Abstract: A dynamic quantity sensor includes a force receiving portion, a first movable portion that rotates in a first rotational direction around a first rotational axis according to dynamic quantity in a first direction that the force receiving portion receives, and rotates in the first rotational direction around the first rotational axis according to dynamic quantity in a second direction different from the first direction that the force receiving portion receives; and a second movable portion that rotates in a second rotational direction around a second rotational axis according to the dynamic quantity in the first direction that the force receiving portion receives, and rotates in an opposite direction to the second rotational direction around the second rotational axis according to the dynamic quantity in the second direction that the force receiving portion receives.

Abstract: A structure having a first movable portion displaced perpendicular to a substrate surface and a second movable portion displaced parallel to the substrate surface is realized by a laminated structure employing a nested structure for the first portion and the second portion. The laminated structure is provided with inner and outer movable portions. A y spring is connected to the outer portion, and the outer portion is supported in a y-axis direction by the y spring at a height apart from an outer substrate. A z spring is connected to the inner portion, and the inner portion is supported in a z-axis direction by the z spring at a height apart from the outer substrate. The outer portion and the z spring are at different heights from the substrate, and the z spring overpasses across the outer portion at a height apart from the outer movable portion.

Abstract: When forming a trench of a narrow width in a thick semiconductor layer, a trench can be formed without the occurrence of semiconductor residue. In this Specification, a semiconductor device in which a trench is formed in a semiconductor layer is disclosed. In the semiconductor layer of the semiconductor device, a compensation pattern which compensates for sudden changes in the width of the trench is formed at a place at which the width of the trench changes suddenly. In the semiconductor layer of the above-described semiconductor device, since a compensation pattern is formed at a place at which the trench width changes suddenly, in the case where forming the trench using a deep RIE method, the occurrence of steep inclined portions arising from semiconductor residue can be prevented. Consequently, when forming a trench of a narrow width in a thick semiconductor layer, the occurrence of semiconductor residue can be prevented.

Abstract: Technology is provided in which, when forming a trench of a narrow width in a thick semiconductor layer, a trench can be formed without the occurrence of semiconductor residue. In this Specification, a semiconductor device in which a trench is formed in a semiconductor layer is disclosed. In the semiconductor layer of the semiconductor device, a compensation pattern which compensates for sudden changes in the width of the trench is formed at a place at which the width of the trench changes suddenly. In the semiconductor layer of the above-described semiconductor device, since a compensation pattern is formed at a place at which the trench width changes suddenly, in the case where forming the trench using a deep RIE method, the occurrence of steep inclined portions arising from semiconductor residue can be prevented. Consequently, when forming, a trench of a narrow width in a thick semiconductor layer, the occurrence of semiconductor residue can be prevented.

Abstract: The micro device includes a support substrate, and a movable structure configured to move with respect to the support substrate. At least one of the support substrate and the movable structure is provided with at least one protrusion protruding towards the other of the support substrate and the movable structure. Further, a base portion extending into the one of the support substrate and the movable structure is provided integrally with the at least one protrusion. With this configuration, the protrusion is securely held by the base portion, and the detachment of the protrusion can therefore be prevented even after repeated collisions between the support substrate and the movable structure via the protrusion.

Abstract: An apparatus with a second movable portion that moves along an x-axis direction and a z-axis direction and a first movable portion that only moves along the z-axis direction is disclosed. The apparatus is provided with a fixed portion fixed to a support portion, a plurality of first spring portions connected to the fixed portion, a first movable portion connected to the plurality of first spring portions, a second spring portion connected to the first movable portion, and a second movable portion connected to the second spring portion. A spring constant of each of the plurality of first spring portions in the z-axis direction is lower than spring constants of each of the plurality of first spring portions in the x-axis and a y-axis directions respectively, and a spring constant of the second spring portion in the x-axis direction is lower than spring constants of the second spring portion in the y-axis and the z-axis directions respectively.

Abstract: A structure having a first movable portion that is displaced perpendicular to a substrate surface and a second movable portion that is displaced parallel to the substrate surface is realized by a laminated structure, and manufacturing cost is reduced by employing a nested structure for the first movable portion and the second movable portion. The laminated structure is provided with a frame-like outer movable portion and an inner movable portion housed within the frame of the outer movable portion. A y spring is connected to the outer movable portion, and the outer movable portion is displaceably supported in a y-axis direction by the y spring at a height apart from an outer substrate. A z spring is connected to the inner movable portion, and the inner movable portion is displaceably supported in a z-axis direction by the z spring at a height apart from the outer substrate.

Abstract: In a MEMS structure, a first trench which penetrates the first layer, the second layer and the third layer is formed, and a second trench which penetrates the fifth layer, the forth layer and the third layer is formed. The first trench forms a first part of an outline of the movable portion in a view along the stacked direction. The second trench forms a second part of the outline of the movable portion in the view along the stacked direction. At least a part of the first trench overlaps with the first extending portion in the view along the stacked direction.

Abstract: A microphone that identifies the direction along which acoustic waves propagate with one diaphragm, and has superior durability is provided. The microphone includes a circular diaphragm supported at a center portion thereof. When the diaphragm receives acoustic waves, each position around the center thereof will vibrate with a phase depending upon the direction of the acoustic waves. First electrodes are arranged on one surface of the diaphragm and second electrodes are arranged facing corresponding first electrodes to form a first capacitor. Third electrodes are arranged on the other surface of the diaphragm and fourth electrodes are arranged facing corresponding third electrodes to form a second capacitor. A controller applies a voltage to the second capacitors so that the capacitance of the first capacitors will be constant and identifies the direction along which the acoustic waves propagate based on the difference in the voltages applied to each of the second capacitors.

Abstract: An apparatus with a second movable portion that moves along an x-axis direction and a z-axis direction and a first movable portion that only moves along the z-axis direction is disclosed. The apparatus is provided with a fixed portion fixed to a support portion, a plurality of first spring portions connected to the fixed portion, a first movable portion connected to the plurality of first spring portions, a second spring portion connected to the first movable portion, and a second movable portion connected to the second spring portion. A spring constant of each of the plurality of first spring portions in the z-axis direction is lower than spring constants of each of the plurality of first spring portions in the x-axis and a y-axis directions respectively, and a spring constant of the second spring portion in the x-axis direction is lower than spring constants of the second spring portion in the y-axis and the z-axis directions respectively.

Abstract: The micro device includes a support substrate, and a movable structure configured to move with respect to the support substrate. At least one of the support substrate and the movable structure is provided with at least one protrusion protruding towards the other of the support substrate and the movable structure. Further, a base portion extending into the one of the support substrate and the movable structure is provided integrally with the at least one protrusion. With this configuration, the protrusion is securely held by the base portion, and the detachment of the protrusion can therefore be prevented even after repeated collisions between the support substrate and the movable structure via the protrusion.

Abstract: A reference voltage circuit includes an operational amplifier, a first fixed resistance resistor, a second fixed resistance resistor, a third fixed resistance resistor, a first diode and a second diode. The reference voltage circuit further includes a fourth fixed resistance resistor having an end connected to a non-inverting input terminal of the operational amplifier and the other end connected to the first diode. The reference voltage circuit is characterized by a value of the resistance of the fourth resistor being less than the resistance of the first resistor and a temperature coefficient of the fourth resistor being greater than any of the temperature coefficients of the first, second and third resistors.

Abstract: A microphone that may identify the direction along which acoustic waves propagate with one diaphragm, and which has superior durability is provided. The microphone comprises a circular diaphragm. The diaphragm is supported at the center portion thereof. When the diaphragm receives acoustic waves, each position around the center thereof will vibrate with a phase depending upon the direction of the acoustic waves. First electrodes are arranged on one of the surfaces of the diaphragm. Second electrodes are arranged so that each second electrode faces corresponding first electrode with gap. Each first electrode and corresponding second electrode facing thereto form a first capacitor. Third electrodes are arranged on the other surface of the diaphragm. Fourth electrodes are arranged so that each fourth electrode faces corresponding third electrode with gap. Each third electrode and corresponding fourth electrode facing thereto form a second capacitor.

Abstract: A reference voltage circuit includes an operational amplifier, a first fixed resistance resistor, a second fixed resistance resistor, a third fixed resistance resistor, a first diode and a second diode. The reference voltage circuit further includes a fourth fixed resistance resistor having an end connected to a non-inverting input terminal of the operational amplifier and the other end connected to the first diode. The reference voltage circuit is characterized by a value of the resistance of the fourth resistor being less than the resistance of the first resistor and a temperature coefficient of the fourth resistor being greater than any of the temperature coefficients of the first, second and third resistors.

Abstract: A capacitive device includes a substrate, a movable electrode, and a fixed electrode. The movable electrode is located above a surface of the substrate and is movable with respect to the substrate along directions that are substantially orthogonal to the surface. The fixed electrode is stationary with respect to the substrate. When the movable electrode is displaced in a first direction that is substantially orthogonal to the surface, the total sum of area-distance quotients in the overlap between the electrodes remains substantially unchanged or decreases to provide a first reduction rate that is substantially zero or more. On the other hand, when the movable electrode is displaced in a second direction that is substantially opposite to the first direction, the total sum of area-distance quotients remains substantially unchanged or decreases to provide a second reduction rate that is substantially zero or more. The reduction rates are different from each other.

Abstract: In a capacitive sensor apparatus, a capacitive sensor includes a plurality of physical-quantity-detection capacitors each having a movable electrode and a fixed electrode. A conversion device operates for converting an output signal of the capacitive sensor into an apparatus output signal. Each of the physical-quantity-detection capacitors is selectively connected and disconnected to and from the conversion device. A determination is made as to whether or not each of the physical-quantity-detection capacitors fails in response to the sensor output signal. When it is determined that a first one of the physical-quantity-detection capacitors fails, the first one is disconnected from the conversion device and a second one of the physical-quantity-detection capacitors is connected to the conversion device.

Abstract: A capacitive physical load sensor includes a substrate, which has fixed electrodes, and a diaphragm, which has movable electrodes. The diaphragm is located across a gap from the substrate, and retaining parts for the diaphragm are formed around the diaphragm. Protruding parts extend into the gap from the diaphragm or from the substrate. The protruding parts support the diaphragm at different levels of deformation to alter the characteristics of the diaphragm and extend its range.

Abstract: A capacitive device includes a substrate, a movable electrode, and a fixed electrode. The movable electrode is located above a surface of the substrate and is movable with respect to the substrate along directions that are substantially orthogonal to the surface. The fixed electrode is stationary with respect to the substrate. When the movable electrode is displaced in a first direction that is substantially orthogonal to the surface, the total sum of area-distance quotients in the overlap between the electrodes remains substantially unchanged or decreases to provide a first reduction rate that is substantially zero or more. On the other hand, when the movable electrode is displaced in a second direction that is substantially opposite to the first direction, the total sum of area-distance quotients remains substantially unchanged or decreases to provide a second reduction rate that is substantially zero or more. The reduction rates are different from each other.

Abstract: On a substrate, first and second capacitive portions are formed to have movable diaphragms having different areas for pressure measurement and diagnostic, wherein a communication structure is provided between the cavity spaces of the first and second capacitive portions to equalize the pressure in the first capacitive space to that of the second capacitive space. The different sizes provide different sensitivity for efficient diagnostic. The first and second capacitive portions can be made in one diaphragm, wherein the second capacitive portion is formed around the first capacitive portion. The cavity spaces of the first and second capacitive portions are connected. Moreover, between the first and second capacitive spaces, an insulation portion may be formed in a ring shape to support the diaphragm portion of the first capacitive portion and the diaphragm portion the second capacitive portion with communication portions.

Abstract: On a substrate, first and second capacitive portions are formed to have movable diaphragms having different areas for pressure measurement and diagnostic, wherein a communication structure is provided between the cavity spaces of the first and second capacitive portions to equalize the pressure in the first capacitive space to that of the second capacitive space. The different sizes provide different sensitivity for efficient diagnostic. The first and second capacitive portions can be made in one diaphragm, wherein the second capacitive portion is formed around the first capacitive portion. The cavity spaces of the first and second capacitive portions are connected. Moreover, between the first and second capacitive spaces, an insulation portion may be formed in a ring shape to support the diaphragm portion of the first capacitive portion and the diaphragm portion the second capacitive portion with communication portions.