Abstract: A positive photosensitive resin composition comprising (A) a polyamic acid, (B) a 1,4-dihydropyridine derivative represented by the general formula (II): wherein R2 is a monovalent organic group; each of R3, R4, R5, and R6 is independently hydrogen or a monovalent organic group; and Ar—NO2 is an aromatic hydrocarbon group having a nitro group at ortho-position, and (C) an amine compound.

Abstract: Disclosed is a container in which at least two structural members, for example, a lid (11) and a body tray (12) having an opening, are welded each other to define an inside space, and in which a sealing material (15) is disposed within the inside space, wherein at least one structural member of the at least two structural members has a groove (17) formed between a welded portion and the sealing material, and a communicating bore (18) for communicating the groove and an outside space of the container with each other.

Abstract: The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.

Abstract: A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

Abstract: A photosensitive polyimide resin precursor composition capable of providing a polyimide resin that is not substantially colored, is transparent and has heat resistance, an optical polyimide resin obtained from the composition, and an optical waveguide using the polyimide resin. The photosensitive polyimide resin precursor composition contains (a) 100 parts by weight of a polyamic acid obtained from a tetracarboxylic acid dianhydride and a diamine, (b) 0.01 parts by weight or more and less than 5 parts by weight of a 1,4-dihydropyridine derivative, (c) 5–50 parts by weight of a glycol (ether). The optical polyimide resin is obtained by irradiating the photosensitive resin precursor composition with UV light, followed by exposure, heating, development, and then heating. The optical waveguide comprises a core layer comprising the optical polyimide resin, and a cladding layer thereof.

Abstract: In the rod target for an arc evaporation source, of which the outer peripheral surface is used as an evaporation surface, the opposite ends thereof in the longitudinal direction thereof are each formed thicker than the central part thereof. The length of the thicker portion at each of the opposite ends in the longitudinal direction is set to be not less than 75 mm nor more than 200 mm. Work with a uniform film thickness is provided, and the availability of a rod target is improved, thereby preventing the rod target from going to waste.

Abstract: A photosensitive resin composition which, when exposed to light through a photomask and then developed, can form a pattern comprising a polyimide film having a thickness of 20 ?m or larger with high resolution; and a use of the composition, in particular, a method of forming a pattern comprising the polyimide film. The photosensitive resin composition comprises (a) a poly(amic acid), (b) a specific 1,4-dihydropyridine derivative, and (c) a specific imide acrylate compound.

Abstract: An object tracing device, an object tracing system and an object tracing method are disclosed, which traces a truly suspicious object even when a new suspicious object comes into an area to be monitored after a suspicious object has been started to be traced. In the object tracing device, an object-identifying part identifies a plurality of objects in a wide-angle picture taken by a first picture-taking device; a chronological-information-creating part creates chronological information of the identified objects; an object-selecting part selects an object having a selecting condition identical with that of the object defined as the object to be traced; and a control part drives a second picture-taking device taking a picture of a narrower angle than a first picture-taking device does and controls the picture-taking device in taking a picture of the selected object.

Abstract: A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

Abstract: Herein disclosed a moving object detecting method of detecting optical flow segments indicative of loci of one or more moving objects apparently moved in a moving picture sequence including a plurality of picture frames each indicating the one or more moving objects at a time point to ensure that the one or more moving objects are correctly detected, the picture frames including a first picture frame indicating the one or more moving objects at a first time point, a second picture frame indicating the one or more moving objects at a second time point, a third picture frame indicating the one or more moving objects at a third time point, and a fourth picture frame indicating the one or more moving objects at a fourth time point in late order, the method comprising the steps of: h) generating filtered optical flow segments indicative of loci of the one or more moving objects apparently moved in the moving picture sequence in the time interval starting from the third time point to the first time point; and i) ad

Abstract: A photosensitive resin composition which, when exposed to light through a photomask and then developed, can form a pattern comprising a polyimide film having a thickness of 20 ?m or larger with high resolution; and a use of the composition, in particular, a method of forming a pattern comprising the polyimide film. The photosensitive resin composition comprises (a) a poly(amic acid), (b) a specific 1,4-dihydropyridine derivative, and (c) a specific imide acrylate compound.

Abstract: A hard laminated film wherein a layer A and a layer B having specific compositions are deposited alternately so that the compositions of layer A and layer B are different. The thickness of layer A per layer is twice or more the thickness of layer B per layer, the thickness of layer B per layer is 0.5 nm or more, and the thickness of layer A per layer is 200 nm or less. Layer A has a cubic rock-salt crystal structure such as that of Ti, Cr, Al, V nitride, carbonitride or carbide, and layer B is a hard film having a crystal structure other than cubic such as that of BN, BCN, SiN, SiC, SiCN, B—C, Cu, CuN, CuCN or metallic Cu. Alternatively, layer A has a chemical composition satisfying the following formula (1), and layer B has a chemical composition satisfying the following formula (2). Layer A: Cr(BaCbN1-a-b-cOc) 0?a?0.15, 0?b?0.3, 0?c?0.1, 0.2?e?1.1??(1) Layer B: B1-s-tCsNt 0?s 0.25, (1?s?t)/t?1.

Abstract: A series of semiconductor devices includes: (i) a plurality of semiconductor elements having electrodes; (ii) a plurality of electrically conductive parts formed around and electrically connected to each of the semiconductor elements; and (iii) a sealing resin in which the plurality of semiconductor elements and the plurality of electrically conductive parts are sealed and an electrode-free side of each semiconductor element and an unwired side of each electrically conductive part are formed on a single flat surface of a removable substrate.

Abstract: A printed wiring board, particularly, an interposer 20 for a chip scale package, comprising an outer insulator layer 22 having outer electrodes 31, a conductor layer 21, and an inner insulator layer 23 having inner electrodes 27, the electrodes 31 and/or 27 having been formed by electroplating using, as a negative electrode, a metal plate 32 that has been provided on the outer insulator layer 22 and removed after the electroplating. Having no plating leads, the printed wiring board has the electrodes in an orderly array at a fine pitch and a high density.

Abstract: A method for manufacturing wired circuit board that enables a wired circuit board of high quality to be manufactured without changing in dimension of the wired circuit board substantially. In this method, the wired circuit board is wound in layers in the winding process in such a manner that after an uncured thermosetting resin layer is formed on the wired circuit board in the resin layer forming process, a right-side spacer and a left-side spacer are disposed on the already wound wired circuit board at both widthwise ends thereof and also an upper spacer is disposed on the right-side spacer and the left-side spacer so as to cover a widthwise area of the wired circuit board, so that the right-side spacer, the left-side spacer and the upper spacer are positioned between the layers of the wired circuit board when wound. Thereafter, the wired circuit board wound in the rolled state is heated as it is, to cure the uncured thermosetting resin layer in the curing process.

Abstract: A method for manufacturing a semiconductor device includes the steps of: (1) forming a plurality of electrically conductive parts on portions of an adhesive layer of an adhesive sheet, the adhesive sheet having a base layer and the adhesive layer; (2) attaching at least one semiconductor element having electrodes to the adhesive layer, wherein an electrode-free side of the semiconductor element is attached to the adhesive layer; (3) electrically connecting a wire between each of the electrically conductive parts and each of the electrodes of the semiconductor element; (4) sealing the semiconductor element in a sealing resin to form a semiconductor device on the adhesive sheet; and (5) separating the adhesive sheet from the semiconductor device. This method enables the production of thin semiconductor devices with a surface mount type.

Abstract: A vacuum evaporator according to the present invention comprises a vacuum chamber, a rod-like evaporation source provided to be liftable into and out of the vacuum chamber, and a work support means for supporting, relative to the evaporation source lowered into the vacuum chamber, works W arranged to surround the evaporation source. The vacuum chamber is formed of a fixed chamber part and a movable chamber part provided connectably to and disconnectably from the fixed chamber part and mounted with the work support means. Either one movable chamber part is horizontally moved and connected to the fixed chamber part in the state where the evaporation source is raised and retreated out of the vacuum chamber to perform vacuum evaporation treatment. According to such a structure, the maintenance of the vacuum evaporator can be performed without raising or lowering the lower plate or taking out the work support means from the vacuum chamber.

Abstract: To provide a method of producing a multilayer printed wiring board that can be intended to have low-profile, light-weight and high-density wiring of a printed wiring board, and a multilayer printed wiring board produced by the method of producing a multilayer printed wiring board, the double-sided substrate is produced by the steps of forming an insulating resin layer on a metal foil; of forming a via hole in the insulating resin layer; of forming a first circuit pattern on the insulating resin layer and forming a conductive layer in the via hole, by plating; and of etching the metal foil to form it into a second circuit pattern. The produced double-sided substrate is used as a core substrate for producing multilayer printed wiring board by a laminate-en-bloc or a build-up method.

Abstract: A hard film comprises an oxide film of corundum crystal structure having a lattice constant in the range of 4.779 to 5.000 Å and a thickness not smaller than 0.005 &mgr;m, and an alumina film of corundum crystal structure formed on one of surfaces of the oxide film. The oxide film is formed of Cr2O3, (Fe, Cr)2O3 or (Al, Cr)2O3. The alumina film excellent in heat resistance and wear resistance can be formed on a base object under a low-temperature condition that will not deteriorate the characteristics of the base object.

Abstract: A hard film comprises an oxide film of corundum crystal structure having a lattice constant in the range of 4.779 to 5.000 Å and a thickness not smaller than 0.005 &mgr;m, and an alumina film of corundum crystal structure formed on one of surfaces of the oxide film. The oxide film is formed of Cr2O3, (Fe, Cr)2O3 or (Al, Cr)2O3. The alumina film excellent in heat resistance and wear resistance can be formed on a base object under a low-temperature condition that will not deteriorate the characteristics of the base object.