Patents by Inventor Hidetoshi Fujii

Hidetoshi Fujii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240189937
    Abstract: A friction stir welding tool and a friction stir welding method that can increase the amount of heat generation, while reducing the amount of escaping heat are provided. The friction stir welding tool (1) has a shoulder portion (7) and a probe portion (5) provided on a bottom surface of the shoulder portion (7) . The base material of the friction stir welding tool (1) is a ceramic material whose main phase is silicon nitride or sialon. The shoulder portion (7) has a diameter of 35 mm or greater.
    Type: Application
    Filed: April 7, 2022
    Publication date: June 13, 2024
    Applicants: NTK CUTTING TOOLS CO., LTD., Osaka University
    Inventors: Yuki Takeuchi, Jun Moteki, Hiroki Takeuchi, Yusuke Katsu, Yasushi Hara, Hidetoshi Fujii, Yoshiaki Morisada
  • Patent number: 11986901
    Abstract: A friction stir welding tool (1) has a shoulder portion (2) and a probe portion (6) provided on a bottom surface of the shoulder portion (2). The probe portion (6) has a length of 5.5 mm or more. In the friction stir welding tool (1), a ceramic material whose main phase is silicon nitride or sialon is used as a base material.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: May 21, 2024
    Assignees: NTK CUTTING TOOLS CO., LTD., OSAKA UNIVERSITY
    Inventors: Hidetoshi Fujii, Yoshiaki Morisada, Yusuke Katsu, Hiroki Takeuchi
  • Publication number: 20240157467
    Abstract: Provided are an easy and efficient linear friction-joining method with which it is possible to form an excellent joined section between materials being joined that are of different sizes and shapes, and a linear friction-joining structure obtained through the aforementioned friction-joining method.
    Type: Application
    Filed: March 18, 2022
    Publication date: May 16, 2024
    Inventors: Hidetoshi FUJII, Yoshiaki MORISADA, Yasuhiro AOKI
  • Patent number: 11964338
    Abstract: A low-temperature joining method effectively suppresses reductions in the mechanical properties of a junction of various types of high-tensile steel or aluminum, and of a heat-affected zone; and produces a joint structure. A method for joining two metal materials by forming a joint interface in which the two metal materials face each other at a joint portion and plunge a rotation tool caused to rotate at a prescribed speed into the joint, the method for low-temperature joining of metal materials characterized in that the peripheral velocity of the outermost periphery of the rotation tool is set to 51 mm/s or less, whereby the recrystallization temperature inherent to the metal materials is reduced by introducing a large strain to the joint, and recrystallized grains are generated at the joint interface by setting the joining temperature to less than the recrystallization temperature inherent to the metal materials.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: April 23, 2024
    Assignee: OSAKA UNIVERSITY
    Inventors: Hidetoshi Fujii, Rintaro Ueji, Yoshiaki Morisada
  • Patent number: 11872651
    Abstract: A dissimilar material solid phase bonding method is disclosed wherein one member and another member having different compositions are brought into contact with one another by way of an insert material to form an interface (1) to be bonded, at which the one member and the insert material are in contact with one another, and an interface (2) to be bonded, at which the other member and the insert material are in contact with one another; the temperature of the interface (1) to be bonded and the interface (2) to be bonded is raised by means of frictional heat and/or by electrical heating; a bonding pressure (1) is applied substantially perpendicular to the interface (1) to be bonded; a bonding pressure (2) is applied substantially perpendicular to the interface (2) to be bonded; and the bonding pressure (1) and the bonding pressure (2) are set to different values.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: January 16, 2024
    Assignee: OSAKA UNIVERSITY
    Inventors: Hidetoshi Fujii, Yoshiaki Morisada, Yasuhiro Aoki, Masayoshi Kamai
  • Patent number: 11813693
    Abstract: A friction stir welding tool member according to the present embodiment has a shoulder portion and a probe portion concentrically projecting from an upper surface of the shoulder portion. The shoulder portion includes a curved surface processed portion that is curved to have a curved shape on an outer peripheral edge of the shoulder portion. A space occupancy occupied by the two-dimensional space in which neither the shoulder portion nor the probe portion exists is in a range of 30% to 70%, the space occupancy being determined based on a projection drawing of a side surface region surrounded from a tip of the probe portion to the curved surface processed portion of the shoulder portion.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: November 14, 2023
    Assignees: OSAKA UNIVERSITY, TOSHIBA MATERIALS CO., LTD.
    Inventors: Hidetoshi Fujii, Yoshiaki Morisada, Kai Funaki, Masahiro Kato, Takayuki Fukasawa, Yutaka Abe
  • Publication number: 20230339039
    Abstract: The objective of the present invention is to provide a friction pressure welding method with which the welding temperature can be controlled accurately, the welding temperature can be lowered, and the distribution of the welding temperature at an interface to be welded can be made uniform; and to provide a welded structure obtained by this method. The present invention relates to the friction pressure welding method in which one member is abutted against another member and is made to slide in a state in which a welding pressure substantially perpendicular to the interface to be welded is applied, said friction pressure welding method being characterized in that the maximum sliding speed is no greater than 53 mm/sec, the difference in the temperature increase rate between a center portion and an outer peripheral portion at the interface to be welded is 10° C.
    Type: Application
    Filed: September 1, 2021
    Publication date: October 26, 2023
    Inventors: Hidetoshi FUJII, Huihong LIU, Yoshiaki MORISADA
  • Patent number: 11745287
    Abstract: To provide a solid phase welding method and a solid phase welding apparatus which are possible to accurately control the welding temperature, to lower the welding temperature and to achieve a solid phase welding of the metallic materials. The present invention provides a solid phase welding method for metallic materials comprising, a first step of forming an interface to be welded by abutting end portions of one material to be welded and the other material to be welded and applying a pressure in a direction substantially perpendicular to the interface to be welded, a second step of raising a temperature of the vicinity of the interface to be welded to a welding temperature by an external heating means, wherein the pressure is set to equal to or more than the yield strength of the one material to be welded and/or the other material to be welded at the welding temperature.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: September 5, 2023
    Assignee: OSAKA UNIVERSITY
    Inventors: Hidetoshi Fujii, Yoshiaki Morisada, Huihong Liu, Yasuhiro Aoki, Masayoshi Kamai
  • Publication number: 20230192480
    Abstract: A method for manufacturing a structural layer in a silicon wafer is provide. The silicon wafer has at least two areas vertically recessed to at least two recess depths, with the first recess depth being greater than the second recess depth. The method includes forming a silicon dioxide pattern, a mask layer and a silicon dioxide pad layer, etching the structural layer in a main LOCOS oxidation process, and removing the formed layers exposing the recessed structural layer. The manufactured structural layer has a bump structure with the recess depth smaller than the second recess depth, and the recessed area has no edge steps.
    Type: Application
    Filed: December 15, 2022
    Publication date: June 22, 2023
    Inventors: Altti TORKKELI, Hidetoshi FUJII
  • Publication number: 20230138076
    Abstract: The present invention provides: a solid-phase spot-welding method with which the welding temperature can be controlled accurately and with which a reduction in the welding temperature can be achieved, regardless of the type of metal material being welded; and a solid-phase spot-welding device that can be used suitably in this solid-phase spot-welding method.
    Type: Application
    Filed: March 9, 2021
    Publication date: May 4, 2023
    Inventors: Hidetoshi FUJII, Yoshiaki MORISADA, Masayoshi KAMAI, Takumi AIBARA
  • Patent number: 11639064
    Abstract: An image forming method includes discharging ink containing water, a coloring material, a polymerization initiator, and a polymerizable compound to a recording medium by a line head to obtain an image, exposing the image to active energy radiation, applying a processing fluid to the image, and drying the image with heat, wherein the time interval between when the ink is discharged in the discharging from the line head to the recording medium passing under a bottom portion of the line head and when the recording medium is exposed to the active energy radiation in the exposing is from 0.5 to 15 seconds.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: May 2, 2023
    Assignee: RICOH COMPANY, LTD.
    Inventors: Takuya Saiga, Hidetoshi Fujii, Shigeyuki Harada, Yuya Hirokawa
  • Patent number: 11534854
    Abstract: Provided are a long-life and inexpensive friction stir welding tool that is not dependent on the mode of friction stir welding or the type of material to be welded, and a friction stir welding method using the friction stir welding tool. The friction stir welding tool comprises a body portion having a shoulder portion, and a probe portion disposed on a bottom surface of the body portion, and is characterized in that the probe portion is spherical-crown shaped. Preferably, the shoulder portion is flat or convex, and preferably the hardness of the shoulder portion is greater than the hardness of the probe portion.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: December 27, 2022
    Assignee: OSAKA UNIVERSITY
    Inventors: Hidetoshi Fujii, Yoshiaki Morisada, Yasuhiro Aoki, Akihiko Ikuta
  • Patent number: 11524893
    Abstract: The disclosure relates to a method for manufacturing recessed micromechanical structures in a MEMS device wafer. First vertical trenches in the device wafer define the horizontal dimensions of both level and recessed structures. The horizontal face of the device wafer and the vertical sidewalls of the first vertical trenches are then covered with a self-supporting etching mask which is made of a self-supporting mask material, which is sufficiently rigid to remain standing vertically in the location where it was deposited even as the sidewall upon which it was deposited is etched away. Recess trenches are then etched under the protection of the self-supporting mask. The method allows a spike-preventing aggressive etch to be used for forming the recess trenches, without harming the sidewalls in the first vertical trenches.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: December 13, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hidetoshi Fujii
  • Publication number: 20220371120
    Abstract: A dissimilar material solid phase bonding method is disclosed wherein one member and another member having different compositions are brought into contact with one another by way of an insert material to form an interface (1) to be bonded, at which the one member and the insert material are in contact with one another, and an interface (2) to be bonded, at which the other member and the insert material are in contact with one another; the temperature of the interface (1) to be bonded and the interface (2) to be bonded is raised by means of frictional heat and/or by electrical heating; a bonding pressure (1) is applied substantially perpendicular to the interface (1) to be bonded; a bonding pressure (2) is applied substantially perpendicular to the interface (2) to be bonded; and the bonding pressure (1) and the bonding pressure (2) are set to different values.
    Type: Application
    Filed: October 28, 2020
    Publication date: November 24, 2022
    Applicant: OSAKA UNIVERSITY
    Inventors: Hidetoshi Fujii, Yoshiaki Morisada, Yasuhiro Aoki, Masayoshi Kamai
  • Patent number: 11414557
    Abstract: An active-energy-ray-polymerizable initiator having a structure represented by the following general formula (1) is provided. In general formula (1), L1 represents —C(?O)—O— (binding to L2 side) or —O—, L2 represents —O(CH2)p-(binding to L1 side), —(OC2H4)n-(binding to L1 side), or —(OC3H6)m-(binding to L1 side), where p represents an integer of 2 to 16, n represents an integer of 2 to 12, and m represents 2 or 3, L3 represents a direct binding or —NH—, L4 represents —OC2H4-(binding to L3 side) or —(OC2H4)2-(binding to L3 side), and R represents —H or —CH3.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: August 16, 2022
    Assignee: RICOH COMPANY, LTD.
    Inventors: Shigeyuki Harada, Hidetoshi Fujii
  • Publication number: 20220162723
    Abstract: Provided are an effective and simple surface-modifying method for prolonging the life of a steel structure made of a steel material having a high sulfur (S) content, and a steel structure having a life prolonged by the surface-modifying method. A surface-modifying method for forming a friction stir region on the surface of a steel material by friction stir processing, wherein a sulfur (S) content of the steel material is 200 ppm or more.
    Type: Application
    Filed: March 2, 2020
    Publication date: May 26, 2022
    Applicant: OSAKA UNIVERSITY
    Inventors: Hidetoshi Fujii, Yoshiaki Morisada, Yasuhiro Aoki
  • Publication number: 20220145435
    Abstract: The present invention provides a weathering steel for solid-state welding that forms an excellent weld when subjected to solid-state welding and has tensile properties equivalent or superior to those of high tensile strength steel, said steel having weathering properties superior to those of conventional weathering steel for welding, wherein the reliability of the weld is equivalent or superior to that of the parent material; and a weathering steel material for solid-state welding. Further, there is provided a solid-state welded structure that includes the weathering steel for solid-state welding according to the present invention, and a solid-state welding method for said weathering steel for solid-state welding. The weathering steel for solid-state welding having a steel composition comprises, in % by mass, C: 0.10 to 0.60% and P: more than 0.035 to 1.000%, with the remainder consisting of Fe and unavoidable impurities.
    Type: Application
    Filed: February 20, 2020
    Publication date: May 12, 2022
    Applicant: OSAKA UNIVERSITY
    Inventors: Hidetoshi Fujii, Kohsaku Ushioda, Tomoya Nagira, Yoshiaki Morisada
  • Publication number: 20220126605
    Abstract: An image forming method includes discharging ink containing water, a coloring material, a polymerization initiator, and a polymerizable compound to a recording medium by a line head to obtain an image, exposing the image to active energy radiation, applying a processing fluid to the image, and drying the image with heat, wherein the time interval between when the ink is discharged in the discharging from the line head to the recording medium passing under a bottom portion of the line head and when the recording medium is exposed to the active energy radiation in the exposing is from 0.5 to 15 seconds.
    Type: Application
    Filed: October 20, 2021
    Publication date: April 28, 2022
    Applicant: Ricoh Company, Ltd.
    Inventors: Takuya Saiga, Hidetoshi Fujii, Shigeyuki Harada, Yuya Hirokawa
  • Patent number: 11273518
    Abstract: A linear friction welding method capable of accurately controlling a welding temperature and capable of lowering the welding temperature is provided. The present invention is a linear friction welding method comprising: a first step of forming a welded interface by bringing one member into contact with the other member; a second step of repeatedly sliding one member and the other member on the same locus and discharging flash from the welded interface in a state where pressure is applied substantially perpendicularly to the welded interface; and a third step of forming a welded surface by stopping the sliding and setting the pressure to be not less than the yield stress and not more than the tensile strength of one member and/or the other member at a desired welding temperature.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: March 15, 2022
    Assignee: OSAKA UNIVERSITY
    Inventors: Hidetoshi Fujii, Yoshiaki Morisada, Yasuhiro Aoki, Masanori Yasuyama, Gen Murayama
  • Publication number: 20220001486
    Abstract: A friction stir welding tool (1) has a shoulder portion (2) and a probe portion (6) provided on a bottom surface of the shoulder portion (2). The probe portion (6) has a length of 5.5 mm or more. In the friction stir welding tool (1), a ceramic material whose main phase is silicon nitride or sialon is used as a base material.
    Type: Application
    Filed: March 6, 2020
    Publication date: January 6, 2022
    Inventors: Hidetoshi FUJII, Yoshiaki MORISADA, Yusuke KATSU, Hiroki TAKEUCHI