Patents by Inventor Hideto Kato

Hideto Kato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11338430
    Abstract: Included are a bottom portion having a traveling portion, a body portion having a first pillar portion and a second pillar portion extending in a vertical direction, respectively, from one end and another end in a horizontal direction of the bottom portion, and a top portion including one end connected to an end of the first pillar portion opposite to the bottom portion and including another end connected to an end of the second pillar portion opposite to the bottom portion, an article storage portion that forms an opening with the first pillar portion, the second pillar portion, the top portion, and the bottom portion in such a way that the opening penetrates the body portion, and fixing portions provided in the first and second pillar portions to sandwich the opening and pair up with each other, for fixing an article storage auxiliary instrument.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: May 24, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shinichi Kato, Hideto Iwamoto, Naoya Tsukamoto, Ian Emerson Random, So Satoh
  • Patent number: 11294282
    Abstract: A photosensitive resin composition comprising an isocyanurate-modified silicone resin containing an epoxy group in the molecule is easy to form a resin coating which has high transparency, light resistance and heat resistance, is amenable to micro-processing, and is useful in applications for protecting and encapsulating optical devices. The coating can be processed in thick film form to define a pattern having a fine size and perpendicularity, and becomes a cured coating which has improved adhesion to substrates, electronic parts, semiconductor devices, and supports for circuit boards, mechanical properties, electric insulation, and crack resistance, and is reliable as an insulating protective film.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: April 5, 2022
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kumiko Hayashi, Hitoshi Maruyama, Kazunori Kondo, Hideto Kato
  • Patent number: 11262655
    Abstract: A photosensitive resin composition comprising (A) a silphenylene and polyether structure—containing polymer and (B) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which has improved substrate adhesion, a pattern forming ability, crack resistance, and reliability as protective film.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: March 1, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hitoshi Maruyama, Hideto Kato, Michihiro Sugo
  • Patent number: 10991611
    Abstract: A wafer processing laminate comprising a support, a temporary adhesive material layer laminated on the support, and a wafer stacked on the temporary adhesive material layer, the wafer having a front surface on which a circuit is formed and a back surface to be processed, the temporary adhesive material layer comprising a first temporary adhesive layer composed of a thermoplastic resin layer (A) laminated on the front surface of the wafer and a second temporary adhesive layer composed of a thermosetting resin layer (B) laminated on the first temporary adhesive layer, the thermoplastic resin layer (A) being soluble in a cleaning liquid (D) after processing the wafer, the thermosetting resin layer (B) being insoluble in the cleaning liquid (D) after heat curing and capable of absorbing the cleaning liquid (D) such that the cleaning liquid (D) permeates into the layer (B).
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: April 27, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shohei Tagami, Michihiro Sugo, Hideto Kato
  • Patent number: 10982053
    Abstract: A novel polymer containing silphenylene and polyether structures in the backbone is used to formulate a photosensitive composition having improved reliability.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: April 20, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hitoshi Maruyama, Hideto Kato, Michihiro Sugo
  • Patent number: 10948823
    Abstract: To provide a laminate which enables pattern formation with excellent opening shape even in the case where a chemically amplified negative type resist material is used, and a pattern forming method in which the laminate is used. The laminate includes a chemically amplified negative type resist layer, and a basic resin coat layer thereon that contains 0.001 to 10% by weight of a basic compound having a molecular weight of up to 10,000.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: March 16, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Satoshi Asai, Kyoko Soga, Hideto Kato
  • Patent number: 10658314
    Abstract: Disclosed herein is a wafer laminate suitable for production of thin wafers and a method for producing the wafer laminate. The wafer laminate can be formed easily by bonding between the support and the wafer and it can be easily separated from each other. It promotes the productivity of thin wafers. The wafer laminate includes a support, an adhesive layer formed on the support, and a wafer which is laminated on the adhesive layer in such a way that that surface of the wafer which has the circuit surface faces toward the adhesive layer, wherein the adhesive layer is a cured product of an adhesive composition composed of resin A and resin B, the resin A having the light blocking effect and the resin B having the siloxane skeleton.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: May 19, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hiroyuki Yasuda, Michihiro Sugo, Hideto Kato
  • Patent number: 10553552
    Abstract: To provide a wafer laminate which permits easy bonding between a support and a wafer, permits easy delamination of a wafer from a support, enables enhanced productivity of a thin wafer, and is suited to production of a thin wafer, and for a method of producing the wafer laminate. The wafer laminate includes a support, an adhesive layer formed on the support, and a wafer laminated in such a manner that its front surface having a circuit surface faces the adhesive layer. The adhesive layer includes a light-shielding resin layer A and a non-silicone thermoplastic resin-coating resin layer B in this order from the support side. The resin layer A is composed of a resin that contains a repeating unit having a condensed ring, and the resin layer B has a storage elastic modulus E? at 25° C. of 1 to 500 MPa and a tensile break strength of 5 to 50 MPa.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: February 4, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hiroyuki Yasuda, Michihiro Sugo, Hideto Kato
  • Publication number: 20190354014
    Abstract: A photosensitive resin composition comprising (A) a silphenylene and polyether structure—containing polymer and (B) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which has improved substrate adhesion, a pattern forming ability, crack resistance, and reliability as protective film.
    Type: Application
    Filed: May 14, 2019
    Publication date: November 21, 2019
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hitoshi Maruyama, Hideto Kato, Michihiro Sugo
  • Publication number: 20190352465
    Abstract: A novel polymer containing silphenylene and polyether structures in the backbone is used to formulate a photosensitive composition having improved reliability.
    Type: Application
    Filed: May 16, 2019
    Publication date: November 21, 2019
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hitoshi Maruyama, Hideto Kato, Michihiro Sugo
  • Patent number: 10453732
    Abstract: A wafer laminate has an adhesive layer (3) sandwiched between a transparent substrate (1) and a water (2), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (3) includes a first cured resin layer (3a) disposed adjacent the substrate and having light-shielding properties and a second cured resin layer (3b) disposed adjacent the wafer and comprising a cured product of a thermosetting resin composition.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: October 22, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hiroyuki Yasuda, Michihiro Sugo, Hideto Kato
  • Patent number: 10416559
    Abstract: A film material includes a support film having a transmittance of at least 60% with respect to light of wavelength 300-450 nm, and a resin layer containing 0.001-10 wt % of a basic compound with a molecular weight of up to 10,000, and having a thickness of 1-100 ?m. A pattern is formed by attaching the resin layer in the film material to a chemically amplified negative resist layer on a wafer, exposing, baking, and developing the resist layer. The profile of openings in the pattern is improved.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: September 17, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Satoshi Asai, Kyoko Soga, Hideto Kato
  • Patent number: 10373903
    Abstract: A laminate is provided comprising a support, a resin layer, a metal layer, an insulating layer, and a redistribution layer. The resin layer comprises a photo-decomposable resin having light-shielding properties and has a transmittance of up to 20% with respect to light of wavelength 355 nm. The laminate is easy to fabricate and has thermal process resistance, the support is easily separated, and a semiconductor package is efficiently produced.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: August 6, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hiroyuki Yasuda, Michihiro Sugo, Hideto Kato, Kazunori Kondo
  • Patent number: 10319653
    Abstract: A semiconductor apparatus includes a semiconductor device, on-semiconductor-device metal pad and metal interconnect each electrically connected to the semiconductor device, a through electrode and a solder bump each electrically connected to the metal interconnect, a first insulating layer on which the semiconductor device is placed, a second insulating layer formed on the semiconductor device, a third insulating layer formed on the second layer. The metal interconnect is electrically connected to the semiconductor device via the on-semiconductor-device metal pad at an upper surface of the second layer, penetrates the second layer from its upper surface, and is electrically connected to the through electrode at an lower surface of the second layer, and an under-semiconductor-device metal interconnect is between the first layer and the semiconductor device, and the under-semiconductor-device metal interconnect is electrically connected to the metal interconnect at the lower surface of the second layer.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: June 11, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Katsuya Takemura, Kyoko Soga, Satoshi Asai, Kazunori Kondo, Michihiro Sugo, Hideto Kato
  • Patent number: 10297485
    Abstract: A semiconductor device is provided comprising a support, an adhesive resin layer, an insulating layer, a redistribution layer, a chip layer, and a mold resin layer. The adhesive resin layer consists of a resin layer (A) comprising a photo-decomposable resin containing a fused ring in its main chain and a resin layer (B) comprising a non-silicone base thermoplastic resin and having a storage elastic modulus E? of 1-500 MPa at 25° C. and a tensile break strength of 5-50 MPa. The semiconductor device is easy to fabricate and has thermal process resistance, the support is easily separated, and a semiconductor package is efficiently produced.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: May 21, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hiroyuki Yasuda, Michihiro Sugo, Hideto Kato, Kazunori Kondo
  • Publication number: 20190064666
    Abstract: A photosensitive resin composition comprising an isocyanurate-modified silicone resin containing an epoxy group in the molecule is easy to form a resin coating which has high transparency, light resistance and heat resistance, is amenable to micro-processing, and is useful in applications for protecting and encapsulating optical devices. The coating can be processed in thick film form to define a pattern having a fine size and perpendicularity, and becomes a cured coating which has improved adhesion to substrates, electronic parts, semiconductor devices, and supports for circuit boards, mechanical properties, electric insulation, and crack resistance, and is reliable as an insulating protective film.
    Type: Application
    Filed: August 28, 2018
    Publication date: February 28, 2019
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kumiko Hayashi, Hitoshi Maruyama, Kazunori Kondo, Hideto Kato
  • Publication number: 20190027391
    Abstract: A wafer processing laminate comprising a support, a temporary adhesive material layer laminated on the support, and a wafer stacked on the temporary adhesive material layer, the wafer having a front surface on which a circuit is formed and a back surface to be processed, the temporary adhesive material layer comprising a first temporary adhesive layer composed of a thermoplastic resin layer (A) laminated on the front surface of the wafer and a second temporary adhesive layer composed of a thermosetting resin layer (B) laminated on the first temporary adhesive layer, the thermoplastic resin layer (A) being soluble in a cleaning liquid (D) after processing the wafer, the thermosetting resin layer (B) being insoluble in the cleaning liquid (D) after heat curing and capable of absorbing the cleaning liquid (D) such that the cleaning liquid (D) permeates into the layer (B).
    Type: Application
    Filed: September 21, 2018
    Publication date: January 24, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shohei TAGAMI, Michihiro SUGO, Hideto KATO
  • Patent number: 10141272
    Abstract: A semiconductor apparatus including a semiconductor device, an on-semiconductor-device metal pad and a metal interconnect each electrically connected to the semiconductor device, a through electrode and a solder bump each electrically connected to the metal interconnect, a first insulating layer on which the semiconductor device is placed, a second insulating layer formed on the semiconductor device, a third insulating layer formed on the second insulating layer, wherein the metal interconnect is electrically connected to the semiconductor device via the on-semiconductor-device metal pad at an upper surface of the second insulating layer, and the metal interconnect penetrates the second insulating layer from its upper surface and is electrically connected to the through electrode at an lower surface of the second insulating layer. This semiconductor apparatus can be easily placed on a circuit board and stacked, and can reduce its warpage even with dense metal interconnects.
    Type: Grant
    Filed: March 16, 2015
    Date of Patent: November 27, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Katsuya Takemura, Kyoko Soga, Satoshi Asai, Kazunori Kondo, Michihiro Sugo, Hideto Kato
  • Patent number: 10128143
    Abstract: Temporary adhesive material for wafer processing, the temporary adhesive material being used for temporarily bonding support to wafer having circuit-forming front surface and back surface to be processed, including complex temporary adhesive material layer that has first temporary adhesive layer composed of thermosetting siloxane polymer layer (A), second temporary adhesive layer composed of thermosetting polymer layer (B), and third temporary adhesive layer composed of thermoplastic resin layer (C), wherein the polymer layer (A) is cured layer of composition containing (A-1) an organopolysiloxane having alkenyl group within its molecule, (A-2) an organopolysiloxane having R103SiO0.5 unit and SiO2 unit, (A-3) organohydrogenpolysiloxane having two or more Si—H groups per molecule, and (A-4) platinum-based catalyst.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: November 13, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masahito Tanabe, Michihiro Sugo, Hiroyuki Yasuda, Shohei Tagami, Hideto Kato
  • Patent number: 10115622
    Abstract: A wafer processing laminate including support, temporary adhesive material layer laminated on the support, and wafer stacked on temporary adhesive material layer, wafer having front surface on which circuit is formed and back surface to be processed, temporary adhesive material layer including first temporary adhesive layer composed of thermoplastic resin layer (A) laminated on front surface of wafer and second temporary adhesive layer composed of thermosetting resin layer (B) laminated on first temporary adhesive layer, thermoplastic resin layer (A) being soluble in cleaning liquid (D) after processing wafer, thermosetting resin layer (B) being insoluble in cleaning liquid (D) after heat curing and capable of absorbing cleaning liquid (D) such that cleaning liquid (D) permeates into layer (B). This wafer processing laminate allows a wide selection of materials, facilitates separation and collection of processed wafer, meets requirements on various processes, and can increase productivity of thin wafers.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: October 30, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shohei Tagami, Michihiro Sugo, Hideto Kato