Patents by Inventor Hiromitsu Nakashima
Hiromitsu Nakashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170199453Abstract: An object of the present invention is to provide a novel fluorine-containing polymer, a radiation-sensitive resin composition for liquid immersion lithography which contains the fluorine-containing polymer, which leads to a pattern having an excellent shape and excellent depth of focus, wherein the amount of an eluted component in a liquid for liquid immersion lithography such as water that comes in contact with the resist during exposure in liquid immersion lithography is little, and which provides a larger receding contact angle between the resist film and the liquid for liquid immersion lithography such as water, and a method for purifying the fluorine-containing polymer. The present resin composition comprises a novel fluorine-containing polymer (A) containing repeating units represented by the general formulae (1) and (2) and having Mw of 1,000-50,000, a resin (B) having an acid-unstable group, a radiation-sensitive acid generator (C), a nitrogen-containing compound (D) and a solvent (E).Type: ApplicationFiled: October 21, 2016Publication date: July 13, 2017Applicant: JSR CORPORATIONInventors: Hiroki NAKAGAWA, Hiromitsu Nakashima, Gouji Wakamatsu, Kentarou Gotou, Yukio Nishimura, Takeo Shioya
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Patent number: 9688523Abstract: It is an objective of the present invention to provide a cap opening tool set that enables the user of a container to reduce surely an inner pressure of the container and loosen smoothly a screw cap even if the user has only a weak arm power. A cap opening tool set according to the present invention includes a ring and a cap opener. The ring includes a guide section for facing a circumferential surface section of a screw cap. The cap opener includes a head to be placed over the screw cap and arms extending from the head. The head includes a contact section, a top-surface facing section, and a needle. The contact section enters a space formed between the screw cap and the guide section and presses the circumferential surface section of the screw cap. The needle penetrates the top surface section of the screw cap.Type: GrantFiled: September 9, 2011Date of Patent: June 27, 2017Assignee: UCC Ueshima Coffee Co., Ltd.Inventors: Takayuki Kamakura, Shinichi Nomura, Osamu Nakagiri, Hiromitsu Nakashima
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Patent number: 9598520Abstract: A radiation-sensitive resin composition includes a first polymer, a second polymer and a radiation-sensitive acid generator. The first polymer has a structure unit represented by a following formula (1-1), a structure unit represented by a following formula (1-2), or both thereof, and has a content of fluorine atoms of no less than 5% by mass to a total mass of the first polymer. The second polymer has an acid-dissociable group, and has a content of fluorine atoms of less than 5% by mass to a total mass of the second polymer.Type: GrantFiled: May 17, 2012Date of Patent: March 21, 2017Assignee: JSR CorporationInventors: Yuko Kiridoshi, Takehiko Naruoka, Yukio Nishimura, Yusuke Asano, Takanori Kawakami, Hiromitsu Nakashima
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Patent number: 9513548Abstract: A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R1 represents an alkali-labile group. A represents an oxygen atom, —NR?—, —CO—O—# or —SO2—O—##, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R? represents a hydrogen atom or an alkali-labile group, and “#” and “##” each indicate a bonding hand bonded to R1.Type: GrantFiled: April 2, 2014Date of Patent: December 6, 2016Assignee: JSR CORPORATIONInventors: Yuusuke Asano, Mitsuo Satou, Hiromitsu Nakashima, Kazuki Kasahara, Yoshifumi Oizumi, Masafumi Hori, Takanori Kawakami, Yasuhiko Matsuda, Kazuo Nakahara
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Patent number: 9500950Abstract: An object of the present invention is to provide a novel fluorine-containing polymer, a radiation-sensitive resin composition for liquid immersion lithography which contains the fluorine-containing polymer, which leads to a pattern having an excellent shape and excellent depth of focus, wherein the amount of an eluted component in a liquid for liquid immersion lithography such as water that comes in contact with the resist during exposure in liquid immersion lithography is little, and which provides a larger receding contact angle between the resist film and the liquid for liquid immersion lithography such as water, and a method for purifying the fluorine-containing polymer. The present resin composition comprises a novel fluorine-containing polymer (A) containing repeating units represented by the general formulae (1) and (2) and having Mw of 1,000-50,000, a resin (B) having an acid-unstable group, a radiation-sensitive acid generator (C), a nitrogen-containing compound (D) and a solvent (E).Type: GrantFiled: November 5, 2015Date of Patent: November 22, 2016Assignee: JSR CORPORATIONInventors: Hiroki Nakagawa, Hiromitsu Nakashima, Gouji Wakamatsu, Kentarou Gotou, Yukio Nishimura, Takeo Shioya
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Publication number: 20160179003Abstract: A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R1 represents an alkali-labile group. A represents an oxygen atom, —NR?—, —CO—O—# or —SO2—O—##, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R? represents a hydrogen atom or an alkali-labile group, and “#” and “##” each indicate a bonding hand bonded to R1.Type: ApplicationFiled: February 29, 2016Publication date: June 23, 2016Applicant: JSR CorporationInventors: Yuusuke ASANO, Mitsuo Sato, Hiromitsu Nakashima, Kazuki Kasahara, Yoshifumi Oizumi, Masafumi Hori, Takanori Kawakami, Yasuhiko Matsuda, Kazuo Nakahara
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Publication number: 20160062237Abstract: An object of the present invention is to provide a novel fluorine-containing polymer, a radiation-sensitive resin composition for liquid immersion lithography which contains the fluorine-containing polymer, which leads to a pattern having an excellent shape and excellent depth of focus, wherein the amount of an eluted component in a liquid for liquid immersion lithography such as water that comes in contact with the resist during exposure in liquid immersion lithography is little, and which provides a larger receding contact angle between the resist film and the liquid for liquid immersion lithography such as water, and a method for purifying the fluorine-containing polymer. The present resin composition comprises a novel fluorine-containing polymer (A) containing repeating units represented by the general formulae (1) and (2) and having Mw of 1,000-50,000, a resin (B) having an acid-unstable group, a radiation-sensitive acid generator (C), a nitrogen-containing compound (D) and a solvent (E).Type: ApplicationFiled: November 5, 2015Publication date: March 3, 2016Applicant: JSR CORPORATIONInventors: Hiroki NAKAGAWA, Hiromitsu NAKASHIMA, Gouji WAKAMATSU, Kentarou GOTOU, Yukio NISHIMURA, Takeo SHIOYA
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Patent number: 9268219Abstract: A photoresist composition includes a polymer that includes a first structural unit shown by a formula (1), and an acid generator. R1 represents a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group. R2 represents a divalent hydrocarbon group having 1 to 10 carbon atoms. A represents —COO—*, —OCO—*, —O—, —S—, or —NH—, wherein “*” indicates a site bonded to R3. R3 represents a single bond or a divalent hydrocarbon group having 1 to 10 carbon atoms. The polymer preferably further includes a second structural unit that includes an acid-labile group.Type: GrantFiled: October 4, 2012Date of Patent: February 23, 2016Assignee: JSR CorporationInventors: Hiromu Miyata, Hiromitsu Nakashima, Masafumi Yoshida
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Patent number: 9213236Abstract: A fluorine-containing polymer for use in a radiation-sensitive resin composition is used for forming a photoresist film in a process of forming a resist pattern, including a liquid immersion lithographic process in which radiation is emitted through a liquid having a refractive index larger than the refractive index of air at a wavelength of 193 nm, and being present between a lens and the photoresist film. The fluorine-containing polymer has a weight average molecular weight determined by gel permeation chromatography in the range from 1,000 to 50,000 and a receding contact angle with water and the photoresist film formed therefrom is 70° or more.Type: GrantFiled: February 12, 2014Date of Patent: December 15, 2015Assignee: JSR CORPORATIONInventors: Hiroki Nakagawa, Hiromitsu Nakashima, Gouji Wakamatsu, Kentarou Gotou, Yukio Nishimura, Takeo Shioya
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Patent number: 9158196Abstract: A radiation-sensitive resin composition for forming a resist film includes a polymer including a first structural unit represented by a formula (1) and a second structural unit represented by a formula (2). The first structural unit and the second structural unit are included in an identical polymer molecule or different polymer molecules. R1 represents a hydrogen atom or a methyl group. Q represents a divalent linking group having 1 to 4 carbon atoms. X represents a monovalent lactone group. A part or all of hydrogen atoms included in the monovalent lactone group represented by X are not substituted or substituted. R2 represents a hydrogen atom or a methyl group. Y represents a monovalent lactone group. A part or all of hydrogen atoms included in the monovalent lactone group represented by Y are not substituted or substituted.Type: GrantFiled: March 27, 2013Date of Patent: October 13, 2015Assignee: JSR CORPORATIONInventors: Kazuki Kasahara, Hiromitsu Nakashima, Masafumi Hori, Masafumi Yoshida
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Patent number: 9116427Abstract: A composition for forming a resist underlayer film includes a polysiloxane and a solvent. The solvent includes an organic solvent having a standard boiling point of no less than 150.0° C., and water. A content of the organic solvent is no less than 1% by mass and no greater than 50% by mass with respect to a total amount of the solvent. A content of water is no less than 1% by mass and no greater than 30% by mass with respect to the total amount of the solvent.Type: GrantFiled: March 6, 2013Date of Patent: August 25, 2015Assignee: JSR CORPORATIONInventors: Shunsuke Kurita, Kazunori Takanashi, Hiromitsu Nakashima, Tooru Kimura
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Patent number: 9046765Abstract: A resist pattern-forming method includes providing a resist film having a surface free energy of 30 to 40 mN/m on a substrate using a radiation-sensitive resin composition. The resist film is exposed by applying radiation via a mask. The exposed resist film is developed. It is preferable that the exposing of the resist film includes exposing the resist film via an immersion liquid that is provided over the resist film.Type: GrantFiled: September 26, 2013Date of Patent: June 2, 2015Assignee: JSR CORPORATIONInventors: Hiromitsu Nakashima, Toru Kimura, Yusuke Asano, Masafumi Hori, Reiko Kimura, Kazuki Kasahara, Hiromu Miyata, Masafumi Yoshida
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Patent number: 8895223Abstract: The radiation-sensitive resin composition includes a compound represented by a following formula (1), and a resin. The resin has an acid-dissociable group, is insoluble or hardly soluble in an alkali, and turns to be soluble in an alkali when the acid-dissociable group is dissociated. R represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, R1 represents a hydrocarbon group having 1 to 20 carbon atoms or the like, R2 to R5 each independently represent an alkyl group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 4 to 20 carbon atoms, or the like, and R6 represents a halogen atom or the like.Type: GrantFiled: March 23, 2012Date of Patent: November 25, 2014Assignee: JSR CorporationInventors: Mitsuo Sato, Kazuo Nakahara, Hiromitsu Nakashima
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Patent number: 8895229Abstract: A composition for formation of upper layer film, which is used for forming an upper layer film on the surface of a photoresist film and which comprises a resin (A) having a repeating unit represented by the following general formula (1-1) and not having a repeating unit represented by the following general formula (1-2), and a resin (B) having a repeating unit represented by the following general formula (1-2) and not having a repeating unit represented by the following general formula (1-1). [In the general formulas (1-1) and (1-2), R1 is hydrogen or the like; R2 is single bonds or the like; and R3 is a fluorine-substituted, linear or branched alkyl group having 1 to 12 carbon atoms, or the like.] The composition can form an upper layer film giving a sufficiently high receded contact angle.Type: GrantFiled: October 11, 2007Date of Patent: November 25, 2014Assignee: JSR CorporationInventors: Yukio Nishimura, Norihiko Sugie, Hiromitsu Nakashima, Norihiro Natsume, Daita Kouno
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Publication number: 20140224071Abstract: It is an objective of the present invention to provide a cap opening tool set that enables the user of a container to reduce surely an inner pressure of the container and loosen smoothly a screw cap even if the user has only a weak arm power. A cap opening tool set according to the present invention includes a ring and a cap opener. The ring includes a guide section for facing a circumferential surface section of a screw cap. The cap opener includes a head to be placed over the screw cap and arms extending from the head. The head includes a contact section, a top-surface facing section, and a needle. The contact section enters a space formed between the screw cap and the guide section and presses the circumferential surface section of the screw cap. The needle penetrates the top surface section of the screw cap.Type: ApplicationFiled: September 9, 2011Publication date: August 14, 2014Applicants: UCC Ueshima Coffee Co., Ltd., Nippon Light Metal Company, Ltd.Inventors: Takayuki Kamakura, Shinichi Nomura, Osamu Nakagiri, Hiromitsu Nakashima
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Publication number: 20140212813Abstract: A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R1 represents an alkali-labile group. A represents an oxygen atom, —NR?—, —CO—O—# or —SO2—O—##, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R? represents a hydrogen atom or an alkali-labile group, and “#” and “##” each indicate a bonding hand bonded to R1.Type: ApplicationFiled: April 2, 2014Publication date: July 31, 2014Applicant: JSR CORPORATIONInventors: Yuusuke ASANO, Mitsuo SATOU, Hiromitsu NAKASHIMA, Kazuki KASAHARA, Yoshifumi OIZUMI, Masafumi HORI, Takanori KAWAKAMI, Yasuhiko MATSUDA, Kazuo NAKAHARA
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Publication number: 20140162190Abstract: A fluorine-containing polymer for use in a radiation-sensitive resin composition is used for forming a photoresist film in a process of forming a resist pattern, including a liquid immersion lithographic process in which radiation is emitted through a liquid having a refractive index larger than the refractive index of air at a wavelength of 193 nm, and being present between a lens and the photoresist film. The fluorine-containing polymer has a weight average molecular weight determined by gel permeation chromatography in the range from 1,000 to 50,000 and a receding contact angle with water and the photoresist film formed therefrom is 70° or more.Type: ApplicationFiled: February 12, 2014Publication date: June 12, 2014Applicant: JSR CORPORATIONInventors: Hiroki NAKAGAWA, Hiromitsu NAKASHIMA, Gouji WAKAMATSU, Kentarou HARADA, Yukio NISHIMURA, Takeo SHIOYA
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Patent number: 8728706Abstract: A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R1 represents an alkali-labile group. A represents an oxygen atom, —NR?—, —CO—O—# or —SO2—O—##, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R? represents a hydrogen atom or an alkali-labile group, and “#” and “##” indicates a bonding hand bonded to R1.Type: GrantFiled: March 15, 2012Date of Patent: May 20, 2014Assignee: JSR CorporationInventors: Yuusuke Asano, Mitsuo Satou, Hiromitsu Nakashima, Kazuki Kasahara, Yoshifumi Oizumi, Masafumi Hori, Takanori Kawakami, Yasuhiko Matsuda, Kazuo Nakahara
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Patent number: 8697343Abstract: An object of the present invention is to provide a novel fluorine-containing polymer, a radiation-sensitive resin composition for liquid immersion lithography which contains the fluorine-containing polymer, which leads to a pattern having an excellent shape and excellent depth of focus, wherein the amount of an eluted component in a liquid for liquid immersion lithography such as water that comes in contact with the resist during exposure in liquid immersion lithography is little, and which provides a larger receding contact angle between the resist film and the liquid for liquid immersion lithography such as water, and a method for purifying the fluorine-containing polymer. The present resin composition comprises a novel fluorine-containing polymer (A) containing repeating units represented by the general formulae (1) and (2) and having Mw of 1,000-50,000, a resin (B) having an acid-unstable group, a radiation-sensitive acid generator (C), a nitrogen-containing compound (D) and a solvent (E).Type: GrantFiled: March 23, 2007Date of Patent: April 15, 2014Assignee: JSR CorporationInventors: Hiroki Nakagawa, Hiromitsu Nakashima, Gouji Wakamatsu, Kentarou Harada, Yukio Nishimura, Takeo Shioya
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Publication number: 20140023968Abstract: A resist pattern-forming method includes providing a resist film having a surface free energy of 30 to 40 mN/m on a substrate using a radiation-sensitive resin composition. The resist film is exposed by applying radiation via a mask. The exposed resist film is developed.Type: ApplicationFiled: September 26, 2013Publication date: January 23, 2014Applicant: JSR CORPORATIONInventors: Hiromitsu NAKASHIMA, Toru KIMURA, Yusuke ASANO, Masafumi HORI, Reiko KIMURA, Kazuki KASAHARA, Hiromu MIYATA, Masafumi YOSHIDA