Abstract: A photosensitive resin composition comprising;(A) a polyimide precursor containing an acrylic or methacrylic group;(B) a tertiary amine compound represented by the general formula: ##STR1## wherein R.sup.6 is a monovalent organic group having 3 or less carbon atoms, R.sup.7 is a divalent organic group having 3 or less carbon atoms, and R.sup.8 is a hydrogen atom or a methyl group; and(C) at least one of a photopolymerization initiator and a sensitizer.This composition has a sufficient sensitivity even when thick films are formed, has a superior developability in an aqueous alkali solution, and is suited for the formation of polyimide patterns.

Abstract: The present invention provides a polyimide resin composition comprising:(a) a polyamide resin comprising a repeating unit represented by the general formula (1): ##STR1## wherein X represents a tetravalent organic group represented by the formula (2): ##STR2## Y represents a divalent organic group comprising a divalent siloxane residual group represented by the formula (3): ##STR3## wherein m is an integer of 60 to 120; and a divalent aromatic group represented by the formula (4): ##STR4## wherein R.sup.1 represents a hydrogen atom or a fluorine atom; and (B) cyclohexanone. From this composition, polyimide resin films can be obtained by heating at a lower temperature for a short time, and the films obtained show good adhesion under moisture-resistant conditions.

Abstract: The composition comprises (A) a specified polyimide precursor and (B) at least one member selected from the group consisting of a sensitizer, a photopolymerization initiator and a combination thereof. The above process comprises applying a solution of the above photosensitive resin composition on a substrate, followed by drying to form a film; exposing the film to light, followed by developing with an aqueous alkaline solution to form a patterned film; and curing the patterned film. The composition has little ionic impurities mixed therein during the preparation of the composition; is excellent in storage stability in the state of a solution; can be developed with an aqueous alkaline solution, which does not cause the problems such as a problem to health and a problem to the treatment of waste liquids, within a short time; and exhibits a good sensitivity even when formed a thick film, thereby readily providing a patterned resinous film.

Abstract: A contact lens material comprising a condensation polymer having a recurring unit represented by the formula (I): ##STR1## wherein R.sup.1 is --C(CF.sub.3).sub.2 -- or ##STR2## R.sup.2 is a group represented by the formula: ##STR3## in which l is an integer of 1 to 3, m is an integer of 1 to 15 and n is an integer of 1 to 3, ##STR4## in which u is an integer of 1 to 3 and v is an integer of 1 to 3, a group represented by the formula (II): ##STR5## wherein R.sup.3, R.sup.4, R.sup.5 and R.sup.6 are the same or different and each is hydrogen atom or an alkyl group having 1 to 5 carbon atoms, or a group represented by the formula (III): ##STR6## wherein R.sup.7 is --C(CF.sub.3).sub.2 --, ##STR7## or a direct bond, and R.sup.8 and R.sup.9 are the same or different and each is an alkyl group having 1 to 3 carbon atoms, a fluoroalkyl group having 1 to 3 carbon atoms, hydrogen atom, hydroxyl group or carboxyl group.

Abstract: A train detection device for use in railroad models is provided with a capacitance type sensor which detects the close approach or passage of a train by responding to capacitance of the train. By using the capacitance type sensor, the train detection device becomes a non-contact type detection device, which avoids the kind of damage that can occur with contact type detectors. The train detection device is applied to a train crossing control apparatus for use in railroad models equipped with a crossing gate, a warning signal, and a controlling device for controlling the operations of the crossing gate and the warning signal.

Abstract: The composition comprises (A) a specified polyimide precursor and (B) at least one member selected from the group consisting of a sensitizer, a photopolymerization initiator and a combination thereof. The above method comprises coating the solution of the above photosensitive resin composition on a substrate, followed by drying to form a coating film; exposing the coating film to light, followed by developing with an aqueous alkaline solution to form a patterned film; and heat-curing the patterned film. The composition has little ionic impurities mixed therein during the preparation of the composition; is excellent in storage stability in the state of a solution; can be developed with an aqueous alkaline solution, which does not cause the problems such as a problem to health and a problem to the treatment of waste liquids, within a short time; and exhibits a good sensitivity even when formed a thick film, thereby readily providing a patterned resinous film.

Abstract: A photosensitive resin composition which comprises (A) a polyimide resin precursor of recurring units of a specific type, (B) at least one member selected from the group consisting of photosensitive diazoquinone compounds of the following formulas ##STR1## wherein R.sup.2 represents an organic group having from 1 to 50 carbon atoms, i is an integer of from 1 to 7, and i is an integer of from 1 to 7, and (C) a phenolic novolac resin. A method for forming a polyimide film pattern on various types of substrates is also described wherein a composition film is alkali-developed after imagewise exposure and cured to provide a heat-resistant polyimide film pattern suitable for protecting the substrate.

Abstract: A transparent ocular lens material comprising a condensation polymer prepared by the condensation polymerization of a monomer mixture comprising (A) an aromatic tetracarboxylic acid dianhydride and (B) at least one diamino compound selected from (a) a silicon-containing diamine, (b) a diamino-substituted benzene and (c) a diamino-substituted diphenyl. The ocular lens material is excellent in transparency, having high oxygen permeability and moreover, excellent in heat resistance, ultraviolet-ray absorbing property and forming and processing property. Therefore, the ocular lens material can be suitably used in contact lenses, intraocular lenses, and the like.

Abstract: A photosensitive resin composition which is adapted for protecting articles and particularly, electronic parts, therewith comprises a polyimide precursor of the following general formula ##STR1## wherein each X individually represents a tetravalent organic group, each Y individually represents a divalent organic group, R.sup.1, R.sup.2 and R.sup.3 may be the same or different and represent a hydrogen atom or a monovalent organic group having form 1 to 10 carbon atoms, and p, q and m are, respectively, an integer of 1 or over, and a photosensitive diazoquinone compound.

Abstract: A polyimidesilicone resin precursor composition which comprises a polysiloxane of the following general formula ##STR1## wherein R is a monovalent organic group having up to 10 carbon atoms, R.sup.1 represents a hydrogen atom or a monovalent organic group having up to 10 carbon atoms, and m is an integer not smaller than 3, and a polyamic acid or a polyimide obtained from the polyamic acid. The composition is cured at a relatively low temperature within a short time to provide a cured film having improved solvent and heat resistances and good adhesion to various substrates.

Abstract: A novel curable polyimide resin of structural formula (1) or (2) is provided wherein R.sup.1 and R.sup.2 are independently substituted or unsubstituted monovalent C.sub.1-10 hydrocarbon groups, R.sup.3 is a divalent C.sub.1-10 organic group, X is a tetravalent organic group containing an aromatic or aliphatic ring, Y is a divalent organic group, Z is a divalent organic group containing an aromatic ring, W is a trivalent organic group containing an aromatic ring, m is an integer of 1 to 3, and n is an integer of at least 1. It can be prepared by reacting a polyimide with a silicon compound. The curable resin forms with a solvent a solution having a low viscosity and shelf stability and cures at relatively low temperatures below 300.degree. C. into coatings having heat resistance, mechanical strength, electrical properties, solvent resistance and substrate adherence.

Abstract: A photosensitive polymer composition comprising, in admixture, a polymer predominantly comprising a recurring unit of the formula (I): ##STR1## wherein x is a tri- or tetravalent organic group, Y is a divalent organic group, and n is equal to 1 or 2 and a compound having a urea bond of the formula (II): ##STR2## wherein R.sup.1 is a group having a functional group capable of forming a dimer or polymer upon exposure to radiation, R.sup.2 and R.sup.3 are independently a hydrogen atom or a monovalent organic group is shelf stable and applicable as relatively thick coatings having sufficient photosensitivity to form semiconductor element surface protective films.

Abstract: A curable resin composition comprising a mixture or cocondensate of a compound containing imide and alkoxysilyl groups and an organosilane or organopolysiloxane is shelf stable and cures into a film which is improved in heat resistance, mechanical strength, electrical properties, solvent resistance and adhesion to substrates and thus suitable as a protective film on electronic parts.

Abstract: A polyimide resin is prepared by polymerizing (A) a tetracarboxylic acid dianhydride component consisting essentially of 10 to 50 mol % of 2,2-bis(3,4-benzene-dicarboxylic anhydride)perfluoropropane and 90 to 50 mol % of pyromellitic dianhydride or similar acid dianhydride and (B) a diamine component consisting essentially of 10 to 80 mol % of a silicon diamine and 90 to 20 mol % of an ether diamine. The polyimide resin is dissolved in an organic solvent and blended with finely divided silica to form a composition which is useful for protecting semiconductor elements.

Abstract: A solution composition of a polyimide resin type curable resin having imide and alkoxysilyl groups is prepared by reacting a polyimide with a silicon compound in an organic solvent. The solution can be cured through relatively mild heating into coatings having enhanced substrate adherence and solvent resistance and thus suitable as protective coatings on electronic parts.

Abstract: A specific polyimide resin is provided which is soluble in low-boiling organic solvents. Polyimide resin films having improved adhesion, heat resistance, electrical and mechanical properties are prepared from solutions of the polyimide resin through a brief heat treatment.

Abstract: A polyimide resin is prepared by polymerizing (A) a tetracarboxylic acid dianhydride component consisting essentially of 10 to 50 mol % of 2,2-bis(3,4-benzene-dicarboxylic anhydride)perfluoropropane and 90 to 50 mol % of pyromelitic dianhydride or similar acid dianhydride and (B) a diamine component consisting essentially of 10 to 80 mol % of a silicon diamine and 90 to 20 mol % of an ether diamine. The polyimide resin is soluble in ordinary organic solvents to form solutions which are readily applicable to substrates, typically providing insulating protective coatings on electronic parts.

Abstract: A novel methacrylic acid ester represented by General Formula (I): ##STR1## wherein l is an integer of 1 to 3; m is an integer of 1 to 10; and n is an integer of 1 to 3,and a process for producing the same. This novel methacrylic acid ester is useful for the synthesis of polymers having useful functions such as an oxygen enrichment performance.

Abstract: A class of novel organosilane compounds are disclosed as represented by the general formulaRSi(OCH.sub.2 CF.sub.3).sub.3,in which R is an atom or group selected from the class consisting of a hydrogen atom, unsaturated monovalent aliphatic hydrocarbon groups having from 2 to 20 carbon atoms, monovalent aryl groups and monovalent organic groups having from 3 to 20 carbon atoms and containing at least one hetero atom, i.e. an atom other than carbon and hydrogen atoms, such as oxygen, halogens, sulfur and nitrogen, the said hetero atom-containing organic group being bonded to the silicon atom through a carbon-to-silicon linkage. Several particular compounds belonging to the class were synthesized and identified.