Patents by Inventor Hideo Sakai
Hideo Sakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9186771Abstract: In a magnetic disk glass substrate manufacturing method, a main surface of a glass substrate is polished using a polishing liquid containing colloidal silica abrasive particles as polishing abrasive particles and a surface plate with a polishing pad, then the glass substrate is brought into contact with a liquid containing a coagulant so that the colloidal silica abrasive particles are coagulated, and then the colloidal silica abrasive particles coagulated are removed.Type: GrantFiled: March 30, 2012Date of Patent: November 17, 2015Assignee: HOYA CORPORATIONInventors: Hideo Sakai, Yosuke Suzuki, Yoshihiro Tawara
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Patent number: 9183868Abstract: A method of manufacturing a glass substrate for a magnetic disk includes a polishing step of polishing a main surface of a glass substrate by sandwiching the glass substrate between a pair of surface plates each having a polishing pad on its surface and by supplying a polishing liquid containing polishing abrasive particles between the glass substrate and the polishing pads. In the polishing step, the polishing liquid and each polishing pad are adjusted so that the friction coefficient falls in a range of 0.02 to 0.05.Type: GrantFiled: January 26, 2012Date of Patent: November 10, 2015Assignee: HOYA CORPORATIONInventors: Hideo Sakai, Yoshihiro Tawara
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Patent number: 8655050Abstract: Although there has been a method for evaluating pattern shapes of electronic devices by using, as a reference pattern, design data or a non-defective pattern, the conventional method has a problem that the pattern shape cannot be evaluated with high accuracy because of the difficulty in defining an exact shape suitable for the manufacturing conditions of the electronic devices. The present invention provides a shape evaluation method for circuit patterns of electronic devices, the method including a means for generating contour distribution data of at least two circuit patterns from contour data sets on the circuit patterns; a means for generating a reference pattern used for the pattern shape evaluation, from the contour distribution data; and a means for evaluating the pattern shape by comparing each evaluation target pattern with the reference pattern.Type: GrantFiled: August 5, 2013Date of Patent: February 18, 2014Assignee: Hitachi High-Technologies CorporationInventors: Yasutaka Toyoda, Hideo Sakai, Ryoichi Matsuoka
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Publication number: 20130315468Abstract: Although there has been a method for evaluating pattern shapes of electronic devices by using, as a reference pattern, design data or a non-defective pattern, the conventional method has a problem that the pattern shape cannot be evaluated with high accuracy because of the difficulty in defining an exact shape suitable for the manufacturing conditions of the electronic devices. The present invention provides a shape evaluation method for circuit patterns of electronic devices, the method including a means for generating contour distribution data of at least two circuit patterns from contour data sets on the circuit patterns; a means for generating a reference pattern used for the pattern shape evaluation, from the contour distribution data; and a means for evaluating the pattern shape by comparing each evaluation target pattern with the reference pattern.Type: ApplicationFiled: August 5, 2013Publication date: November 28, 2013Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Yasutaka TOYODA, Hideo SAKAI, Ryoichi MATSUOKA
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Patent number: 8515155Abstract: Although there has been a method for evaluating pattern shapes of electronic devices by using, as a reference pattern, design data or a non-defective pattern, the conventional method has a problem that the pattern shape cannot be evaluated with high accuracy because of the difficulty in defining an exact shape suitable for the manufacturing conditions of the electronic devices. The present invention provides a shape evaluation method for circuit patterns of electronic devices, the method including a means for generating contour distribution data of at least two circuit patterns from contour data sets on the circuit patterns; a means for generating a reference pattern used for the pattern shape evaluation, from the contour distribution data; and a means for evaluating the pattern shape by comparing each evaluation target pattern with the reference pattern.Type: GrantFiled: January 25, 2013Date of Patent: August 20, 2013Assignee: Hitachi High-Technologies CorporationInventors: Yasutaka Toyoda, Hideo Sakai, Ryoichi Matsuoka
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Patent number: 8363923Abstract: Although there has been a method for evaluating pattern shapes of electronic devices by using, as a reference pattern, design data or a non-defective pattern, the conventional method has a problem that the pattern shape cannot be evaluated with high accuracy because of the difficulty in defining an exact shape suitable for the manufacturing conditions of the electronic devices. The present invention provides a shape evaluation method for circuit patterns of electronic devices, the method including a means for generating contour distribution data of at least two circuit patterns from contour data sets on the circuit patterns; a means for generating a reference pattern used for the pattern shape evaluation, from the contour distribution data; and a means for evaluating the pattern shape by comparing each evaluation target pattern with the reference pattern.Type: GrantFiled: November 11, 2011Date of Patent: January 29, 2013Assignee: Hitachi High-Technologies CorporationInventors: Yasutaka Toyoda, Hideo Sakai, Ryoichi Matsuoka
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Publication number: 20120251711Abstract: In a magnetic disk glass substrate manufacturing method, a main surface of a glass substrate is polished using a polishing liquid containing colloidal silica abrasive particles as polishing abrasive particles and a surface plate with a polishing pad, then the glass substrate is brought into contact with a liquid containing a coagulant so that the colloidal silica abrasive particles are coagulated, and then the colloidal silica abrasive particles coagulated are removed.Type: ApplicationFiled: March 30, 2012Publication date: October 4, 2012Applicant: HOYA CORPORATIONInventors: Hideo SAKAI, Yosuke SUZUKI, Yoshihiro TAWARA
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Publication number: 20120196033Abstract: A method of manufacturing a glass substrate for a magnetic disk includes a polishing step of polishing a main surface of a glass substrate by sandwiching the glass substrate between a pair of surface plates each having a polishing pad on its surface and by supplying a polishing liquid containing polishing abrasive particles between the glass substrate and the polishing pads. In the polishing step, the polishing liquid and each polishing pad are adjusted so that the friction coefficient falls in a range of 0.02 to 0.05.Type: ApplicationFiled: January 26, 2012Publication date: August 2, 2012Applicant: HOYA CORPORATIONInventors: Hideo SAKAI, Yoshihiro TAWARA
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Publication number: 20120057774Abstract: Although there has been a method for evaluating pattern shapes of electronic devices by using, as a reference pattern, design data or a non-defective pattern, the conventional method has a problem that the pattern shape cannot be evaluated with high accuracy because of the difficulty in defining an exact shape suitable for the manufacturing conditions of the electronic devices. The present invention provides a shape evaluation method for circuit patterns of electronic devices, the method including a means for generating contour distribution data of at least two circuit patterns from contour data sets on the circuit patterns; a means for generating a reference pattern used for the pattern shape evaluation, from the contour distribution data; and a means for evaluating the pattern shape by comparing each evaluation target pattern with the reference pattern.Type: ApplicationFiled: November 11, 2011Publication date: March 8, 2012Applicant: Hitachi High-Technologies CorporationInventors: Yasutaka TOYODA, Hideo Sakai, Ryoichi Matsuoka
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Patent number: 8077962Abstract: Although there has been a method for evaluating pattern shapes of electronic devices by using, as a reference pattern, design data or a non-defective pattern, the conventional method has a problem that the pattern shape cannot be evaluated with high accuracy because of the difficulty in defining an exact shape suitable for the manufacturing conditions of the electronic devices. The present invention provides a shape evaluation method for circuit patterns of electronic devices, the method including a means for generating contour distribution data of at least two circuit patterns from contour data sets on the circuit patterns; a means for generating a reference pattern used for the pattern shape evaluation, from the contour distribution data; and a means for evaluating the pattern shape by comparing each evaluation target pattern with the reference pattern.Type: GrantFiled: February 5, 2009Date of Patent: December 13, 2011Assignee: Hitachi High-Technologies CorporationInventors: Yasutaka Toyoda, Hideo Sakai, Ryoichi Matsuoka
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Publication number: 20110096309Abstract: A method and system for evaluating a lithographic pattern obtained using multiple-patterning lithographic processing are presented. In one aspect, the method includes aligning a target design with a lithographic pattern. The target design may comprise a first design and a second design. The method further comprises identifying in the lithographic pattern a stitching region based on a region of overlap between the first design and the second design. The method further comprises determining for the identified stitching region whether a predetermined criterion is fulfilled. In some embodiments, determining whether a predetermined criterion is fulfilled may comprise determining a line or trench minimum width. Alternately or additionally, determining whether a predetermined criterion is fulfilled may comprise determining a stitching metric for the identified stitching region, and evaluating whether or not the stitching metric fulfills the predetermined criterion.Type: ApplicationFiled: October 27, 2010Publication date: April 28, 2011Applicants: IMEC, Hitachi High-Technologies CorporationInventors: Vincent Jean-Marie Pierre Paul Wiaux, Ryoichi Matsuoka, Shunsuke Koshihara, Hideo Sakai
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Patent number: 7846358Abstract: When the number of rotations of a drive motor (3) driving a hydraulic pump (2) is variably controlled and thus each operation process in a molding cycle is controlled, as the hydraulic pump (2), a hydraulic pump (2) that can set at least a high fixed discharge flow rate (Qm) and a low fixed discharge flow rate (Qs) lower than the high flow rate is used, limit conditions for a threshold for the load condition of the drive motor (3) are preset and, during a molding operation, by setting a predetermined operation process at the high fixed discharge flow rate (Qm), the operation process is controlled and, when the load condition of the drive motor (3) is monitored and the load condition reaches the limit conditions, the flow rate is switched to the low fixed discharge flow rate (Qs) to control the predetermined operation process.Type: GrantFiled: May 18, 2009Date of Patent: December 7, 2010Assignee: Nissei Plastic Industrial Co., Ltd.Inventors: Kenichi Shimizu, Hideo Sakai
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Patent number: 7752114Abstract: A seat ticket auction method and system using the Internet is provided. A user submits a tender for the auction of each seat while referring to a seating table, and also performs a search of an exhibition before submitting a tender during the auction. Further, when the seating table is referred to, information for a seat appropriate for a person in a wheelchair, and a simulation (view) of what a user will see of the stage from a seat are displayed on the terminal of the user. Three tender types, a personal tender, a complete group tender and an incomplete group tender can be selected. For the complete group tender, when a bid is not successful for all the members of the group, the bid is abandoned.Type: GrantFiled: March 21, 2002Date of Patent: July 6, 2010Assignee: International Business Machines CorporationInventor: Hideo Sakai
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Publication number: 20090297650Abstract: When the number of rotations of a drive motor (3) driving a hydraulic pump (2) is variably controlled and thus each operation process in a molding cycle is controlled, as the hydraulic pump (2), a hydraulic pump (2) that can set at least a high fixed discharge flow rate (Qm) and a low fixed discharge flow rate (Qs) lower than the high flow rate is used, limit conditions for a threshold for the load condition of the drive motor (3) are preset and, during a molding operation, by setting a predetermined operation process at the high fixed discharge flow rate (Qm), the operation process is controlled and, when the load condition of the drive motor (3) is monitored and the load condition reaches the limit conditions, the flow rate is switched to the low fixed discharge flow rate (Qs) to control the predetermined operation process.Type: ApplicationFiled: May 18, 2009Publication date: December 3, 2009Inventors: Kenichi SHIMIZU, Hideo Sakai
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Patent number: 7616300Abstract: An edge flaw detection device includes an elliptical mirror having a mirror surface on the inside thereof and having a cutout that allows an object to be inserted therethrough formed at the apex thereof, a light-emitting unit that radiates coherent light toward an edge of the object arranged in the vicinity of a first focal position of the elliptical mirror, a photo detector that is arranged in a second focal position of the elliptical mirror, and a light-shielding member that shields low-order diffracted light that is reflected regularly. The light-emitting unit is moved in the thickness direction of the object by a moving member so that the light-emitting unit can radiate the coherent light in a different radiation range in the thickness direction at the edge of the object.Type: GrantFiled: August 10, 2005Date of Patent: November 10, 2009Assignee: Raytex CorporationInventors: Naoyuki Nohara, Hideo Sakai
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Publication number: 20090202139Abstract: Although there has been a method for evaluating pattern shapes of electronic devices by using, as a reference pattern, design data or a non-defective pattern, the conventional method has a problem that the pattern shape cannot be evaluated with high accuracy because of the difficulty in defining an exact shape suitable for the manufacturing conditions of the electronic devices. The present invention provides a shape evaluation method for circuit patterns of electronic devices, the method including a means for generating contour distribution data of at least two circuit patterns from contour data sets on the circuit patterns; a means for generating a reference pattern used for the pattern shape evaluation, from the contour distribution data; and a means for evaluating the pattern shape by comparing each evaluation target pattern with the reference pattern.Type: ApplicationFiled: February 5, 2009Publication date: August 13, 2009Inventors: Yasutaka TOYODA, Hideo SAKAI, Ryoichi MATSUOKA
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Publication number: 20090091748Abstract: An edge flaw detection device includes an elliptical mirror having a mirror surface on the inside thereof and having a cutout that allows an object to be inserted therethrough formed at the apex thereof, a light-emitting unit that radiates coherent light toward an edge of the object arranged in the vicinity of a first focal position of the elliptical mirror, a photo detector that is arranged in a second focal position of the elliptical mirror, and a light-shielding member that shields low-order diffracted light that is reflected regularly. The light-emitting unit is moved in the thickness direction of the object by a moving member so that the light-emitting unit can radiate the coherent light in a different radiation range in the thickness direction at the edge of the object.Type: ApplicationFiled: August 10, 2005Publication date: April 9, 2009Inventors: Naoyuki Nohara, Hideo Sakai
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Publication number: 20090091747Abstract: An edge flaw detection device includes an elliptical mirror having an inner mirror surface, with a cut-out formed in the vertex portion to enable insertion of an object; a light-emitting portion which radiates coherent light toward an edge of the object, the edge of the object being positioned in the vicinity of a first focal position of the elliptical mirror; an optical detector positioned at a second focal position of the elliptical mirror; and a light-blocking member which blocks lower-order diffracted light which is regularly reflected. The light-emitting portion is capable of radiating coherent light at different wavelengths.Type: ApplicationFiled: August 10, 2005Publication date: April 9, 2009Inventors: Naoyuki Nohara, Hideo Sakai
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Publication number: 20060269809Abstract: A cooling apparatus for a fuel cell vehicle for cooling a fuel cell and a drive motor that receives electric power from the fuel cell and produces motive power for traveling. The cooling apparatus is provided with a first radiator for cooling the fuel cell, a second radiator for cooling the drive motor, and a radiator air-cooling fan that is shared by the first and second radiators. The sizes of the ventilation apertures of the first radiator and second radiator are set to be essentially the same, and the heat-releasing surface areas are set so as to be different from each other. The first and second radiators are adjacent to each other in the front-rear direction of the vehicle and can be disposed in the front portion of the fuel cell vehicle. The periphery between the first radiator and the second radiator is sealed with a seal member.Type: ApplicationFiled: May 23, 2006Publication date: November 30, 2006Applicant: HONDA MOTOR CO., LTD.Inventors: Hideo Sakai, Takayuki Ogawa, Mitsuharu Imaseki, Tomoya Yamagishi, Kensaku Yamamoto, Tohru Ono, Kengo Takamizawa
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Patent number: D558239Type: GrantFiled: February 2, 2007Date of Patent: December 25, 2007Assignee: Sawafuji Electric Co., Ltd.Inventors: Masahiro Takemoto, Hideo Sakai, Yoshiaki Amano