundary between inclined surface and non-inclined surface, and a second position, the position of a desired deep hole or deep groove positioned within the inclined surface. The pattern dimension in a height direction is determined on the basis of the distance in the sample surface direction between the first position and second position and the angle of the inclined surface.Type: GrantFiled: May 11, 2015Date of Patent: January 22, 2019Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Hiroki Kawada, Hideo Sakai, Katsuhiro Sasada
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Patent number: 9934940Abstract: There is provided a control device for controlling a charged particle beam apparatus, wherein the beam apparatus comprises a workpiece stage having at least two turning axes which are not parallel to each other and an irradiation unit, and the control device comprises an angle calculation unit that based on a direction of a first processing in which a processed surface having a normal line not parallel to any of the turning axes is generated in the workpiece by the irradiation unit and a direction of a second processing to be processed by the irradiation unit from a direction different from the direction of the first processing with respect to the processed surface to be generated by the first processing, calculates turning angles about the turning axes that changes the direction of the stage from the direction of the first processing to the direction of the second processing.Type: GrantFiled: March 24, 2017Date of Patent: April 3, 2018Assignee: Hitachi High-Tech Science CorporationInventors: Satoshi Tomimatsu, Tsuyoshi Oonishi, Hiroki Kawada, Hideo Sakai
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Publication number: 20170278673Abstract: There is provided a control device for controlling a charged particle beam apparatus, wherein the beam apparatus comprises a workpiece stage having at least two turning axes which are not parallel to each other and an irradiation unit, and the control device comprises an angle calculation unit that based on a direction of a first processing in which a processed surface having a normal line not parallel to any of the turning axes is generated in the workpiece by the irradiation unit and a direction of a second processing to be processed by the irradiation unit from a direction different from the direction of the first processing with respect to the processed surface to be generated by the first processing, calculates turning angles about the turning axes that changes the direction of the stage from the direction of the first processing to the direction of the second processing.Type: ApplicationFiled: March 24, 2017Publication date: September 28, 2017Applicant: HITACHI HIGH-TECH SCIENCE CORPORATIONInventors: Satoshi Tomimatsu, Tsuyoshi Oonishi, Hiroki Kawada, Hideo Sakai