Abstract: The present invention provides a notebook PC with a monitor that enables a user to have better handling of the PC and viewing of the display of the device when using the PC. A PC includes a monitor and a main unit that are connected to each other by an arm through a first hinge portion and a second hinge portion. In the present invention, the angle of tilting of the monitor is constantly maintained even when the position in height of the monitor is changed.

Abstract: An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more; and (D) a silicone oil having at least one amino group per molecule. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Abstract: To provide a docking station for a portable computer, which increases its heat radiation when the docking station is docked with the portable computer. A docking station is equipped with a fan unit at a back portion of a power supply unit within a station body, and a front surface of a connection portion with which a notebook PC is docked is provided with an air suction opening. Thereby, once the fan unit is driven, high temperature air is exhausted from a station body and the connection portion, then outside air is introduced from the suction opening to stimulate the cooling of the connection portion, and the heat which is transferred from a back side portion of the notebook PC to the connection portion is also dissipated there to stimulate the cooling of the notebook PC side.

Abstract: There are provided motherboard 7, signal line 12 formed on motherboard 7, multiple ground lines 13 formed spaced apart and substantially in parallel with each other adjacent signal line 12, card board 10, signal line 14 formed on card board 10, multiple ground lines 15 formed spaced apart and substantially in parallel with each other adjacent signal line 14, and line connector 9, and signal line 12 and signal line 14 are connected by conductor 16 in connector 9, while ground lines 13 and ground lines 15 are connected by conductor 17 in connector 9. Radio frequency module 11 is connected to signal line 14, and signal line 12 is connected to an antenna through radio frequency receptacle 8. A radio frequency signal is transmitted through signal line 12, conductor 16, and signal line 14 with a low insertion loss.

Abstract: The invention relates to an electrical device, of which one example is a laptop-type PC provided with a PC body and a keyboard configured as an input unit to be detachable from the PC body. Such a PC is equipped with the detachable keyboard which can be used either in a wired system or a wireless system in a state separated from the PC body. The invention allows for the input unit to automatically switch between wired and wireless operation depending on the state of connectivity between the input unit and the electrical device. The invention also provides at least two different, advantageous positions of wired integration between the input unit and the electrical device.

Abstract: [Object]

Abstract: A first antenna and a second antenna in first and second antenna-only areas of each face of an insulating substrate are arranged to decrease an antenna system having a plurality of antennas in size as the first antenna-only area and the second antenna-only area at least overlap with each other when viewed from a direction vertical to a face of the insulating substrate.

Abstract: An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Abstract: There are provided motherboard 7, signal line 12 formed on motherboard 7, multiple ground lines 13 formed spaced apart and substantially in parallel with each other adjacent signal line 12, card board 10, signal line 14 formed on card board 10, multiple ground lines 15 formed spaced apart and substantially in parallel with each other adjacent signal line 14, and line connector 9, and signal line 12 and signal line 14 are connected by conductor 16 in connector 9, while ground lines 13 and ground lines 15 are connected by conductor 17 in connector 9. Radio frequency module 11 is connected to signal line 14, and signal line 12 is connected to an antenna through radio frequency receptacle 8. A radio frequency signal is transmitted through signal line 12, conductor 16, and signal line 14 with a low insertion loss.

Abstract: A docking station is provided with a floppy disk drive and a CD-ROM drive used to extend a function of a lap-top PC. A station body has a pocket formed so as to house and hold the lap-top PC therein. The docking station is of a vertical type and the lap-top PC is also held as a vertical position therein. Consequently, the docking station is effective in space-saving. In addition, because the lap-top PC can be docked to the docking station from the front side of the docking station, the docking can be done safely and easily.

Abstract: Object

Abstract: In a notebook type computer terminal, a plate type slot antenna is provided between a display panel and a surrounding wall of a display panel housing so that a radiator portion thereof is projecting from a frame of the display panel and a stay, which are made of conductive material by a length more than a predetermined dimension S. A ground portion of the antenna is connected not only to a ground of a radio transceiver unit but also to the display panel housing made of conductive material through the stay.

Abstract: There are provided a circuit-forming substrate comprising a long stainless steel foil having formed on one surface or both surfaces thereof a polyimide resin layer wholly or partially, and a circuit substrate formed by using the circuit-forming substrate, wherein a conductor layer is finely patterned on the circuit-forming substrate. The circuit-forming substrate sufficiently satisfies low cost, high density and high reliability, scarcely causes warping of the substrate itself, and has excellent workability.

Abstract: To provide a docking station for a portable computer, which increases its heat radiation when the docking station is docked with the portable computer. A docking station is equipped with a fan unit at a back portion of a power supply unit within a station body, and a front surface of a connection portion with which a notebook PC is docked is provided with an air suction opening. Thereby, once the fan unit is driven, high temperature air is exhausted from a station body and the connection portion, then outside air is introduced from the suction opening to stimulate the cooling of the connection portion, and the heat which is transferred from a back side portion of the notebook PC to the connection portion is also dissipated there to stimulate the cooling of the notebook PC side.

Abstract: A connector for achieving stabilization of operation of electronic equipment against EMI/ESD by reinforcing grounding of an entire connector is provided for. An interface connector has protruding portions formed on a top face and bottom face of a metal shell, wherein the height of these protruding portions is in a predetermined relationship to one another, such that the connector and connector connection structure provide: a reduction in the contact resistance in fitting portions of connectors, and hence an improvement in conductivity.

Abstract: A flap actuation mechanism is provided with flaps for opening an aperture formed in the housing of a notebook sized personal computer. A first shaft portion and a second shaft portion rotatably support rotating plates bent and formed in the flaps and an insertion mouth is formed in the abutting surfaces of the flaps. An opening pin is inserted into the insertion mouth from the outside. The positions of the first shaft portion and the second shaft portion are set according to the height of the rotating plates so that the moment of rotation for opening the flap outside the housing is greater than the moment of rotation for rotating the flap inside the housing. With this, it becomes possible to reduce the height of the rotating plates and therefore the flap actuation mechanism can be made thin.

Abstract: An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Abstract: There are provided a circuit-forming substrate comprising a long stainless steel foil having formed on one surface or both surfaces thereof a polyimide resin layer wholly or partially, and a circuit substrate formed by using the circuit-forming substrate, wherein a conductor layer is finely patterned on the circuit-forming substrate. The circuit-forming substrate sufficiently satisfies low cost, high density and high reliability, scarcely causes warping of the substrate itself, and has excellent workability.

Abstract: A semiconductor device in which the space between a semiconductor chip and an auxiliary wiring plate is sealed with resin. The auxiliary wiring plate has insulating layers and on both sides of the routing conductor, the insulating layer on the side of the semiconductor chip has a hole being led from the routing conductor to the electrode of the semiconductor chip, the metal filled in the hole and the metal bump formed so as to protrude from the hole serves as an inner electrode. The semiconductor device can be manufactured by the TAB technique.

Abstract: A semiconductor device capable of preventing the occurrence of defect of electroconductivity, wherein a semiconductor chip 1 equipped with electrodes 11 is mounted on an auxiliary wiring plate 2 in the state of facing the surface of the electrode 11 side, leading conductors 23 are disposed in the inside of the auxiliary wiring plate 2, one end of each leading conductor 23 forms an internal electrode 21 projecting from the surface of the auxiliary wiring plate 2 at the side of mounting the semiconductor chip 1, the other end of the leading conductor 23 forms an external electrode 22 projecting from the surface of the auxiliary wiring plate opposite to the side of mounting the semiconductor chip 1, and each of the internal electrodes 21 is connected to each of the electrodes 11 of the semiconductor chip 1, at least a gap between the semiconductor chip 1 and the auxiliary wiring plate 2 is encapsulated with a heat-welding polyimide resin layer.