Abstract: From a heat-curable photosensitive composition comprising a cresol and/or xylenol novolac resin which has been partially 1,2-naphthoquinonediazido-4- or 5-sulfonate esterified and having a weight average molecular weight of 1,000-10,000, an epoxy compound, and a solvent therefor, a pattern featuring improved solvent resistance and heat resistance can be formed at a high sensitivity and resolution by a simple process. The pattern is suitable as an interlayer insulating film for use in thin-film magnetic heads.

Abstract: A positive resist composition contains (A) a novolak resin having a weight average molecular weight calculated as polystyrene of 2,000-20,000 wherein 2.5-27 mol % of the hydrogen atom of a hydroxyl group is replaced by a 1,2-naphthoquinonediazidosulfonyl group and (B) a low molecular aromatic compound having phenolic hydroxyl groups and 2-20 benzene rings wherein the ratio of the number of phenolic hydroxyl groups to the number of benzene rings is between 0.5 and 2.5. By forming a resist layer on a substrate from the positive resist composition and baking the resist layer at 90-130° C., followed by exposure and development, there is formed a resist pattern having an undercut of desired configuration. Owing to high resolution and improved dimensional control, heat resistance and film retention, the resist pattern lends itself to a lift-off technique.

Abstract: A polymer in the form of a novolac resin is provided wherein the novolac resin has a weight average molecular weight of 1,000-30,000, some of the hydrogen atoms of hydroxyl groups are replaced by 1,2-naphthoquinonediazidosulfonyl ester groups, and some of the hydrogen atoms of the remaining hydroxyl groups are replaced by substituted acetal groups and/or crosslinked within a molecule or between molecules with crosslinking groups having C—O—C linkages. The polymer is formulated into a positive resist composition having improved uniformity, sensitivity, resolution and pattern profile as well as improved heat resistance, film retention, substrate adhesion and storage stability.

Abstract: By blending novel organosiloxane polymers of the invention with a crosslinking agent and a photoacid generator, photo-curable resin compositions are formulated which can be exposed to radiation in a broad wavelength range and readily form a thin film without oxygen attack. From the compositions, fine patterns having improved dry etching resistance can be formed. Cured coatings of the compositions having improved substrate adhesion, heat resistance, and electrical insulation are suitable as a protective film for electric and electronic parts.

Abstract: By forming a lift-off resist pattern on a surface of a first layer, forming a second layer over the first layer surface including the resist pattern, removing the resist pattern to partially expose the first layer surface, and etching the exposed area of the first layer, a micropattern having a high resolution of 0.3 &mgr;m or less and improved dimensional control is obtained.

Abstract: An electrostatic capacity sensor comprises an electrostatic capacity type detection element in which a detection electrode, a ground electrode and a charge plate interposed between the detection electrode and the ground electrode are arranged in a state that they are isolated to each other; a detection circuit for detecting changes in capacitance of the detection electrode caused by an object to be detected; and a power supply for supplying electrical power to the detection circuit. Since the electrostatic capacity sensor is provided with the charge plate between the detection electrode and the charge plate, it is possible to improve the sensitivity of the detection element, so that it is possible to increase the detection distance. In addition, the variations in the capacitance of the detection element due to the changes in the ambient conditions can be reduced.

Abstract: A polyimide silicone resin which is obtained from a diamine containing an acid dianhydride and a diaminopolysiloxane, contains 50% by weight or more of a siloxane residual group and has an elongation at rapture of 400% or higher and a modulus of elasticity of 500 N/mm2 or lower. Also disclosed are a polyimide silicone resin solution composition comprising this polyimide silicone resin and a ketone solvent having a boiling point of 130° C. or below, and a polyimide silicone resin film comprising this polyimide silicone resin and formed on a substrate. The polyimide silicone resin can form films at relatively low temperature, has superior adhesiveness to substrates and durability under conditions of high humidity and also has low stress and high elongation.

Abstract: A polyimide silicone resin which contains not more than 300 ppm of a cyclic siloxane oligomer having 10 or less silicon atoms, has a glass transition point of 250° C. or below and is soluble in an organic solvent. This polyimide silicone resin is produced using a diamine containing a diaminosiloxane containing not more than 300 ppm of the cyclic siloxane oligomer. Also disclosed is a polyimide silicone resin composition including 50 to 99% by mass of the polyimide silicone resin and 1 to 50% by mass of an epoxy compound. The polyimide silicone resin has been made to less contain the cyclic siloxane oligomers causative of trouble in electrical contacts, and promises a good adhesiveness or bond strength to substrates and a high reliability.

Abstract: A resist composition comprising (A) an alkali-insoluble or substantially insoluble polymer having acidic functional groups protected with acid labile groups, which polymer becomes alkali-soluble upon elimination of the acid labile groups, (B) a photoacid generator, and (C) a 1,2-naphthoquinonediazidosulfonyl group-bearing compound has a high resolution and sensitivity, and provides resist patterns of excellent plating resistance when used in UV lithography at an exposure light wavelength of at least 300 nm.

Abstract: From a heat-curable photosensitive composition comprising a cresol and/or xylenol novolac resin which has been partially 1,2-naphthoquinonediazido-4- or 5-sulfonate esterified and having a weight average molecular weight of 1,000-10,000, an epoxy compound, and a solvent therefor, a pattern featuring improved solvent resistance and heat resistance can be formed at a high sensitivity and resolution by a simple process. The pattern is suitable as an interlayer insulating film for use in thin-film magnetic heads.

Abstract: A single layer lift-off resist composition comprising a novolac resin, a quinonediazidosulfonate photosensitive agent, and an aromatic hydroxy compound having at least one phenolic hydroxyl group in which the phenolic hydroxyl group is partially acylated is improved in adhesion to a substrate.

Abstract: A positive resist composition contains (A) a novolak resin having a weight average molecular weight calculated as polystyrene of 2,000-20,000 wherein 2.5-27 mol % of the hydrogen atom of a hydroxyl group is replaced by a 1,2-naphthoquinonediazidosulfonyl group and (B) a low molecular aromatic compound having phenolic hydroxyl groups and 2-20 benzene rings wherein the ratio of the number of phenolic hydroxyl groups to the number of benzene rings is between 0.5 and 2.5. By forming a resist layer on a substrate from the positive resist composition and baking the resist layer at 90-130° C., followed by exposure and development, there is formed a resist pattern having an undercut of desired configuration. Owing to high resolution and improved dimensional control, heat resistance and film retention, the resist pattern lends itself to a lift-off technique.

Abstract: A polymer in the form of a novolac resin is provided wherein the novolac resin has a weight average molecular weight of 1,000-30,000, some of the hydrogen atoms of hydroxyl groups are replaced by 1,2-naphthoquinonediazidosulfonyl ester groups, and some of the hydrogen atoms of the remaining hydroxyl groups are replaced by substituted acetal groups and/or crosslinked within a molecule or between molecules with crosslinking groups having C—O—C linkages. The polymer is formulated into a positive resist composition having improved uniformity, sensitivity, resolution and pattern profile as well as improved heat resistance, film retention, substrate adhesion and storage stability.

Abstract: A surface treatment agent comprises an oligomeric or polymeric silicon-containing compound having an epoxycyclohexyl, glycidoxy, N-&bgr;-aminoethylamino, amino, N-phenylamino, mercapto or isocyanate group. When the surface treatment agent is applied to a metal or metal oxide substrate prior to formation of a resist pattern thereon, it serves to strengthen adhesion between the substrate and the photoresist film.

Abstract: The invention provides a novel polymer in the form of a novolac resin in which some of the hydrogen atoms of the hydroxyl groups are replaced by 1,2-naphthoquinonediazidosulfonyl ester groups and some of the hydrogen atoms of the remaining hydroxyl groups are replaced by substituted carbonyl or sulfonyl groups. The polymer has a weight average molecular weight calculated as polystyrene of 1,000-30,000. The polymer is formulated into a resist composition having improved uniformity, sensitivity, resolution and pattern geometry in microfabrication.

Abstract: A novel polymer is provided in the form of a novolac resin in which some of the hydrogen atoms of hydroxyl groups are replaced by 1,2-naphthoquinonediazidosulfonyl ester groups, triazinyl groups and optionally, substituted carbonyl or sulfonyl groups. A positive resist composition comprising the polymer has improved sensitivity, resolution and developability in microfabrication as well as improved heat resistance and low-temperature curability in forming interlayer insulating film.

Abstract: A photosensitive resin composition contains a photosensitive resin comprising recurring units of formula (1) and having a Mw of 1,300-11,000 and 20-5,000 ppm of a tertiary amine compound of formula (2). R is hydrogen or a 1,2-naphthoquinonediazido-5-sulfonic acid residue, the content of 1,2-naphthoquinonediazido-5-sulfonic acid residue in R is 3-27 mol %, and m is a number from 0 to 3, X is a C6-20 alkyl, aryl or aralkyl group, Y and Z each are a C1-20 alkyl group. The composition is improved in sensitivity stability and adhesion to substrates and eliminates the risk of causing corrosion of metal substrates.

Abstract: A positive resist composition contains (A) a novolak resin having a weight average molecular weight calculated as polystyrene of 2,000-20,000 wherein 2.5-27 mol % of the hydrogen atom of a hydroxyl group is replaced by a 1,2-naphthoquinonediazidosulfonyl group and (B) a low molecular aromatic compound having phenolic hydroxyl groups and 2-20 benzene rings wherein the ratio of the number of phenolic hydroxyl groups to the number of benzene rings is between 0.5 and 2.5. By forming a resist layer on a substrate from the positive resist composition and baking the resist layer at 90-130° C., followed by exposure and development, there is formed a resist pattern having an undercut of desired configuration. Owing to high resolution and improved dimensional control, heat resistance and film retention, the resist pattern lends itself to a lift-off technique.

Abstract: An epoxy resin composition contains (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a skeleton having a structure in which two benzene rings are conjugable to each other directly or via an aliphatic unsaturated double bond, carbon atoms having an atomic orbital of SP.sup.2 type accounting for at least 50% of the carbon number, (B) a phenolic resin having a hydroxyl equivalent of at least 160, carbon atoms having an atomic orbital of Sp.sup.2 type accounting for at least 85% of the carbon number, (C) a polyimide resin in an amount of 1-20 parts by weight per 100 parts by weight of components (A) and (B) combined, and (D) 70-85% by volume of the entire composition of an inorganic filler. The composition cures into products having flame retardancy and high-temperature reliability even though it is free of bromine compounds and antimony compounds.

Abstract: A photosensitive resin composition is comprised of (A) a polyimide resin having a weight-average molecular weight of from 5,000 to 150,000, represented by the general formula (I): ##STR1## wherein X is a specified tetravalent organic group having two benzene rings, Y is a member comprised of 30-100 mol % of a specific organic group having two benzene rings and 70-0 mol % of another specific divalent aromatic organic group, Z is a divalent organic group represented by the general formula (VI): ##STR2## wherein b is an integer of 5 to 80; and m and n each represent a number satisfying that m/(m+n) is 0.98 to 0.70 and n/(m+n) is 0.02 to 0.30; (B) an agent selected from a sensitizer and a photopolymerization initiator; and (C) an organic solvent. From this composition, polyimide films having a superior adhesion to substrates and also having no corrosive properties can be formed by low-temperature heat treatment.