Patents by Inventor Hiroaki Takezawa

Hiroaki Takezawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200243232
    Abstract: A rare-earth cobalt permanent magnet with good magnetic properties is provided. A rare-earth cobalt permanent magnet contains 23 to 27 mass % R, 3.5 to 5.0 mass % Cu, 18 to 25 mass % Fe, 1.5 to 3.0 mass % Zr in mass and a remainder Co with inevitable impurities, where an element R is a rare earth element at least containing Sm. The rare-earth cobalt permanent magnet has a metal structure including a plurality of crystal grains and a continuously extending grain boundary. A content of Cu in the grain boundary is higher than a content of Cu in the crystal grains, and a content of Zr in the grain boundary is higher than a content of Zr in the crystal grains.
    Type: Application
    Filed: October 7, 2016
    Publication date: July 30, 2020
    Inventors: Masaaki TAKEZAWA, Teruhiko FUJIWARA, Hiroaki MACHIDA, Hideyuki YOSHIKAWA
  • Patent number: 10329112
    Abstract: The present disclosure provides a drive transmission apparatus capable of reducing vibration of rotating member. The apparatus includes a shaft, a pin, and a rotating member. The rotating member is engaged with the shaft by the pin and rotates with the shaft. A protruded portion is provided on one of an outer circumferential surface of the shaft and an inner circumferential surface of the rotating member. The rotating member is attached to the shaft with the protruded portion in pressure contact with another one of the outer circumferential surface of the shaft and the inner circumferential surface of the rotating member, so that swinging of the rotating member around the pin is restricted.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: June 25, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiroaki Takezawa, Atsushi Yoshida
  • Publication number: 20180305161
    Abstract: The present disclosure provides a drive transmission apparatus capable of reducing vibration of rotating member. The apparatus includes a shaft, a pin, and a rotating member. The rotating member is engaged with the shaft by the pin and rotates with the shaft. A protruded portion is provided on one of an outer circumferential surface of the shaft and an inner circumferential surface of the rotating member. The rotating member is attached to the shaft with the protruded portion in pressure contact with another one of the outer circumferential surface of the shaft and the inner circumferential surface of the rotating member, so that swinging of the rotating member around the pin is restricted.
    Type: Application
    Filed: March 19, 2018
    Publication date: October 25, 2018
    Inventors: Hiroaki Takezawa, Atsushi Yoshida
  • Patent number: 7755893
    Abstract: The present invention provides a display apparatus that can achieve high durability by making the most of the function of the exhaust fans to effectively suppress the rise of the temperature. The display apparatus comprises a display panel for displaying images, a rear case covering a rear side of the display panel, and an exhaust fan disposed within the rear case, wherein the rear case includes a first air-hole area and a second air-hole area each provided with a plurality of air holes, the first air-hole area is located at a higher level than the second air-hole area with respect to a vertical direction with a spacing therebetween, and at least partially faces the exhaust fan, and an area surrounded by the first air-hole area, the second air-hole area and external common tangents thereof is a shielded area in which no air hole is provided.
    Type: Grant
    Filed: March 15, 2006
    Date of Patent: July 13, 2010
    Assignee: Panasonic Corporation
    Inventors: Hiroto Yanagawa, Hiroaki Takezawa
  • Patent number: 7705536
    Abstract: A display device is provided which is capable of inhibiting a localized elevation in the temperature of a casing thereby uniformalizing the surface temperature distribution over the casing. A display device includes: a display panel having surface arrays of plural pixels for displaying an image by light radiation control on a pixel to pixel basis; an electronic component forming a control circuit configured to perform the light radiation control; a casing housing the display panel and the electronic component therein; and a flat heat-conductive sheet interposed between the display panel and the casing and between the electronic component and the casing.
    Type: Grant
    Filed: January 25, 2006
    Date of Patent: April 27, 2010
    Assignee: Panasonic Corporation
    Inventors: Hiroto Yanagawa, Tetsuo Kawakita, Taketoshi Nakao, Hiroaki Takezawa, Kiyohide Amemiya
  • Publication number: 20090180042
    Abstract: A display apparatus including a display device, circuit boards on which circuits for driving the display device are formed, a chassis plate having a first surface to which the display device is mounted and a second surface to which the circuit boards are mounted, and a back cover fastened onto the second surface of the chassis plate by screws. The chassis plate has a first radiating rib, and the back cover has a second radiating rib that is in surface contact with the first radiating rib.
    Type: Application
    Filed: January 6, 2009
    Publication date: July 16, 2009
    Applicant: PANASONIC CORPORATION
    Inventors: Takayuki Furukawa, Miyoko Irikiin, Yukihiro Iwata, Shinya Ogasawara, Hiroaki Takezawa
  • Publication number: 20090009047
    Abstract: The present invention provides a display apparatus that can achieve high durability by making the most of the function of the exhaust fans to effectively suppress the rise of the temperature. The display apparatus comprises a display panel for displaying images, a rear case covering a rear side of the display panel, and an exhaust fan disposed within the rear case, wherein the rear case includes a first air-hole area and a second air-hole area each provided with a plurality of air holes, the first air-hole area is located at a higher level than the second air-hole area with respect to a vertical direction with a spacing therebetween, and at least partially faces the exhaust fan, and an area surrounded by the first air-hole area, the second air-hole area and external common tangents thereof is a shielded area in which no air hole is provided.
    Type: Application
    Filed: March 15, 2006
    Publication date: January 8, 2009
    Inventors: Hiroto Yanagawa, Hiroaki Takezawa
  • Patent number: 7468206
    Abstract: The present invention provides an organic ultra-thin film firmly fixed to a substrate with the film thickness ranging from tens of nm to hundreds of nm. The organic ultra-thin film comprises polymers fixed on a substrate by M2—O—A— bond in which A represents an Si, Ge, Ti, Sn or Zr atom in the polymer, and M2 represents an atom in the substrate) or by a coordinate bond, the polymers are combined with each other by —A1—O—A1?— bond in which A1 and A1? are Si, Ge, Ti, Sn, Zr or S or by a coordinate bond.
    Type: Grant
    Filed: December 17, 1997
    Date of Patent: December 23, 2008
    Assignee: Panasonic Corporation
    Inventors: Tadashi Ootake, Yasuo Takebe, Norihisa Mino, Hiroaki Takezawa
  • Publication number: 20080239634
    Abstract: A flat panel display device is provided which is capable of reliably inhibiting the surface temperature of a relevant portion of the casing of the flat panel display device from rising too much while efficiently cooling the inside of the casing. The flat panel display device (100) of the invention includes: a flat display panel (11); a front cover (15) having an opening matching a display surface of the flat display panel (11); and a casing (18) having a first casing section (20) and a second casing section (21) and covering a rear side of the flat display panel (11), the first casing section (20) having a lower thermal conductivity than the second casing section (21), extending upwardly from the second casing section (21), and being provided with a vent hole.
    Type: Application
    Filed: February 15, 2006
    Publication date: October 2, 2008
    Inventors: Taketoshi Nakao, Kiyohide Amemiya, Hiroaki Takezawa, Hiroto Yanagawa, Tetsuo Kawakita
  • Publication number: 20070216273
    Abstract: A display device is provided which is capable of inhibiting a localized elevation in the temperature of a casing thereby uniformalizing the surface temperature distribution over the casing. A display device (10) includes: a display panel (11) having surface arrays of plural pixels for displaying an image by light radiation control on a pixel to pixel basis; an electronic component (16a to 16f) forming a control circuit configured to perform the light radiation control; a casing (120) housing the display panel (11) and the electronic component (16a to 16f) therein; and a flat heat-conductive sheet (140) interposed between the display panel (11) and the casing (120) and between the electronic component (16a to 16f) and the casing (120).
    Type: Application
    Filed: January 25, 2006
    Publication date: September 20, 2007
    Inventors: Hiroto Yanagawa, Tetsuo Kawakita, Takatoshi Nakao, Hiroaki Takezawa, Kiyohide Amemiya
  • Patent number: 7151306
    Abstract: A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element. Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 ?m or more and to 10.0 ?m or less and preferably to 1.0 ?m or more and to 5.0 ?m or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.
    Type: Grant
    Filed: December 13, 2004
    Date of Patent: December 19, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takashi Kitae, Tsutomu Mitani, Yukihiro Ishimaru, Hiroaki Takezawa
  • Patent number: 6916433
    Abstract: A conductive adhesive comprises main components of a conductive filler and a binder resin, and a content of the conductive filler is in a range from 20 wt % to 70 wt %. It is preferable that at least a part of the conductive filler has protrusions. A dendrite metal filler is especially preferred. When this adhesive is compressed, the resin component is squeezed out, while the conductive filler component remains inside. As a result, the concentration of the conductive filler component is raised inside, and this is useful in connecting the electrodes by scratching the surfaces of the electrodes. No solder is required in forming a conductive adhesive 3 on a substrate electrode 2 of a circuit substrate 1 and also for packaging an electronic element 4. Provided also are a package of an electronic element using the conductive adhesive with improved initial and long-term reliability, and a method of packaging the same.
    Type: Grant
    Filed: February 27, 2001
    Date of Patent: July 12, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsutomi Mitani, Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Yasuhiro Suzuki
  • Publication number: 20050098338
    Abstract: A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element. Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 ?m or more and to 10.0 ?m or less and preferably to 1.0 ?m or more and to 5.0 ?m or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.
    Type: Application
    Filed: December 13, 2004
    Publication date: May 12, 2005
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takashi Kitae, Tsutomu Mitani, Yukihiro Ishimaru, Hiroaki Takezawa
  • Patent number: 6853074
    Abstract: A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element. Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 ?m or more and to 10.0 ?m or less and preferably to 1.0 ?m or more and to 5.0 ?m or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.
    Type: Grant
    Filed: December 27, 2000
    Date of Patent: February 8, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takashi Kitae, Tsutomu Mitani, Yukihiro Ishimaru, Hiroaki Takezawa
  • Patent number: 6814893
    Abstract: A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.
    Type: Grant
    Filed: July 7, 2003
    Date of Patent: November 9, 2004
    Assignee: Matsushita Electric Industiral Co., Ltd.
    Inventors: Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Tsutomu Mitani, Tousaku Nishiyama
  • Patent number: 6749774
    Abstract: A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group, an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: June 15, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani
  • Patent number: 6749889
    Abstract: In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: June 15, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Tsutomu Mitani, Minehiro Itagaki, Yoshihiro Bessho, Kazuo Eda
  • Patent number: 6694613
    Abstract: A method for producing a printed-circuit board includes forming via holes that penetrate through a prepreg to whose surface a parting film is applied; filling the via holes with a conducting paste; compressing the prepreg under heat to cure the prepreg and the paste; and then peeling off the parting film. Thus, projection electrodes with a height corresponding to the thickness of the film are formed in a manner such that the projection electrodes are integrated with the via hole conductors.
    Type: Grant
    Filed: June 5, 2001
    Date of Patent: February 24, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshifumi Nakamura, Minehiro Itagaki, Hiroaki Takezawa, Yoshihiro Bessho, Tsukasa Shiraishi
  • Patent number: 6675474
    Abstract: An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive and an electrode of the circuit board, an intermediate layer that is formed of a thermoplastic insulating adhesive with a softening temperature of 100° C. to 300° C. is interposed between the electrically conductive adhesive and the electrode. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer, thus allowing an electrical conduction between the electrically conductive adhesive and the electrode of the circuit board.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: January 13, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsutomu Mitani, Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Yasuhiro Suzuki
  • Publication number: 20040005459
    Abstract: A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.
    Type: Application
    Filed: July 7, 2003
    Publication date: January 8, 2004
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO.,LTD.
    Inventors: Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Tsutomu Mitani, Tousaku Nishiyama