Patents by Inventor Hideo Yamanaka

Hideo Yamanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10527779
    Abstract: A display device includes a light source, a reflection sheet, a display panel, and a supporting unit. The reflection sheet reflects light from the light source. The supporting unit supports the reflection sheet. The supporting unit has a first protruding portion that contacts with a first area of a rear facing surface of the reflection sheet within a predetermined distance from a center portion of the reflection sheet, a second protruding portion that contacts with a second area of the rear facing surface of the reflection sheet that is spaced apart from the first area and a third protruding portion that contacts with a third area of the rear facing surface of the reflection sheet that is spaced apart from the first and second areas, the third area being located between the first and second areas.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: January 7, 2020
    Assignee: FUNAI ELECTRIC CO., LTD.
    Inventors: Akira Yokawa, Yuki Kita, Akihiro Fujikawa, Yasuyuki Fukumoto, Yasuhiro Mori, Yuto Suzuki, Hirofumi Horiuchi, Hirohiko Tsuji, Takahito Yamanaka, Hideo Yonezawa, Akifumi Kono
  • Patent number: 10520666
    Abstract: A display device includes a display panel, a light source, a reflection sheet, and a supporting unit. The supporting unit has a first protruding portion that contacts with a first area of a rear facing surface of the reflection sheet, a second protruding portion that contacts with a second area of the rear facing surface, a third protruding portion that contacts with a third area of the rear facing surface and a fourth protruding portion that contacts with a fourth area of the rear facing surface. The first, second, third and fourth areas are spaced apart from a center portion of the reflection sheet. The first and second areas are spaced apart from each other in a first direction. The third and fourth areas are spaced apart from each other in a second direction that is perpendicular to the first direction.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: December 31, 2019
    Assignee: FUNAI ELECTRIC CO., LTD.
    Inventors: Akira Yokawa, Yuki Kita, Akihiro Fujikawa, Yasuyuki Fukumoto, Yasuhiro Mori, Yuto Suzuki, Hirofumi Horiuchi, Hirohiko Tsuji, Takahito Yamanaka, Hideo Yonezawa, Akifumi Kono
  • Patent number: 10514158
    Abstract: A light source device includes: a holder that has a first surface and a second surface located higher than the first surface, and is an integral structure; a semiconductor light-emitting device on the first surface; an optical element unit that is disposed above the semiconductor light-emitting device, and has a reflective surface that inclines with respect to the first surface and reflects emitted light from the semiconductor light-emitting device; and a phosphor optical element that is disposed on the second surface and irradiated with reflected light from the optical element unit.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: December 24, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masaharu Fukakusa, Hideo Yamaguchi, Hirotaka Ueno, Kazuhiko Yamanaka
  • Patent number: 10475806
    Abstract: A semiconductor memory device includes a substrate with a first insulating film thereon, a wiring in the first insulating film, a first electrode film on the first insulating film, a stacked body on the first electrode film, made of alternating second insulating films and second electrode films, a first insulating member extending in a direction to penetrate the stacked body, a first semiconductor film around the first insulating member and connected to the first electrode film, a third insulating film around the first semiconductor film, a first conductive member extending in the direction to penetrate the stacked body and the first electrode film, and connected to the wiring, and a fourth insulating film around the first conductive member. The fourth insulating film has the same film structure as the third insulating film.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: November 12, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Mikiko Yagi, Hideto Takekida, Takaya Yamanaka, Masaharu Mizutani, Hideo Wada
  • Patent number: 10447005
    Abstract: A light source device includes: a semiconductor light-emitting device including a flat-shaped base having a first main surface on a first side and a second main surface and a semiconductor light-emitting element disposed on the first side; a first fixing component having a first through-hole and a first pressing surface that presses the first main surface; and a second fixing component having a second through-hole and a second pressing surface that presses the second main surface. The base is fixed between the first and second pressing surfaces by an engagement between a first inner surface surrounding the first through-hole of the first fixing component and a second outer surface of the second fixing component. A distance between the first and second pressing surfaces is smaller than or equal to a thickness of the base, and a void is formed lateral to the base between the first and second pressing surfaces.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: October 15, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kazuhiko Yamanaka, Kiyoshi Morimoto, Hideki Kasugai, Kazuyuki Matsumura, Hideo Yamaguchi, Nobuyasu Suzuki
  • Publication number: 20190290223
    Abstract: The ultrasonic CT device includes: a first water tank configured such that an object is inserted therein, the first water tank being filled with a medium through which an ultrasonic wave passes; a ring array that irradiates an ultrasonic wave to the object and detects an ultrasonic wave reflected by the object while moving on an outer surface of the first water tank; and a signal processing unit that generates a tomographic image of the object based on a signal obtained by the ring array. The ultrasonic CT device further includes: a second water tank that houses the first water tank and the ring array; and a lid having a hole or a notch which is provided on a side of the object in the second water tank and which drains the medium.
    Type: Application
    Filed: February 11, 2019
    Publication date: September 26, 2019
    Inventors: Yushi TSUBOTA, Masakazu SUGAYA, Hideo KASHIMA, Takahide TERADA, Kenichi KAWABATA, Wenjing WU, Kazuhiro YAMANAKA, Ai MASUDA
  • Publication number: 20190259917
    Abstract: A light source device includes a mounted substrate which is a multi-layered substrate, a semiconductor light-emitting device which emits a laser beam, a wavelength-converting member which radiates fluorescence by being irradiated with the laser beam emitted from the semiconductor light-emitting device as an excitation light, a state detection circuit, an electric field effect type transistor which adjusts an electric current amount applied to the semiconductor light-emitting device upon receipt of an output from the state detection circuit, and an external connecting member, and the semiconductor light-emitting device, the state detection circuit, the transistor, and the external connecting member are mounted on the single mounted substrate.
    Type: Application
    Filed: April 30, 2019
    Publication date: August 22, 2019
    Inventors: Kazuhiko YAMANAKA, Kenichi MATSUMOTO, Hideo YAMAGUCHI, Wakahiko OKAZAKI, Yasuhiko ENAMI, Taku KOBAYASHI, Kazuki ADACHI, Hirotaka UENO
  • Patent number: 10310170
    Abstract: A display device comprises a light source, an optical member, a display panel, and a frame. The frame supports the display panel. The frame has a first protruding portion that contacts with an area of a rear facing surface of the optical member within a predetermined distance from a center portion of the optical member. The first protruding portion has an overall rectangular shape with a step part at at least one corner of the overall rectangular shape.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: June 4, 2019
    Assignee: FUNAI ELECTRIC CO., LTD.
    Inventors: Akira Yokawa, Yuki Kita, Akihiro Fujikawa, Yasuyuki Fukumoto, Yasuhiro Mori, Yuto Suzuki, Hirofumi Horiuchi, Hirohiko Tsuji, Takahito Yamanaka, Hideo Yonezawa, Akifumi Kono
  • Publication number: 20190137684
    Abstract: A display device includes a display panel, a light source, a reflection sheet, and a supporting unit. The supporting unit has a first protruding portion that contacts with a first area of a rear facing surface of the reflection sheet, a second protruding portion that contacts with a second area of the rear facing surface, a third protruding portion that contacts with a third area of the rear facing surface and a fourth protruding portion that contacts with a fourth area of the rear facing surface. The first, second, third and fourth areas are spaced apart from a center portion of the reflection sheet. The first and second areas are spaced apart from each other in a first direction. The third and fourth areas are spaced apart from each other in a second direction that is perpendicular to the first direction.
    Type: Application
    Filed: January 7, 2019
    Publication date: May 9, 2019
    Inventors: Akira YOKAWA, Yuki KITA, Akihiro FUJIKAWA, Yasuyuki FUKUMOTO, Yasuhiro MORI, Yuto SUZUKI, Hirofumi HORIUCHI, Hirohiko TSUJI, Takahito YAMANAKA, Hideo YONEZAWA, Akifumi KONO
  • Publication number: 20190137683
    Abstract: A display device includes a light source, a reflection sheet, a display panel, and a supporting unit. The reflection sheet reflects light from the light source. The supporting unit supports the reflection sheet. The supporting unit has a first protruding portion that contacts with a first area of a rear facing surface of the reflection sheet within a predetermined distance from a center portion of the reflection sheet, a second protruding portion that contacts with a second area of the rear facing surface of the reflection sheet that is spaced apart from the first area and a third protruding portion that contacts with a third area of the rear facing surface of the reflection sheet that is spaced apart from the first and second areas, the third area being located between the first and second areas.
    Type: Application
    Filed: January 7, 2019
    Publication date: May 9, 2019
    Inventors: Akira YOKAWA, Yuki KITA, Akihiro FUJIKAWA, Yasuyuki FUKUMOTO, Yasuhiro MORI, Yuto SUZUKI, Hirofumi HORIUCHI, Hirohiko TSUJI, Takahito YAMANAKA, Hideo YONEZAWA, Akifumi KONO
  • Patent number: 7521335
    Abstract: A method for producing an ultra-thin semiconductor chip and an ultra-thin back-illuminated solid-state image pickup device utilizing a semiconductor layer formed on a support substrate via an insulating layer to improve separation performance of a semiconductor layer from a support substrate and thereby improve the productivity and quality. The method uses two porous peeling layers on opposite sides of a substrate to produce an ultra-thin substrate.
    Type: Grant
    Filed: October 6, 2005
    Date of Patent: April 21, 2009
    Assignee: Sony Corporation
    Inventor: Hideo Yamanaka
  • Patent number: 7294299
    Abstract: A granulating die B is provided with a resin discharge surface 5a to which a flow of water is contacted; and a plurality of nozzles 8 which communicate to a cylinder of an extruder are provided in this resin discharge surface 5a. Upon the resin discharge surface 5a, these nozzles 8 are not formed in at least one of its regions P which are in the direction of inflow of the flow of water and in the direction of outflow of the flow of water, and its regions R which are in directions orthogonal to this direction of inflow of said flow of water and this direction of outflow of said flow of water, but are only formed in the other regions Q thereof.
    Type: Grant
    Filed: March 11, 2004
    Date of Patent: November 13, 2007
    Assignee: Sekisui Plastics Co., Ltd.
    Inventors: Hideo Yamanaka, Shigeru Takeuchi
  • Patent number: 7276429
    Abstract: A method for producing an ultra-thin semiconductor chip and an ultra-thin back-illuminated solid-state image pickup device utilizing a semiconductor layer formed on a support substrate via an insulating layer to improve separation performance of a semiconductor layer from a support substrate and thereby improve the productivity and quality. The method uses two porous peeling layers on opposite sides of a substrate to produce an ultra-thin substrate.
    Type: Grant
    Filed: August 4, 2005
    Date of Patent: October 2, 2007
    Assignee: Sony Corporation
    Inventor: Hideo Yamanaka
  • Publication number: 20070087492
    Abstract: An object of the present invention is to provide a method for easily forming a polycrystalline semiconductor thin-film, such as polycrystalline silicon having high crystallinity and high quality, or a single crystalline semiconductor thin-film at inexpensive cost, the crystalline semiconductor thin-film having a large area, and to provide an apparatus for processing the method described above.
    Type: Application
    Filed: November 3, 2006
    Publication date: April 19, 2007
    Inventor: Hideo Yamanaka
  • Patent number: 7183229
    Abstract: An object of the present invention is to provide a method for easily forming a polycrystalline semiconductor thin-film, such as polycrystalline silicon having high crystallinity and high quality, or a single crystalline semiconductor thin-film at inexpensive cost, the crystalline semiconductor thin-film having a large area, and to provide an apparatus for processing the method described above.
    Type: Grant
    Filed: December 7, 2001
    Date of Patent: February 27, 2007
    Assignee: Sony Corporation
    Inventor: Hideo Yamanaka
  • Patent number: 7157352
    Abstract: A method for producing an ultra-thin semiconductor chip and an ultra-thin back-illuminated solid-state image pickup device utilizing a semiconductor layer formed on a support substrate via an insulating layer to improve separation performance of a semiconductor layer from a support substrate and thereby improve the productivity and quality. The method uses two porous peeling layers on opposite sides of a substrate to produce an ultra-thin substrate.
    Type: Grant
    Filed: October 7, 2003
    Date of Patent: January 2, 2007
    Assignee: Sony Corporation
    Inventor: Hideo Yamanaka
  • Publication number: 20060237404
    Abstract: A laser annealer has a laser light source with at least one GaN-type semiconductor laser and is configured so as to form emission points that emit laser beams having a wavelength of 350 to 450 nm, and a scanning device for scanning an annealing surface with the laser beams. The laser annealer may have a spatial light modulator for modulating the laser beams, and in which pixel portions whose light modulating states change in accordance with control signals are arranged on a substrate. The invention is applied to a laser thin-film forming apparatus. The apparatus has a laser source that has at least one semiconductor laser and is configured so as to form emission points, and an optical system for focusing laser beams into a single beam in the width direction of a substrate.
    Type: Application
    Filed: March 28, 2006
    Publication date: October 26, 2006
    Inventors: Hiromi Ishikkawa, Akinori Harada, Kazuhiko Nagano, Yoji Okazaki, Takeshi Fujii, Hideo Yamanaka, Hiromitsu Yamakawa
  • Patent number: 7112760
    Abstract: A laser annealer has a laser light source with at least one GaN-type semiconductor laser and is configured so as to form emission points that emit laser beams having a wavelength of 350 to 450 nm, and a scanning device for scanning an annealing surface with the laser beams. The laser annealer may have a spatial light modulator for modulating the laser beams, and in which pixel portions whose light modulating states change in accordance with control signals are arranged on a substrate. The invention is applied to a laser thin-film forming apparatus. The apparatus has a laser source that has at least one semiconductor laser and is configured so as to form emission points, and an optical system for focusing laser beams into a single beam in the width direction of a substrate.
    Type: Grant
    Filed: June 9, 2003
    Date of Patent: September 26, 2006
    Assignees: Fuji Photo Film Co., Ltd., Fujinon Corporation
    Inventors: Hiromi Ishikawa, Akinori Harada, Kazuhiko Nagano, Yoji Okazaki, Takeshi Fujii, Hideo Yamanaka, Hiromitsu Yamakawa
  • Publication number: 20060204604
    Abstract: A granulating die B is provided with a resin discharge surface 5a to which a flow of water is contacted; and a plurality of nozzles 8 which communicate to a cylinder of an extruder are provided in this resin discharge surface 5a. Upon the resin discharge surface 5a, these nozzles 8 are not formed in at least one of its regions P which are in the direction of inflow of the flow of water and in the direction of outflow of the flow of water, and its regions R which are in directions orthogonal to this direction of inflow of said flow of water and this direction of outflow of said flow of water, but are only formed in the other regions Q thereof.
    Type: Application
    Filed: March 11, 2004
    Publication date: September 14, 2006
    Inventors: Hideo Yamanaka, Shigeru Takeuchi
  • Patent number: 7098085
    Abstract: A method is disclosed for forming high-quality high-crystallinity polycrystalline or monocrystalline thin semiconductor film. The method is capable of forming such a semiconductor film over a large area at low cost. An apparatus for practicing the method is also disclosed. To form a high-crystallinity large-grain polycrystalline film or monocrystalline thin semiconductor film on a substrate, or to produce a semiconductor device including a high-crystallinity large-grain polycrystalline film or monocrystalline thin semiconductor film disposed on a substrate, a low-crystal-quality thin semiconductor film is first formed on the substrate, and then focused-light annealing is performed on the low-crystal-quality thin semiconductor film thereby melting or semi-melting the low-crystal-quality thin semiconductor film.
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: August 29, 2006
    Assignee: Sony Corporation
    Inventors: Hideo Yamanaka, Hisayoshi Yamoto