Abstract: A portable electronic tool comprising a body for the portable electronic tool; a cable; and an engaging mechanism, so that the cable is stored while the cable is wound by the engaging mechanism around the external surface of the electronic tool body. A first and a second protrusion are provided at the respective ends of the body and prevent the cable from slipping off the body when the cable is wound around the body. The engaging mechanism includes a terminal tool, which is provided at the distal end of the cable, and a recessed portion, which is provided in the first protrusion, wherein the terminal tool is retained. A guide member is provided to guide, in a direction in which the cable is wound, the base end portion of the cable so as to prevent the base end of the cable from being projected outward from the body when the cable is wound around the body. The terminal tool is so designed that selective attachment of various types of plugs is possible.

Abstract: A docking device for a portable computer which can be utilized with a number of portable computers having diverse sizes is disclosed. The docking device includes a body having a number of electronic components disposed therein adapted to be electrically connected to a portable computer. A surface supported by the body is adapted to slidably receive a portable computer selected from among the number of portable computers having diverse sizes. Adjacent to the surface, at least two electrical connectors are disposed, including a first connector rotatably supported by the body which is rotatable between a first position and a second position. The selected portable computer may be electrically connected to the number of electrical components via only the first electrical connector when the first electrical connector is in the first position and may be electrically connected to the number of electronic components via only the second electrical connector when the first electrical connector is in the second position.

Abstract: A semiconductor device in which a semiconductor chip is encapsulated in an epoxy resin composition comprising (A) an epoxy resin represented by formula (I): ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, and R.sub.4 each represents an alkyl group having from 1 to 4 carbon atoms, and (B) a reaction product obtained by preliminarily reacting a silane compound represented by formula (II): ##STR2## wherein X represents a monovalent organic group having at least one functional group selected from the group consisting of a glycidyl group, an amino group, and a mercapto group; Y represents an alkoxy group having from 1 to 4 carbon atoms; and n represents 0, 1 or 2, with a phenol aralkyl resin represented by formula (III) ##STR3## wherein m represents 0 or a positive integer. The epoxy resin composition has low moisture absorption and low stress to provide a semiconductor device excellent in thermal crack resistance and moisture resistance.

Abstract: A support is constructed and arranged to absorb a tangential force component of an impact force applied to the steering wheel of the steering column.