Abstract: A liquid crystal display device is obtained which performs point-sequential driving so that unevenness in brightness on a display screen becomes less noticeable. A signal line driving circuit that applies an image signal voltage sent from a signal processing circuit and a timing circuit to signal lines for performing point-sequential driving of the signal lines includes a driving direction switching circuit for inverting a driving direction of the point-sequential driving, and the signal processing circuit includes an image signal rearranging circuit for performing rearrangement of image signals, which is needed in accordance with inversion of the driving direction, in synchronization with the inversion of the driving direction.

Abstract: To provide a TFT fabrication method capable of forming on a large-surface area substrate with uniform film thickness and at high deposition rate of film, while being a low-temperature process, a high-quality gate insulation film having good charge behavior by forming a silicon oxide film by a thin film transistor fabrication method having a channel region connected to a source region and a drain region, and a gate electrode confronting with the channel region through a gate insulation film, wherein in the formation process of said gate insulation film using plasma chemical vapor deposition under the condition that tetraethoxysilane is used as the feed gas to provide the silicon and the distance between electrodes for generating the plasma is about 15 mm or less.

Abstract: A method for making a highly reliable non-single-crystal silicon thin film transistor, in which an underlying SiO.sub.2 film 15 is formed on a glass substrate 14 and then a polycrystalline silicon layer 17 is formed thereon. After patterning the polycrystalline silicon layer 17, a gate SiO.sub.2 film 18 is formed by an ECR-PECVD process or a TEOS-PECVD process. A gate electrode 19 is formed and source and drain regions 20, 20 are formed by an ion doping process. After forming a SiO.sub.2 insulating interlevel film 21 and providing a contact hole 22, an electrode 23 composed of an Al--Si--Cu film is formed. Finally, it is subjected to wet annealing at a temperature of 350.degree. C. for 3 hours.

Abstract: To provide a TFT fabrication method capable of forming on a large-surface area substrate with uniform film thickness and at high deposition rate of film, while being a low-temperature process, a high-quality gate insulation film having good charge behavior by forming a silicon oxide film by a thin film transistor fabrication method having a channel region connected to a source region and a drain region, and a gate electrode confronting with the channel region through a gate insulation film, wherein in the formation process of said gate insulation film using plasma chemical vapor deposition under the condition that tetraethoxysilane is used as the feed gas to provide the silicon and the distance between electrodes for generating the plasma is about 15 mm or less.

Abstract: There is disclosed an active matrix substrate including on a given substrate a thin film transistor, a scanning line connected to the gate of the thin film transistor, a data bus connected to the source of the thin film transistor, and a picture element electrode connected to the data bus through the thin film transistor, the active matrix substrate comprising a structure of the scanning line having the surface covered with an insulating film. A semiconductor layer covered with a gate insulating film constituting the thin film transistor, and a gate electrode constituting the thin film transistor, which are laid on each other in the stated order.