Abstract: A light-emitting element includes: a support substrate; a semiconductor stacked body disposed on the support substrate, the semiconductor stacked body including a first semiconductor layer, a second semiconductor layer, and a light-emitting layer provided between the first semiconductor layer and the second semiconductor layer; an insulating film including a first opening disposed above the first semiconductor layer and a plurality of second openings disposed above the second semiconductor layer; a first pad electrode disposed on the insulating film and electrically connected to the first semiconductor layer at the first opening; a second pad electrode disposed on the insulating film and electrically connected to the second semiconductor layer at the plurality of second openings; and a third pad electrode disposed on the insulating film and electrically insulated from the semiconductor stacked body.

Abstract: A method for manufacturing a light-emitting device includes: providing an intermediate body having a first ultraviolet transmitting layer, a first adhesive layer, a plurality of first light emitting elements, a second adhesive layer, and a second ultraviolet transmitting layer; disposing on the second ultraviolet transmitting layer of the intermediate body, an ultraviolet shielding layer in a region corresponding to a part of the first light-emitting elements; performing first ultraviolet irradiation of irradiating the intermediate body with ultraviolet from a direction facing the ultraviolet shielding layer; performing second ultraviolet irradiation of irradiating the intermediate body with ultraviolet from a direction facing the first ultraviolet transmitting layer; and separating the part of the first light-emitting elements from the first adhesive layer along with the second adhesive layer.

Abstract: A light emitting device includes: a plurality of element structural bodies, each including: a substrate, a light emitting element mounted on or above the substrate, and a light-transmissive member disposed on or above the light emitting element, wherein at least three of the plurality of element structural bodies are disposed along a first direction; a first covering member that covers lateral surfaces of the substrate, the light emitting element, and the light-transmissive member of each of the plurality of element structural bodies; and a support member that covers a lateral surface of the first covering member, wherein at least a portion of the support member is disposed lateral to the plurality of element structural bodies and extends along the first direction. A rigidity of the support member is greater than a rigidity of the first covering member.

Abstract: A method for manufacturing a light-emitting device includes preparing light-emitting elements, each including a semiconductor structure body that includes a first surface including recesses, a second surface, and a lateral surface. The method includes disposing the light-emitting elements on an adhesive sheet member so that the second surfaces face the sheet member and the lateral surfaces are covered with the sheet member. The method includes causing a first member to contact the first surfaces so that the first member is located inside the recesses and located between the sheet member and a second member in a state in which the second member is located on the first member. The first member includes a transmissive uncured resin member. The second member includes a wavelength conversion material and has a higher hardness than the uncured resin member. The method includes curing the first member, and removing the sheet member.

Abstract: A method for manufacturing a light-emitting device includes preparing first and second members. The first member includes first elements having first bonding parts. The second member includes a wiring substrate and second bonding parts. The method includes bonding the first bonding part and the second bonding part at a first bonding condition. The method includes evaluating an electrical characteristic of the first elements. The method includes removing, from the wiring substrate, a defective first element determined by the evaluation to be defective. The method includes placing a second element having a third bonding part on a region of the wiring substrate at which the defective first element had been removed. The method includes bonding the first bonding part and the second bonding part, and the third bonding part and the second bonding part at a second bonding condition.

Abstract: A light emitting element includes: a semiconductor layered structure; a first electrically insulating film covering surfaces of the semiconductor layered structure and defining a first opening in each of a first region and a second region of a first semiconductor layer, and defining a second opening in a portion above a second semiconductor layer; a first electrode electrically connected to the first semiconductor layer through each first opening; a second electrode electrically connected to the second semiconductor layer through the second opening; a first terminal located on the first electrode and electrically connected to the first electrode; a second terminal located on the second electrode and electrically connected to the second electrode; and a metal member located on a portion of the first electrically insulating film located over the second semiconductor layer and electrically insulated from the first terminal and the second terminal.

Abstract: A light emitting device that includes a plurality of element structures, a frame, and a covering member. Each of the plurality of element structures includes a light emitting element. The frame surrounds the plurality of element structures. The covering member is disposed on an inner side of the frame. The covering member is disposed between the frame and an element structure of the plurality of element structures adjacent to the frame and between adjacent element structures of the plurality of element structures. An upper surface and a lower surface of each of the plurality of element structures are exposed from the covering member.

Abstract: A method of manufacturing a light-emitting device that includes providing a plurality of element structures, each of which includes a submount substrate, a light-emitting element, and a light-transmissive member in this order. The method further includes disposing the plurality of element structures such that the light-transmissive members face a sheet member, and forming a covering member on the sheet member to cover at least a portion of each of lateral surfaces of the submount substrate of each of the element structures.

Abstract: A light emitting device including a plurality of element structures each including a submount, a light emitting element, and a light transmissive member, in this order. The light emitting device further includes a first cover member holding the element structures by covering lateral faces of each of the element structures.

Abstract: A light-emitting device includes: a circuit board; and a light-emitting element mounted on the circuit board, the light-emitting element including: a substrate provided on the circuit board, the substrate having a first side along a first direction and a second side along the first direction, wherein a second direction from the first side toward the second side being is orthogonal to the first direction; n semiconductor stacked bodies (n being a natural number of 2 or more) provided on the substrate, the n semiconductor stacked bodies comprising a first semiconductor stacked body and a second semiconductor stacked body that are electrically insulated from each other; and n+1 interconnect layers.

Abstract: A light-emitting element includes: a semiconductor layered body including first and second semiconductor layers, the first semiconductor layer having a plurality of exposed portions exposed from the second semiconductor layer at locations inward of an outer periphery of the second semiconductor layer; an insulating film covering the semiconductor layered body and defining a first opening above the exposed portions and a second opening above a part of the second semiconductor layer; first and second electrodes electrically connected to the first and second semiconductor layer through the first and second openings, respectively; first bumps and second bumps disposed on the first and second electrodes, respectively. The first electrode and the second electrode have a first surface and a second surface, respectively, that are located at the same height from the second semiconductor layer. The first and second bumps are respectively connected to the first and second surfaces.

Abstract: A method of manufacturing a light emitting device includes: providing a plurality of first element structures each including a submount, a light emitting element, and a light transmissive member, in this order; disposing the first element structures on a sheet member such that the submount in each of the first element structures faces the sheet member; and forming a first cover member on the sheet member so as to cover lateral faces of the first element structures.

Abstract: A method of manufacturing a light-emitting module that includes providing a light-transmissive member joined body that includes a plurality of submounts, a plurality of light-emitting elements each of which is disposed on a respective one of submounts, and a single light-transmissive member disposed on the light-emitting elements. The method further includes disposing the light-transmissive member joined body on a module board such that the submounts face the module board, forming a plurality of element structures by dividing the single light-transmissive member for each light-emitting element into the element structures each of which includes the submount, the light-emitting element, and the light-transmissive member positioned in this order, and forming a first covering member on the module board to cover lateral surfaces of the element structures.

Abstract: A light emitting element includes: a semiconductor layered structure; a first electrically insulating film covering surfaces of the semiconductor layered structure and defining a first opening in each of a first region and a second region of a first semiconductor layer, and defining a second opening in a portion above a second semiconductor layer; a first electrode electrically connected to the first semiconductor layer through each first opening; a second electrode electrically connected to the second semiconductor layer through the second opening; a first terminal located on the first electrode and electrically connected to the first electrode; a second terminal located on the second electrode and electrically connected to the second electrode; and a metal member located on a portion of the first electrically insulating film located over the second semiconductor layer and electrically insulated from the first terminal and the second terminal.

Abstract: A light-emitting element includes: a base member including a first side and a second side, the first side and the second side being along a first direction, wherein a second direction from the first side toward the second side is orthogonal to the first direction; a semiconductor stacked body that is not electrically connected to the base member in a third direction, the third direction being orthogonal to a plane including the first direction and the second direction, the semiconductor stacked body comprising a p-type semiconductor layer, a light-emitting layer, and an n-type semiconductor layer; a first pad electrode that is not electrically connected to the base member in the third direction; a second pad electrode that is not electrically connected to the base member in the third direction; a first conductive layer; and a second conductive layer.

Abstract: A light-emitting device includes: a substrate; n light-emitting elements (n being a natural number of 2 or more) mounted on the substrate, each comprising a first bonding member electrically connected to a first semiconductor layer, and a second bonding member electrically connected to a second semiconductor layer; and n+1 interconnects provided on the substrate, the n+1 interconnects comprising a first interconnect comprising a first external connection portion, a second interconnect comprising a second external connection portion, and a third interconnect comprising a third external connection portion. In a top-view, the first light-emitting element is located between a first side of the substrate and a second light-emitting element, and the second light-emitting element is located between a first light-emitting element and a second side.

Abstract: A light emitting device includes: a plurality of element structural bodies, each including: a substrate, a light emitting element mounted on or above the substrate, and a light-transmissive member disposed on or above the light emitting element, wherein at least three of the plurality of element structural bodies are disposed along a first direction; a first covering member that covers lateral surfaces of the substrate, the light emitting element, and the light-transmissive member of each of the plurality of element structural bodies; and a support member that covers a lateral surface of the first covering member, wherein at least a portion of the support member is disposed lateral to the plurality of element structural bodies and extends along the first direction. A rigidity of the support member is greater than a rigidity of the first covering member.

Abstract: A method of manufacturing a light-emitting device that includes providing a plurality of element structures, each of which includes a submount substrate, a light-emitting element, and a light-transmissive member in this order. The method further includes disposing the plurality of element structures such that the light-transmissive members face a sheet member, and forming a covering member on the sheet member to cover at least a portion of each of lateral surfaces of the submount substrate of each of the element structures.

Abstract: A method of manufacturing a light-emitting module that includes providing a light-transmissive member joined body that includes a plurality of submounts, a plurality of light-emitting elements each of which is disposed on a respective one of submounts, and a single light-transmissive member disposed on the light-emitting elements. The method further includes disposing the light-transmissive member joined body on a module board such that the submounts face the module board, forming a plurality of element structures by dividing the single light-transmissive member for each light-emitting element into the element structures each of which includes the submount, the light-emitting element, and the light-transmissive member positioned in this order, and forming a first covering member on the module board to cover lateral surfaces of the element structures.

Abstract: A light-emitting device includes: a circuit board; and a light-emitting element mounted on the circuit board, the light-emitting element including: a substrate provided on the circuit board, the substrate having a first side along a first direction and a second side along the first direction, wherein a second direction from the first side toward the second side being is orthogonal to the first direction; n semiconductor stacked bodies (n being a natural number of 2 or more) provided on the substrate, the n semiconductor stacked bodies comprising a first semiconductor stacked body and a second semiconductor stacked body that are electrically insulated from each other; and n+1 interconnect layers.