Abstract: In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

Abstract: The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.

Abstract: In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

Abstract: A conductive paste has conductive particles having metal particle surface coated with a complex of same metal of less than 10 nm in thickness and not having spontaneous oxide film on said metal particles, and a binder mainly composed of an insulating resin.

Abstract: A printed-circuit board, especially a multilayer printed-circuit board, with projection electrodes integrated with via hole conductors. Each of the projection electrodes is highly adhesive to the via hole conductor and has high strength and thus the production method of the printed-circuit board is simplified. Projection electrodes formed of a cured conducting paste are formed in such a manner that it is integrated with via hole conductors consisting of a conducting paste embedded into the via hole formed in an insulating resin substrate to form a printed board. The method for producing a printed-circuit board includes making via holes that penetrate through a prepreg to whose surface a parting film is applied; filling the via hole with a conducting paste; compressing the prepreg under heat to cure the prepreg and the paste; and then peeling off the film.

Abstract: A printed-circuit board, especially a multilayer printed-circuit board, with projection electrodes integrated with via hole conductors. Each of the projection electrodes is highly adhesive to a corresponding one of the via hole conductors and has high strength, and thus the production method of the printed-circuit board is simplified. Projection electrodes formed of a cured conducting paste are formed in such a manner that the electrodes are integrated with the via hole conductors which consist of a conducting paste embedded into the via hole formed in an insulating resin substrate to form a printed board. The method for producing a printed-circuit board, includes making via holes that penetrate through a prepreg to whose surface a parting film is applied; filling the via hole with a conducting paste; compressing the prepreg under heat to cure the prepreg and the paste; and then peeling off the film.

Abstract: A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group, an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.

Abstract: A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element.

Abstract: Disclosed is a method for mounting a semiconductor element, the method requiring no strict flatness for a substrate and being reliable in a semiconductor device produced by mounting a semiconductor element on a circuit substrate. In the multilayer circuit substrate comprising bump electrodes formed of a conductive paste, a conductive adhesive is applied to the top of bump electrodes and then leveled to obtain the end portions on the bump electrodes with a high coplanarity in height. The semiconductor element is mounted on this substrate using a combination of a conductive resin and a sealing resin or an anisotropic conductive sheet. Every top of the bump electrodes after the conductive adhesive is applied has a high coplanarity. The semiconductor element can be mounted with high reliability, on the substrate having such a poor flatness of the electrode face that mounting by a conventional method can not be applied.

Abstract: An electrically insulating film capable of maintaining a preferable insulating property even with a film thickness of only some &mgr;and a method for preparing the same are disclosed. The insulating film comprises a first layer formed on a surface of a conductor substrate of a transition metal and comprised of molecules fixed on the surface of the conductor substrate through chemical bonds such as transition metal-sulfur bonds or chelate bonds, and a second layer formed on the first layer and comprised of a resin bonded to the molecules of the first layer through covalent bonds.

Abstract: A flux for soft soldering is disclosed. It comprises a chelating agent as an activator for facilitating a connection of a conductor metal to a soft solder by removing an oxide film naturally formed on the surface of the conductor metal, and for securing insulating reliability after soft soldering by forming complexes with copper and tin which are insulating substance, and a solvent capable of dissolving the chelating agent and further preferably evaporating at soldering process.