Abstract: The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.

Abstract: The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.

Abstract: A method of forming a container having a lid and a container body which define an inside space, and a material containing an organic compound provided in the inside space. The method includes forming a groove and a communication member for communicating the groove with an outside space, in at least one of the lid and the container body, providing the material in the inside space, welding the lid and the container body to each other, and exhausting the organic compound vaporized by welding heat to the outside space through the groove and the communication member.

Abstract: The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials. The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.

Abstract: A container including at least two structural members welded to each other to define an inside space, and a material containing an organic compound provided in the inside space, in which in at least one structural member of the at least two structural members has (i) a groove formed between a welded portion thereof and the material in order to release the organic compound, as the organic compound is vaporized when the structural members are welded to each other, and (ii) a communication member to communicate the groove and an outside space of the container with each other, so that the vaporized organic compound is exhausted to the outside space.

Abstract: A photosensitive resin composition which is excellent in flame resistance, resolution and flexibility, and substantially free from deposition of components thereof to prevent contamination of a product. The photosensitive resin composition comprises: (A) a cyclic phosphazene compound represented by the following general formula (1): wherein at least one of the Rs is an organic group having the urethane(meth)acrylate structure represented by the following general formula (2) and n is a positive number of 2 to 5: wherein R1 is a hydrogen atom or a methyl group; (B) a carboxyl-containing linear polymer obtained by polymerizing an ethylenically unsaturated compound through addition polymerization; (C) an epoxy resin; (D) an ethylenically unsaturated group-containing polymerizable compound; and (E) a photopolymerization initiator; wherein the cyclic phosphazene compound (A) is present in a proportion of 5 to 30 wt % based on the total weight of the composition.

Abstract: It is an object of the present invention to provide an arc ion plating method and a target used therein, capable of obtaining a uniform film thickness distribution substantially throughout the overall length of a work and also capable of improving the yield of the target material and reducing the manufacturing cost of the target. Within a vacuum chamber 1 there are disposed a target 3 and works, the target 3 being dividable into at least both longitudinal end portions 31, 32 and a central portion 33 other than the both longitudinal end portions. When forming a film, the position of an arc spot on the target surface is controlled in such a manner that the consuming speed of both longitudinal end portions 31, 32 becomes higher than the consuming speed of the central portion 33.

Abstract: A conductor circuit (2) having a predetermined pattern is formed on a base material (1); a photosensitive resin composition layer is formed on a surface of the base material, on which the conductor circuit (2) having the predetermined pattern is formed, by using a photosensitive resin composition; a surface of the photosensitive resin composition layer is irradiated with and exposed to active light rays through a photomask having a predetermined pattern; a solder resist layer (3a) having a predetermined pattern is formed by using a developing solution; and the formed solder resist layer (3a) is irradiated with ultraviolet light by using a low-pressure mercury-vapor lamp.

Abstract: An exposure apparatus including a projection optical system and configured to expose a substrate to light via the projection optical system includes a support configured to support the projection optical system, an object supported by the support and movable relative the support, an actuator configured to drive the object, a detector configured to detect a relative position between the object and the support, and a controller configured to perform a control of the actuator based on an output of the detector to cause the object to follow the support. The controller is configured to perform an estimation of a vibration of the support based on an output of the detector in parallel with the control to cause the object to follow the support.

Abstract: A positive photosensitive resin composition comprising (A) a polyamic acid, (B) a 1,4-dihydropyridine derivative represented by the general formula (II): wherein R2 is a monovalent organic group; each of R3, R4, R5, and R6 is independently hydrogen or a monovalent organic group; and Ar—NO2 is an aromatic hydrocarbon group having a nitro group at ortho-position, and (C) an amine compound.

Abstract: A photosensitive resin composition for a flexible circuit board capable of suppressing warpage occurrence after heat curing, and a flexible circuit board obtained by using the same. The photosensitive resin composition includes (A) a carboxyl-group containing linear polymer having a glass transition temperature of not more than 55° C. obtained by addition polymerizing an ethylenic unsaturated compound; (B) a polymerizable compound containing an ethylenic unsaturated group; and (C) a photopolymerization initiator.

Abstract: A photosensitive resin composition for a flexible circuit board having excellent flame retardancy and with non-halogenation for consideration of environmental aspects, and a flexible circuit board obtained by using the same. The photosensitive resin composition includes (A) a linear polymer containing a carboxyl group obtained by addition polymerizing an ethylenic unsaturated compound; (B) a polymerizable compound containing an ethylenic unsaturated group; (C) a photopolymerization initiator: and (D) a phosphorated epoxy resin containing phosphorous atom at not less than 2% by weight based on a total molecular weight thereof.

Abstract: The present invention provides a PVD cylindrical target comprising an evaporation material covering the outer circumferential surface of a cylindrical substrate, the PVD cylindrical target includes a meshing part having at least either of a protruding shape and a recessed shape formed with rounded angular parts at the interface between the substrate and the evaporation material. According to such a structure, peeling or cracking of the evaporation material by a residual stress caused at the interface between the substrate and the evaporation material by a thermal expansion difference between the both can be suppressed, and sufficient adhesiveness between the both can also be ensured.

Abstract: The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials. The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.

Abstract: A hard laminated film wherein a layer A and a layer B having specific compositions are deposited alternately so that the compositions of layer A and layer B are different. The thickness of layer A per layer is twice or more the thickness of layer B per layer, the thickness of layer B per layer is 0.5 nm or more, and the thickness of layer A per layer is 200 nm or less. Layer A has a cubic rock-salt crystal structure such as that of Ti, Cr, Al, V nitride, carbonitride or carbide, and layer B is a hard film having a crystal structure other than cubic such as that of BN, BCN, SiN, SiC, SiCN, B—C, Cu, CuN, CuCN or metallic Cu. Alternatively, layer A has a chemical composition satisfying the following formula (1), and layer B has a chemical composition satisfying the following formula (2). Cr(BaCbN1-a-b-cOc)??Layer A 0?a?0.15, 0?b?0.3, 0?c?0.1, 0.2?e?1.1??(1) B1-s-tCsNt??Layer B 0?s 0.25, (1?s?t)/t?1.

Abstract: An arc ion plating apparatus comprises a vacuum chamber, a rotary table for moving a substrate within the vacuum chamber vertically relative to its height direction, an arc evaporation source for bombardment for cleaning the surface of the substrate with metal ions, and an arc evaporation source for deposition group for depositing metal ions on the surface of the substrate. The arc evaporation source for deposition group is composed of a plurality of evaporation sources arranged so as to be opposite to the substrate set on the rotary table, and the arc evaporation source for bombardment is arranged so as to be opposite to the substrate, and formed so that its length in the height direction of the vacuum chamber is equal to the length between the upper and lower ends of the arc evaporation source for deposition group. According to such a structure, over temperature rise or abnormal discharge is hardly caused in the substrate at the time of bombardment, and process controllability is consequently enhanced.

Abstract: A hard laminated film wherein a layer A and a layer B having specific compositions are deposited alternately so that the compositions of layer A and layer B are different. The thickness of layer A per layer is twice or more the thickness of layer B per layer, the thickness of layer B per layer is 0.5 nm or more, and the thickness of layer A per layer is 200 nm or less. Layer A has a cubic rock-salt crystal structure such as that of Ti, Cr, Al, V nitride, carbonitride or carbide, and layer B is a hard film having a crystal structure other than cubic such as that of BN, BCN, SiN, SiC, SiCN, B—C, Cu, CuN, CuCN or metallic Cu. Alternatively, layer A has a chemical composition satisfying the following formula (1), and layer B has a chemical composition satisfying the following formula (2). Layer A: Cr(BaCbN1-a-b-cOc) 0?a?0.15, 0?b?0.3, 0?c?0.1, 0.2?e?1.1??(1) Layer B: B1-s-tCsNt 0?s 0.25, (1-s-t)/t?1.

Abstract: A series of semiconductor devices includes: (i) a plurality of semiconductor elements having electrodes; (ii) a plurality of electrically conductive parts formed around and electrically connected to each of the semiconductor elements; and (iii) a sealing resin in which the plurality of semiconductor elements and the plurality of electrically conductive parts are sealed and an electrode-free side of each semiconductor element and an unwired side of each electrically conductive part are formed on a single flat surface of a removable substrate.

Abstract: The present invention provides a film deposition system capable of effectively cooling a work having a large volume, and a film deposition method using this system. The film deposition system has, within a vacuum chamber 1, an evaporation source 3 for forming a film on a work 2 and a cooling device 4 for cooling the work 2, characterized in that the work 2 has an internal space 15 communicating with the outside through an opening part 14, and the cooling device 4 is insertable to and drawable from the internal space 15 through the opening part 14 of the work 2 to cool the work 2 from the inside.

Abstract: A vacuum evaporator according to the present invention comprises a vacuum chamber, a rod-like evaporation source provided to be liftable into and out of the vacuum chamber, and a work support means for supporting, relative to the evaporation source lowered into the vacuum chamber, works W arranged to surround the evaporation source. The vacuum chamber is formed of a fixed chamber part and a movable chamber part provided connectably to and disconnectably from the fixed chamber part and mounted with the work support means. Either one movable chamber part is horizontally moved and connected to the fixed chamber part in the state where the evaporation source is raised and retreated out of the vacuum chamber to perform vacuum evaporation treatment. According to such a structure, the maintenance of the vacuum evaporator can be performed without raising or lowering the lower plate or taking out the work support means from the vacuum chamber.