Abstract: To provide a battery pack less subject to vibration, shock, or the like and stable in characteristics. A battery pack includes a unit battery obtained by accommodating, in a casing film, a battery element in which positive and negative electrodes are stacked via separators, the unit battery having a sealing portion obtained by sealing opposing synthetic resin layers formed on inner surface of the casing film; and a lithium ion secondary battery stacked body obtained by stacking a plurality of the unit batteries and winding a fixing tape therearound. A sealing surface of the sealing portion is substantially parallel to a unit battery stacking surface, and an end surface of the sealing portion is brought into contact with the fixing tape.

Abstract: An electronic-component lead terminal includes a lead terminal one end of which is connectable to an electronic component and the other end of which is connectable to an electrode, and a solder-wicking prevention area formed on a surface of the lead terminal so as to intersect a solder-wicking direction oriented from the other end toward the one end, the solder-wicking prevention area including a plurality of portions projecting to a downstream side in the solder-wicking direction.

Abstract: A large-scale display device having a plurality of display units which each include a plurality of elongated plasma tubes each filled with a discharge gas, and at least one pair of display electrodes disposed outside the plasma tubes, voltage applying means which applies a drive voltage to the display electrodes to cause electric discharge in the plasma tubes for display. Vertically adjoining ones of the display units respectively have adjoining portions which are offset thicknesswise from each other for prevention of contact between the plasma tubes of the vertically adjoining display units. The voltage applying means is disposed away from the adjoining portions of the vertically adjoining display units.

Abstract: A piezoelectric element comprises a piezoelectric layer and an electrode provided to the piezoelectric layer. The piezoelectric layer has a Perovskite-type structure containing bismuth and iron, and includes nitrogen in an oxygen site of the Perovskite-type structure.

Abstract: An electronic component lead manufacturing method includes irradiating a first laser beam to a second layer with a solder wettability higher than a first layer, the second layer being laminated on the outside of the first layer of the lead used by the electronic component, and exposing the first layer from the second layer based on the irradiating of the first laser beam, and forming a projecting part near a region irradiated by a second laser beam by irradiating the second laser beam to the exposed first layer.

Abstract: An electronic component includes: an electronic component body; and a lead secured to the electric component and including a projection portion defined by first and second inclined portions facing each other. The solder wettability of the first inclined portion is smaller than the solder wettability of the second inclined portion.

Abstract: A cleaning apparatus includes: a supply unit to supply at least an initial amount of cleaning solution to a specific portion of an object to be cleaned; an agitator to induce agitation in the cleaning solution supplied to the object; a monitoring unit to monitor an amount of the cleaning solution and to provide a signal indicative thereof; and a control unit to detect a threshold amount of reduction in the cleaning solution based on the signal from the monitoring unit and accordingly to control the supply unit to supply an additional amount of cleaning solution to the specific portion of the object.

Abstract: A game apparatus saves, in accordance with an instruction of a user, a photographing image taken by an inward camera or an outward camera, or a handwriting image of a handwritten note inputted using a touch panel. Moreover, in accordance with an instruction of the user, position information is saved together with the photographing image or the handwriting image. That is, a photographing place or a creation place of the handwritten note is registered on a map. When the photographing image or the handwriting image is reproduced, an image of a landmark set near a position on the map indicated by the position information is reproduced before the photographing image or the handwritten image.

Abstract: A piezoelectric element comprising a first electrode, a piezoelectric layer which is composed of a metal oxide containing lead, zirconium and titanium and which formed above the first electrode, and a second electrode formed above the piezoelectric layer. The piezoelectric layer has negatively charged Pb—O complex defects and positively charged Pb—O complex defects, the concentration of the negatively charged Pb—O complex defects being higher than the concentration of the positively charged Pb—O complex defects.

Abstract: A large-scale display device having a plurality of display units which each include a plurality of elongated plasma tubes each filled with a discharge gas, and at least one pair of display electrodes disposed outside the plasma tubes, voltage applying means which applies a drive voltage to the display electrodes to cause electric discharge in the plasma tubes for display. Vertically adjoining ones of the display units respectively have adjoining portions which are offset thicknesswise from each other for prevention of contact between the plasma tubes of the vertically adjoining display units. The voltage applying means is disposed away from the adjoining portions of the vertically adjoining display units.

Abstract: An electronic-component lead terminal includes a lead terminal one end of which is connectable to an electronic component and the other end of which is connectable to an electrode, and a solder-wicking prevention area formed on a surface of the lead terminal so as to intersect a solder-wicking direction oriented from the other end toward the one end, the solder-wicking prevention area including a plurality of portions projecting to a downstream side in the solder-wicking direction.

Abstract: A piezoelectric element comprises a piezoelectric layer and an electrode provided to the piezoelectric layer. The piezoelectric layer has a Perovskite-type structure containing bismuth and iron, and includes nitrogen in an oxygen site of the Perovskite-type structure.

Abstract: A lead configured to join to a signal line of an electronic part through solder is disposed in an opposing relationship to the signal line and extends for sliding movement. A first opposing face section including a pair of faces having wettability to the solder is formed on surfaces of the signal line and the lead. Further, a second opposing face section including a pair of faces having wettability lower than the wettability of the first opposing face section is formed on the surfaces of the signal line and the lead along an extending direction of the lead.

Abstract: A lead configured to join to a signal line of an electronic part through solder is disposed in an opposing relationship to the signal line and extends for sliding movement. A first opposing face section including a pair of faces having wettability to the solder is formed on surfaces of the signal line and the lead. Further, a second opposing face section including a pair of faces having wettability lower than the wettability of the first opposing face section is formed on the surfaces of the signal line and the lead along an extending direction of the lead.

Abstract: A ferroelectric memory device includes: a substrate; a first insulating film formed above the substrate, the first insulating film including a plug; a ferroelectric capacitor formed above the first insulating film; the ferroelectric capacitor including a lower electrode formed above the plug, a ferroelectric film formed on the lower electrode, an upper electrode formed on the ferroelectric film; a hydrogen barrier film formed on the ferroelectric capacitor, a first thickness of the hydrogen barrier film formed on the upper electrode being greater than a second thickness of the hydrogen barrier film formed on a side surface of the ferroelectric capacitor; and the hydrogen barrier film including a first hydrogen barrier film and the second hydrogen barrier film, the first hydrogen barrier film formed on an upper surface of the upper electrode and a side surface of the upper electrode, the second hydrogen barrier film formed above the ferroelectric capacitor.

Abstract: A method of manufacturing a ferroelectric memory device includes: forming a hydrogen barrier film which covers a ferroelectric capacitor including a lower electrode, a ferroelectric film, and an upper electrode, wherein a thickness of an area of the hydrogen barrier film provided on the upper electrode is made greater than a thickness of an area of the hydrogen barrier film provided on a sidewall of the ferroelectric capacitor by forming the area of the hydrogen barrier film provided on the upper electrode in a plurality of layers.

Abstract: A piezoelectric element comprising a first electrode, a piezoelectric layer which is composed of a metal oxide containing lead, zirconium and titanium and which formed above the first electrode, and a second electrode formed above the piezoelectric layer. The piezoelectric layer has negatively charged Pb—O complex defects and positively charged Pb—O complex defects, the concentration of the negatively charged Pb—O complex defects being higher than the concentration of the positively charged Pb—O complex defects.

Abstract: An electronic component lead manufacturing method includes irradiating a first laser beam to a second layer with a solder wettability higher than a first layer, the second layer being laminated on the outside of the first layer of the lead used by the electronic component, and exposing the first layer from the second layer based on the irradiating of the first laser beam, and forming a projecting part near a region irradiated by a second laser beam by irradiating the second laser beam to the exposed first layer.

Abstract: An electronic component includes: an electronic component body; and a lead secured to the electric component and including a projection portion defined by first and second inclined portions facing each other. The solder wettability of the first inclined portion is smaller than the solder wettability of the second inclined portion.

Abstract: A cleaning apparatus includes: a supply unit to supply at least an initial amount of cleaning solution to a specific portion of an object to be cleaned; an agitator to induce agitation in the cleaning solution supplied to the object; a monitoring unit to monitor an amount of the cleaning solution and to provide a signal indicative thereof; and a control unit to detect a threshold amount of reduction in the cleaning solution based on the signal from the monitoring unit and accordingly to control the supply unit to supply an additional amount of cleaning solution to the specific portion of the object.