Patents by Inventor Hiroki Arai

Hiroki Arai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210129041
    Abstract: The abstract of the disclosure is a thermal-ultrafine bubble generation unit which is configured to generate thermal-ultrafine bubbles by bringing a liquid into film boiling. More specifically, the thermal-ultrafine bubble generation unit in the disclosure includes a temperature detection element that is configured to detect generation of the film boiling.
    Type: Application
    Filed: October 30, 2020
    Publication date: May 6, 2021
    Inventors: Yoshiyuki Imanaka, Takahiro Nakayama, Masahiko Kubota, Akira Yamamoto, Akitoshi Yamada, Yumi Yanai, Hiroyuki Ishinaga, Teruo Ozaki, Toshio Kashino, Hiroki Arai, Kazuki Hirobe, Yukinori Nishikawa, Hisao Okita, Yusuke Komano
  • Publication number: 20210095112
    Abstract: A polyacetal resin composition capable of minimizing degradation when a molded body thereof comes into contact with an acidic cleaner. The polyacetal resin composition contains with respect to (A) 100 parts by mass of a polyacetal copolymer in which the amount of a hemiformal end group is 0.8 mmol/kg or less, (B) more than 1.0 parts by mass and at most 5.0 parts by mass of a hindered phenol-based antioxidant, and (C) more than 4.0 parts by mass and at most 30 parts by mass of magnesium oxide.
    Type: Application
    Filed: April 24, 2019
    Publication date: April 1, 2021
    Inventors: Hiroki Arai, Tornohiro MONMA
  • Publication number: 20210071296
    Abstract: Examples of a cleaning method includes supplying a cleaning gas into an exhaust duct that provides an exhaust flow passage of a gas supplied to an area above a susceptor, the exhaust duct having a shape surrounding the susceptor in plan view, and activating the cleaning gas to clean an inside of the exhaust duct.
    Type: Application
    Filed: September 2, 2020
    Publication date: March 11, 2021
    Inventors: Toshiharu Watarai, Hiroki Arai, Toshio Nakanishi, Yoshiyuki Kikuchi, Ryo Miyama
  • Patent number: 10927255
    Abstract: A polyarylene sulfide resin composition characterized by comprising a polyarylene sulfide resin, and an olefinic copolymer comprising an ?-olefin-derived structural unit and an ?,?-unsaturated acid glycidyl ester-derived structural unit, wherein the olefinic copolymer content is at least 1.0 parts by mass and less than 5.0 parts by mass with respect to 100 parts by mass of the polyarylene sulfide resin, a melt viscosity of the polyarylene sulfide resin measured at 310° C. and a shear rate of 1216 sec?1 is at least 70 Pa·s and at most 300 Pa·s, and a flow length for a width of 20 mm and a thickness of 1 mm, at a cylinder temperature of 320° C., an injection pressure of 100 MPa and a mold temperature of 150° C., is at least 80 mm and at most 200 mm.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: February 23, 2021
    Assignee: POLYPLASTICS CO., LTD.
    Inventors: Katsuhei Ohnishi, Hiroki Arai, Kuniaki Matsuda
  • Publication number: 20200407590
    Abstract: The present invention provides a cationic electrodeposition coating composition that has both good anti-cissing property and good coating film appearance. This is a cationic electrodeposition coating composition containing a silicone compound (A) having an SP value of more than 10.5 and 15.0 or less, and a film forming resin (B), wherein the silicone compound (A) is contained in an amount of 0.01 parts by mass or more and 4.5 parts by mass or less per 100 parts by mass of the resin solid content of the film forming resin (B). For example, the silicone compound (A) is at least one species selected from the group consisting of a polyether modified silicone compound (A-1), a polyester modified silicone compound (A-2), and a polyacrylic modified silicone compound (A-3).
    Type: Application
    Filed: December 12, 2019
    Publication date: December 31, 2020
    Applicant: NIPPON PAINT AUTOMOTIVE COATINGS CO., LTD.
    Inventors: Masayuki KOTANI, Yuko HASEGAWA, Yasuyuki FURUYA, Keigo OBATA, Keisuke TSUTSUI, Hiroki ARAI, Hiroyoshi YAMAZAKI
  • Patent number: 10844191
    Abstract: The present invention addresses the problem of providing a polyacetal resin composition which can minimize degradation of a molded product produced from the acetal resin composition, when the molded product is in contact with an acidic cleaner. Said problem is solved by a polyacetal resin composition, comprising: polyacetal copolymer (A) in an amount of 100 parts by mass, wherein said polyacetal copolymer (A) has a hemiformal terminal group content of 0.8 mmol/kg or less; hindered phenol-based antioxidant (B) in an amount of 0.1 to 1.0 part by mass; and at least one selected from an oxide of magnesium or zinc or a hydroxide of magnesium or zinc (C) in an amount more than 2.0 parts by mass and 30 parts by mass or less.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: November 24, 2020
    Assignee: Polyplastics Co., Ltd.
    Inventors: Hiroki Arai, Tomohiro Monma
  • Patent number: 10809950
    Abstract: The web server program causes the information processing apparatus to function as: a reception unit that receives a request from a web application executed on the web browser; an acquisition unit configured to acquire, from the request, information about a domain of the web application executed on the web browser; a determination unit that determines whether or not to permit communication with the web application executed on the web browser, based on the domain indicated in the information acquired by the acquisition unit; and a transmission unit that transmits a response to the web browser based on the result of determination of the determination unit, wherein the web server program communicates with an external apparatus connected to a network, and acquires, from the external apparatus, information used for authentication or authorization by the external apparatus.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: October 20, 2020
    Assignee: CANON DENSHI KABUSHIKI KAISHA
    Inventors: Sousuke Onodera, Hiroki Miura, Taketo Ochiai, Hirotaka Watanabe, Kazuki Takano, Hiroki Arai, Dayon Kou, Yuantian Wei
  • Publication number: 20200192614
    Abstract: The web server program causes the information processing apparatus to function as: a reception unit that receives a request from a web application executed on the web browser; an acquisition unit configured to acquire, from the request, information about a domain of the web application executed on the web browser; a determination unit that determines whether or not to permit communication with the web application executed on the web browser, based on the domain indicated in the information acquired by the acquisition unit; and a transmission unit that transmits a response to the web browser based on the result of determination of the determination unit, wherein the web server program communicates with an external apparatus connected to a network, and acquires, from the external apparatus, information used for authentication or authorization by the external apparatus.
    Type: Application
    Filed: January 2, 2020
    Publication date: June 18, 2020
    Inventors: SOUSUKE ONODERA, Hiroki Miura, Taketo Ochiai, Hirotaka Watanabe, Kazuki Takano, Hiroki Arai, Dayon Kou, Yuantian Wei
  • Publication number: 20200172699
    Abstract: The present invention addresses the problem of providing a polyacetal resin composition which can minimize degradation of a molded product produced from the acetal resin composition, when the molded product is in contact with an acidic cleaner. Said problem is solved by a polyacetal resin composition, comprising: polyacetal copolymer (A) in an amount of 100 parts by mass, wherein said polyacetal copolymer (A) has a hemiformal terminal group content of 0.8 mmol/kg or less; hindered phenol-based antioxidant (B) in an amount of 0.1 to 1.0 part by mass; and at least one selected from an oxide of magnesium or zinc or a hydroxide of magnesium or zinc (C) in an amount more than 2.0 parts by mass and 30 parts by mass or less.
    Type: Application
    Filed: February 23, 2018
    Publication date: June 4, 2020
    Inventors: Hiroki ARAI, Tomohiro MONMA
  • Patent number: 10635364
    Abstract: The web server program causes the information processing apparatus to function as: a reception unit that receives a request from a web application executed on the web browser; an acquisition unit configured to acquire, from the request, information about a domain of the web application executed on the web browser; a determination unit that determines whether or not to permit communication with the web application executed on the web browser, based on the domain indicated in the information acquired by the acquisition unit; and a transmission unit that transmits a response to the web browser based on the result of determination of the determination unit, wherein the web server program communicates with an external apparatus connected to a network, and acquires, from the external apparatus, information used for authentication or authorization by the external apparatus.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: April 28, 2020
    Assignee: CANON DENSHI KABUSHIKI KAISHA
    Inventors: Sousuke Onodera, Hiroki Miura, Taketo Ochiai, Hirotaka Watanabe, Kazuki Takano, Hiroki Arai, Dayon Kou, Yuantian Wei
  • Patent number: 10490659
    Abstract: The present invention provides a semiconductor device that can achieve miniaturization or thinning of the size of the package while maintaining the characteristic of the MOSFET and reducing the on-resistance value, and a portable apparatus using the same. The gate electrodes 26 and 28 of the semiconductor chip 10 are disposed in the vicinity of the two side surfaces of the longitudinal direction (the x axis direction on the page) of the package 2, and the gate terminal 13 and 14 that is mounted with the gate electrodes 26 and 28 in a flip-chip manner are extended in the longitudinal direction of the package 2 and are derived to the outside from the two side surfaces 2A and 2B. Based on the configuration, it is capable of maximizing the size of the semiconductor chip with respect to the size of the package, and it is able to realize the high performance of the element characteristic for the module.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: November 26, 2019
    Assignee: UPI SEMICONDUCTOR CORP.
    Inventors: Masamichi Yanagida, Masashi Koyano, Nobuyoshi Matsuura, Hiroki Arai
  • Publication number: 20190282415
    Abstract: A nonwoven sheet is provided in a formation region of a target portion or a further wide region including the formation region of the target portion. The target portion is a composite of a nonwoven fabric as a base and loop pile fiber yarns which are woven and project from at least an external surface nonwoven fabric. The target portion is fixed to an outer nonwoven sheet forming the outside of a ventral part.
    Type: Application
    Filed: November 22, 2017
    Publication date: September 19, 2019
    Applicant: Daio Paper Corporation
    Inventor: Hiroki Arai
  • Publication number: 20190002693
    Abstract: A polyarylene sulfide resin composition characterized by comprising a polyarylene sulfide resin, and an olefinic copolymer comprising an ?-olefin-derived structural unit and an ?,?-unsaturated acid glycidyl ester-derived structural unit, wherein the olefinic copolymer content is at least 1.0 parts by mass and less than 5.0 parts by mass with respect to 100 parts by mass of the polyarylene sulfide resin, a melt viscosity of the polyarylene sulfide resin measured at 310° C. and a shear rate of 1216 sec?1 is at least 70 Pa·s and at most 300 Pa·s, and a flow length for a width of 20 mm and a thickness of 1 mm, at a cylinder temperature of 320° C., an injection pressure of 100 MPa and a mold temperature of 150° C., is at least 80 mm and at most 200 mm.
    Type: Application
    Filed: December 20, 2016
    Publication date: January 3, 2019
    Applicant: Polyplastics Co., Ltd.
    Inventors: Katsuhei Ohnishi, Hiroki Arai, Kuniaki Matsuda
  • Patent number: 10017643
    Abstract: A corona-resistant resin composition and a corona-resistant member, having sufficient durability relative to corona discharge, are provided. A corona-resistant resin composition obtained, at least, by melt kneading 7 to 80 parts by mass of a silicone-based polymer per 100 parts by mass of a resin component, and a corona-resistant member formed by molding the corona-resistant resin composition, are disclosed. A polyarylene sulfide resin or a polybutylene terephthalate resin may be used as the resin component.
    Type: Grant
    Filed: October 24, 2014
    Date of Patent: July 10, 2018
    Assignee: POLYPLASTICS CO., LTD.
    Inventor: Hiroki Arai
  • Publication number: 20180155836
    Abstract: A substrate processing apparatus includes a stage provided in a chamber, a shower head in which a plurality of slits are formed and which is opposed to the stage, a first gas supply part which supplies a first gas to a space between the stage and the shower head via the plurality of slits, and a second gas supply part which supplies a second gas which is not a noble gas to a region below the stage, wherein the second gas is the same gas as one of a plurality of kinds of gases constituting the first gas in a case where the first gas is a mixture gas constituted of the plurality of kinds of gases, and the second gas is the same gas as the first gas in a case where the first gas is a single kind of gas.
    Type: Application
    Filed: December 2, 2016
    Publication date: June 7, 2018
    Applicant: ASM IP Holding B.V.
    Inventors: Hiroki ARAI, Yukihiro MORI, Yuya NONAKA
  • Publication number: 20170207180
    Abstract: A semiconductor device is disclosed. The semiconductor device includes a semiconductor substrate having an active area and a source electrode formed on the semiconductor substrate. The source electrode is covered by a hard passivation layer and an opening is formed in the hard passivation layer. An under bump metal (UBM) layer used as a barrier film is formed broader than the opening to reduce a spreading resistance during the operation of the semiconductor device and a warp amount of the semiconductor substrate caused by variation of temperature.
    Type: Application
    Filed: December 30, 2016
    Publication date: July 20, 2017
    Inventors: Hiroki Arai, Masashi Koyano, Nobuyoshi Matsuura
  • Publication number: 20170194294
    Abstract: The present invention provides a semiconductor device that can achieve miniaturization or thinning of the size of the package while maintaining the characteristic of the MOSFET and reducing the on-resistance value, and a portable apparatus using the same. The gate electrodes 26 and 28 of the semiconductor chip 10 are disposed in the vicinity of the two side surfaces of the longitudinal direction (the x axis direction on the page) of the package 2, and the gate terminal 13 and 14 that is mounted with the gate electrodes 26 and 28 in a flip-chip manner are extended in the longitudinal direction of the package 2 and are derived to the outside from the two side surfaces 2A and 2B. Based on the configuration, it is capable of maximizing the size of the semiconductor chip with respect to the size of the package, and it is able to realize the high performance of the element characteristic for the module.
    Type: Application
    Filed: December 27, 2016
    Publication date: July 6, 2017
    Inventors: Masamichi Yanagida, Masashi Koyano, Nobuyoshi Matsuura, Hiroki Arai
  • Patent number: 9695293
    Abstract: A corona resistant resin composition having sufficient resistance to corona discharge, and a corona resistant member are provided. This corona resistant member is formed by molding a corona-resistant resin composition obtained by melting and mixing at least a resin component and mica, and a mode diameter of the mica in the volume-based particle size distribution measured by a laser diffraction/scattering method after molding is 1 to 200 ?m. For 100 parts by mass of the resin component, there are preferably 25-101 parts by mass of mica.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: July 4, 2017
    Assignee: POLYPLASTICS CO., LTD.
    Inventor: Hiroki Arai
  • Patent number: 9673092
    Abstract: A film forming apparatus includes a reactor chamber, a first electrode provided in the reactor chamber and receiving electrical power, a second electrode provided in the reactor chamber and facing the first electrode, a gas supply inlet for supplying material gas to a space between the first and second electrodes, and a gas exhaust outlet for discharging the material gas. Insulating material is not exposed to a flow path for the material gas in the reactor chamber.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: June 6, 2017
    Assignee: ASM IP Holding B.V.
    Inventors: Ryu Nakano, Noboru Takamure, Hiroki Arai
  • Patent number: 9623911
    Abstract: A rear part structure of a vehicle includes: a pair of right and left rear side members; a pair of side sills which are connected to the rear side members; a pair of sub frame side members respective one ends of which are connected to connecting parts between the rear side members and the side sills, the sub frame side members being extended to a rear side of the vehicle, in a manner inclined inward in a lateral direction of the vehicle; and a sub frame center member one end of which is connected to the other ends of the sub frame side members, the sub frame center member being extended to the rear side of the vehicle.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: April 18, 2017
    Assignees: MITSUBISHI JIDOSHA KOGYO KABUSHIKI KAISHA, MITSUBISHI JIDOSHA ENGINEERING KABUSHIKI KAISHA
    Inventors: Hiroaki Kano, Satoru Takahashi, Masato Nakamura, Toshiaki Isogai, Atsushi Ogita, Syunichiro Ohma, Yuichi Miyake, Hiroyuki Inoue, Muneaki Kato, Hiroki Arai