Abstract: A plurality of semiconductor chips are formed on a wafer. By forming a dummy pattern of a linear shape on an insulating film formed on a semiconductor chip along dicing lines provided for separating the plurality of semiconductor chips into the individual semiconductor chips, when the separation of the semiconductor chips is performed along the dicing lines, an advancing of a film peeling to a recognition mark for bonding within the dummy pattern or elements is prevented to reduce both a recognition error of information at the time of bonding of the semiconductor chip and the number of defective elements.

Abstract: An LED array in which the optical output distribution in each light emitting region is as uniform as possible. An n electrode 3 is provided on the under surface of a substrate 2 and a p electrode is provided on the upper surface thereof. A multiplicity of light emitting regions 4 are formed on the upper layer of the substrate 2. Two strip-like conductor portions 6c extending over each light emitting region 4 in ohmic contact are connected to each electrode 6 so that a current is efficiently applied to the conductor portions 6c of each light emitting region 4 and the optical output distribution in each light emitting region 4 is made uniform.

Abstract: An LED head includes a circuit substrate on which a light emitting element and drive IC are mounted, a SELFOC lens for condensing the irradiating light from the light emitting element on the circuit substrate, and a head cover of aluminum for holding the SELFOC lens spaced a given distance away from the light emitting element and for radiating heat from the circuit substrate.

Abstract: In an image sensor including a light emitting element for emitting a light beam to be incident on a document, a light receiving element for receiving the light beam reflected by the document, and a lens array for directing the reflected light beam from the document to the light receiving element, there is located a mirror between the lens array and the light receiving element for changing the direction of the light beam passing through the lens array. The light emitting element and the light receiving element are located on the same substrate. With this arrangement, a compact and inexpensive image sensor can be achieved. This compact image sensor causes an increased amount of light to be incident on the document.

Abstract: An LED array in which the optical output distribution in each light emitting region is as uniform as possible. An n electrode 3 is provided on the under surface of a substrate 2 and a p electrode is provided on the upper surface thereof. A multiplicity of light emitting regions 4 are formed on the upper layer of the substrate 2. Two strip-like conductor portions 6c extending over each light emitting region 4 in ohmic contact are connected to each electrode 6 so that a current is efficiently applied to the conductor portions 6c of each light emitting region 4 and the optical output distribution in each light emitting region 4 is made uniform.

Abstract: The spots to be bonded are determined by a light intensity controller as data and bonding is carried out in accordance with the data. The data obtained are stored in a memory or disk memory. In the case of storing the data in the memory, the data is transmitted to a wire bonder as occasion demands, and the wire bonder carries out bonding in accordance with the received data. In the case of storing the data in the disk memory, the disk memory is mounted on the wire bonder. The wire bonder reads out the data from the disk memory as occasion demands and carries out wire bonding.

Abstract: An LED light source with readily adjustable luminous energy including LED chips is disclosed. A resistor device is provided in order to control the current flowing in LED chips for reducing variance of luminous energy. The resistor device includes a plurality of resistors arranged in parallel, and a plurality of fuses connected in series with the respective resistors. In order to obtain the desired resistance value of the resistor device, the fuses connected to unnecessary resistors in series are burnt out by applying an excess current to the fuses thereby omitting a bonding process of the resistors or the like.

Abstract: An apparatus for optically writing information comprises a row of longitudinally spaced LED array chips, a photosensitive surface arranged to face the chip row in parallel thereto, and a lens system arranged between the chip row and the photosensitive surface. Each array chip has constantly spaced LEDs to provide luminescent dots. The lens system includes convex lens elements arranged in corresponding relation to the respective array chips to form magnified images, in inverted arrangement, of the luminescent dots of the respective array chips on the photosensitive surface, so that all of the dot images on the photosensitive surface are constantly spaced.

Abstract: Thermal printing is effected by pressing a heat generating element of a thermal head to paper intervening a transferring ribbon with a heat-sensitive ink layer and immediately after printing, the transferring ribbon is bend so as to detach rapidly the ribbon from the paper.