Abstract: According to one embodiment, a semiconductor image pickup device includes a pixel area and a non-pixel area. The device includes a first photoelectric conversion element formed in the pixel area, a first transistor formed in the pixel area and connected to the first photoelectric conversion element, a second photoelectric conversion element formed in the non-pixel area, a second transistor formed in the non-pixel area and connected to the second photoelectric conversion element, a metal wire formed at least in the non-pixel area, a first cap layer formed on the metal wire to prevent diffusion of metal contained in the metal wire, and a dummy via wire formed in the non-pixel area and penetrating the first cap layer.

Abstract: According to one embodiment, a semiconductor image pickup device includes a pixel area and a non-pixel area. The device includes a first photoelectric conversion element formed in the pixel area, a first transistor formed in the pixel area and connected to the first photoelectric conversion element, a second photoelectric conversion element formed in the non-pixel area, a second transistor formed in the non-pixel area and connected to the second photoelectric conversion element, a metal wire formed at least in the non-pixel area, a first cap layer formed on the metal wire to prevent diffusion of metal contained in the metal wire, and a dummy via wire formed in the non-pixel area and penetrating the first cap layer.

Abstract: According to one embodiment, a semiconductor image pickup device includes a pixel area and a non-pixel area. The device includes a first photoelectric conversion element formed in the pixel area, a first transistor formed in the pixel area and connected to the first photoelectric conversion element, a second photoelectric conversion element formed in the non-pixel area, a second transistor formed in the non-pixel area and connected to the second photoelectric conversion element, a metal wire formed at least in the non-pixel area, a first cap layer formed on the metal wire to prevent diffusion of metal contained in the metal wire, and a dummy via wire formed in the non-pixel area and penetrating the first cap layer.

Abstract: According to one embodiment, an interface control apparatus includes an interface, a table, a command processor, and a controller. The interface transmits and receives information to and from a host. The table holds management information for managing an address in a memory space in the host. The command processor carries out a command process of accessing the memory space in the host using the management information. The controller releases the management information corresponding to the command process from the table in response to completion of the command process.

Abstract: According to one embodiment, in a semiconductor device, a semiconductor substrate has a first surface and a second surface which is opposed to the first surface. An insulating layer is provided on the first surface of the semiconductor substrate. A metal wiring is provided within the insulating layer. A support substrate is bonded to the insulating layer. A poly silicon electrode is connected to the metal wiring through a contact. A pad is provided on the second surface of the semiconductor substrate and is connected to the poly silicon electrode through a metal film deposited in a via-hole to penetrate the semiconductor substrate and extend to the poly silicon electrode.

Abstract: According to one embodiment, an interface control apparatus includes an interface, and a controller. The interface is configured to transmit information between a host and a data storage apparatus. The controller is configured to fetch request information making a processing request for the data storage apparatus, from an element being a storage unit of a queue provided on the host through the interface. The controller is configured to execute read request processing of fetching first request information divided into a plurality of elements and stored, with priority over second request information which is different from the first request information, when the request information is fetched.

Abstract: According to one embodiment, a semiconductor image pickup device includes a pixel area and a non-pixel area. The device includes a first photoelectric conversion element formed in the pixel area, a first transistor formed in the pixel area and connected to the first photoelectric conversion element, a second photoelectric conversion element formed in the non-pixel area, a second transistor formed in the non-pixel area and connected to the second photoelectric conversion element, a metal wire formed at least in the non-pixel area, a first cap layer formed on the metal wire to prevent diffusion of metal contained in the metal wire, and a dummy via wire formed in the non-pixel area and penetrating the first cap layer.

Abstract: According to one embodiment, a semiconductor image pickup device includes a pixel area and a non-pixel area. The device includes a first photoelectric conversion element formed in the pixel area, a first transistor formed in the pixel area and connected to the first photoelectric conversion element, a second photoelectric conversion element formed in the non-pixel area, a second transistor formed in the non-pixel area and connected to the second photoelectric conversion element, a metal wire formed at least in the non-pixel area, a first cap layer formed on the metal wire to prevent diffusion of metal contained in the metal wire, and a dummy via wire formed in the non-pixel area and penetrating the first cap layer.

Abstract: According to one embodiment, a solid-state imaging device includes a photodiode includes an N-type region and a P-type region, a floating diffusion region, and a transfer transistor. The N-type diffusion region of the photodiode comprises a first semiconductor region and a second semiconductor region formed shallower than the first semiconductor region. An end portion of the first semiconductor region is positioned on the floating diffusion region side rather than an end portion of a gate electrode of the transfer transistor. An end portion of the second semiconductor region is set in substantially the same position as that of the end portion of the gate electrode of the transfer transistor.

Abstract: According to one embodiment, a solid-state imaging device includes a photodiode includes an N-type region and a P-type region, a floating diffusion region, and a transfer transistor. The N-type diffusion region of the photodiode comprises a first semiconductor region and a second semiconductor region formed shallower than the first semiconductor region. An end portion of the first semiconductor region is positioned on the floating diffusion region side rather than an end portion of a gate electrode of the transfer transistor. An end portion of the second semiconductor region is set in substantially the same position as that of the end portion of the gate electrode of the transfer transistor.

Abstract: According to one embodiment, an interface control apparatus includes an interface, a table, a command processor, and a controller. The interface transmits and receives information to and from a host. The table holds management information for managing an address in a memory space in the host. The command processor carries out a command process of accessing the memory space in the host using the management information. The controller releases the management information corresponding to the command process from the table in response to completion of the command process.

Abstract: Error correction is carried out on first data stored in an external memory after determining that the first data contains a correctable error. Prior to starting the error correction of the first data, other accesses to the first data are blocked. Thereafter, the first data is corrected and overwritten by the corrected data (second data). After storing the second data in the external memory, accesses to the second data are permitted.

Abstract: Photoelectric conversion elements are arranged in a pixel area. A circuit area is arranged around the pixel area. An interconnect including copper is arranged in the pixel area and circuit area. A cap layer is arranged on the interconnect. Wherein the cap layer except a part on the interconnect is removed from the pixel area and circuit area.

Abstract: According to one embodiment, an interface control apparatus includes an interface, and a controller. The interface is configured to transmit information between a host and a data storage apparatus. The controller is configured to fetch request information making a processing request for the data storage apparatus, from an element being a storage unit of a queue provided on the host through the interface. The controller is configured to execute read request processing of fetching first request information divided into a plurality of elements and stored, with priority over second request information which is different from the first request information, when the request information is fetched.

Abstract: According to one embodiment, a solid-state imaging device includes a semiconductor layer including first and second regions, a pixel portion provided in the first region, electrodes provided in the second region and configured to penetrate the semiconductor layer, and a guard ring provided in the second region and configured to penetrate the semiconductor layer and electrically isolate the pixel portion from the electrodes. An upper surface of the semiconductor layer in the second region is lower than an upper surface of the semiconductor layer in the first region.

Abstract: According to one embodiment, in a semiconductor device, a semiconductor substrate has a first surface and a second surface which is opposed to the first surface. An insulating layer is provided on the first surface of the semiconductor substrate. A metal wiring is provided within the insulating layer. A support substrate is bonded to the insulating layer. A poly silicon electrode is connected to the metal wiring through a contact. A pad is provided on the second surface of the semiconductor substrate and is connected to the poly silicon electrode through a metal film deposited in a via-hole to penetrate the semiconductor substrate and extend to the poly silicon electrode.

Abstract: According to one embodiment, a data storage control apparatus includes an interface module and a controller. The interface module receives first data, in specific units, from a host and stores the data in a buffer memory. The controller generates second data from the first data stored in the buffer memory, and performs a control to write the second data to a nonvolatile storage medium. The controller generates the second data of a second format having the same size as the first format of the data stored in an ordinary recording area provided at the nonvolatile storage medium, and including a plurality of units of the first data and invalid data. The controller further performs a control to write the second data in a save area provided on the nonvolatile storage medium.

Abstract: According to one embodiment, a solid state imaging device includes a pixel region to be used for generating pixels, a black reference region provided outside the pixel region, and a dummy region provided between the black reference region and the pixel region, and including a light shielding pattern configured to shield the black reference against light coming from the pixel region.

Abstract: According to one embodiment, a solid-state imaging device includes a semiconductor substrate of a first conductive type having a diffusion layer region provided on a surface thereof, a diffusion layer of the first conductive type for a pixel separation whose bottom portion is formed at the deepest position of the diffusion layer region in a pixel region, and a first deep diffusion layer of the first conductive type provided at the deepest position of the diffusion layer region in a first peripheral logic region for electrically connecting the semiconductor substrate and the first peripheral logic region and having a first concentration gradient equal to that of the diffusion layer for pixel separation.

Abstract: According to one embodiment, a solid-state imaging device includes a semiconductor substrate of a first conductive type having a diffusion layer region provided on a surface thereof, a diffusion layer of the first conductive type for a pixel separation whose bottom portion is formed at the deepest position of the diffusion layer region in a pixel region, and a first deep diffusion layer of the first conductive type provided at the deepest position of the diffusion layer region in a first peripheral logic region for electrically connecting the semiconductor substrate and the first peripheral logic region and having a first concentration gradient equal to that of the diffusion layer for pixel separation.