Abstract: There is provided a transparent conductive film achieving low resistance characteristics of a transparent conductive layer. The present invention provides a transparent conductive film including: a polymer film substrate; and a transparent conductive layer formed on at least one surface of the polymer film substrate, wherein the transparent conductive film includes an inorganic undercoat layer formed by means of a vacuum film-forming method between the polymer film substrate and the transparent conductive layer, and an existing atomic amount of carbon atoms in the transparent conductive layer is 3×1020 atoms/cm3 or less.

Abstract: The transparent conductive film of the invention includes a transparent conductive coating provided on at least one surface of an organic polymer film substrate, wherein the transparent conductive coating is a crystalline coating of an indium-based complex oxide having a tetravalent metal oxide content of 7 to 15% by weight as calculated by the formula {(the amount of the tetravalent metal element oxide)/(the amount of the tetravalent metal element oxide+the amount of indium oxide)}×100 (%), has a thickness of 10 to 40 nm and a specific resistance of 1.3×10?4 to 2.8×10?4 ?·cm, has main X-ray diffraction peaks corresponding to (222) and (440) planes, and has a ratio (I440/I222) of (440) peak intensity to (222) peak intensity of less than 0.2. The transparent conductive film of the invention has a crystalline thin coating with a low level of specific resistance and surface resistance.

Abstract: There is provided a transparent conductive film achieving low resistance characteristics of a transparent conductive layer. The present invention provides a transparent conductive film including: a polymer film substrate; and a transparent conductive layer formed on at least one surface of the polymer film substrate by means of a sputtering method using a sputtering gas including argon, wherein an existing atomic amount of argon atoms in the transparent conductive layer is 0.24 atomic % or less; an existing atomic amount of hydrogen atoms in the transparent conductive layer is 13×1020 atoms/cm3 or less; and the transparent conductive layer has a specific resistance of 1.1×10?4 ?·cm or more and 2.8×10—4 ?·cm or less.

Abstract: A transparent conductive film includes a transparent conductive coating provided on at least one surface of an organic polymer film substrate, wherein the transparent conductive coating is a crystalline coating of an indium-based complex oxide having a content of a tetravalent metal element oxide of 7 to 15% by weight calculated by the formula {(the amount of the tetravalent metal element oxide)/(the amount of the tetravalent metal element oxide+the amount of indium oxide)}=100(%), has a thickness in the range of more than 40 to 200 nm, a specific resistance of 1.2×10?4 to 2.0×10?4 ?·cm, main X-ray diffraction peaks corresponding to (222) and (440) planes and has a ratio (I440/I222) of (440) peak intensity (I440) to (222) peak intensity (I222) of less than 0.3, and has an internal stress of 700 MPa or less as determined by an X-ray stress measurement method.

Abstract: A transparent conductive film includes a polymeric film substrate and a transparent conductive layer on at least one of main surfaces of the polymeric film substrate. The transparent conductive layer is a crystalline transparent conductive layer comprising an indium tin composite oxide. The transparent conductive layer has a residual stress of less than or equal to 600 MPa. The transparent conductive layer has a specific resistance of 1.1×10?4 ?·cm to 3.0×10?4 ?·cm. The transparent conductive layer has a thickness of 15 nm to 40 nm.

Abstract: Provided is a transparent conductive film that can drastically improving an electrical characteristic of a transparent conductive layer after crystallizing process with resped to the transparent conductive layer before the crystallizing process and can achieve a lower resistivity. The transparent conductive film (1) is provided with a film substrate (2) and a crystalline transparent conductive layer (3) formed on one of the main surfaces (2a) of the said substrate. The amorphous transparent conductive layer before the crystallizing process has a carrier density na×1019 of (10 to 60)×1019/cm3 and Hall mobility ?a of 10 to 25 cm2/V·s, the crystalline transparent conductive layer after the crystallizing process has a carrier density nc×1019 of (80 to 150)×1019/cm3 and Hall mobility t of 20 to 40 cm2/V·s, and the length of motion L defined by {(nc?na)2+(?c??a)2}1/2 is 50 to 150.

Abstract: A transparent conductive film 1 includes a transparent substrate 2; a first optical adjustment layer 4 disposed on one side in the thickness direction of the transparent substrate 2 and made of a resin layer; an inorganic substance layer 5 disposed on one side in the thickness direction of the first optical adjustment layer 4 so as to make contact with the first optical adjustment layer 4; and a transparent conductive layer 6 disposed on one side in the thickness direction of the inorganic substance layer 5. The inorganic substance layer 5 has a thickness of 10 nm or less, and the surface of the one side in the thickness direction of the transparent conductive layer 6 has a surface roughness of 1.40 nm or less.

Abstract: The present invention relates to a transparent conductive film which is excellent in dotting property under a heavy load and excellent in bending resistance. Provided is a transparent conductive film, comprising a flexible transparent base; and a transparent conductive layer formed on the flexible transparent base and including a crystalline indium/tin composite oxide, wherein a compressive residual stress of the transparent conductive layer is 0.4 to 2 GPa.

Abstract: A transparent conductive film includes a transparent conductive coating provided on at least one surface of an organic polymer film substrate, wherein the transparent conductive coating is a crystalline coating of an indium-based complex oxide having a content of a tetravalent metal element oxide of 7 to 15% by weight calculated by the formula {(the amount of the tetravalent metal element oxide)/(the amount of the tetravalent metal element oxide+the amount of indium oxide)}=100(%), has a thickness in the range of more than 40 to 200 nm, a specific resistance of 1.2×10?4 to 2.0×10?4 ?·cm, main X-ray diffraction peaks corresponding to (222) and (440) planes and has a ratio (I440/I222) of (440) peak intensity (I440) to (222) peak intensity (I222) of less than 0.3, and has an internal stress of 700 MPa or less as determined by an X-ray stress measurement method.

Abstract: A method for producing a transparent conductive film includes: forming a transparent conductive coating on at least one surface of an organic polymer film substrate in the presence of inert gas by RF superimposed DC sputtering deposition using an indium-based complex oxide target with a high horizontal magnetic field of 85 to 200 mT at a surface of the target in a roll-to-roll system, wherein the indium-based complex oxide target has a content of a tetravalent metal element oxide of 7 to 15% by weight as calculated by the formula {(the amount of the tetravalent metal element oxide)/(the amount of the tetravalent metal element oxide+the amount of indium oxide)}×100(%), wherein the transparent conductive coating has a thickness in the range of 10 to 40 nm, and the transparent conductive coating has a specific resistance of 1.3×10?4 to 2.8×10?4 ?·cm.

Abstract: A transparent conductive film, includes: an organic polymer film substrate; at least one undercoat layer formed on the organic polymer film substrate by a dry process; and a transparent conductive coating provided on at least one surface of the organic polymer film substrate with the undercoat layer interposed therebetween, wherein the transparent conductive coating is a crystalline coating of an indium-based complex oxide having a content of a tetravalent metal element oxide of 7 to 15% by weight as calculated by the formula {(the amount of the tetravalent metal element oxide)/(the amount of the tetravalent metal element oxide+the amount of indium oxide)}×100(%), the transparent conductive coating has a thickness in the range of 10 to 40 nm, and the transparent conductive coating has a specific resistance of 1.3×10?4 to 2.8×10?4 ?·cm.

Abstract: The transparent conductive film of the invention includes a transparent conductive coating provided on at least one surface of an organic polymer film substrate, wherein the transparent conductive coating is a crystalline coating of an indium-based complex oxide having a tetravalent metal oxide content of 7 to 15% by weight as calculated by the formula {(the amount of the tetravalent metal element oxide)/(the amount of the tetravalent metal element oxide+the amount of indium oxide)}×100 (%), has a thickness of 10 to 40 nm and a specific resistance of 1.3×10?4 to 2.8×10?4 ?·cm, has main X-ray diffraction peaks corresponding to (222) and (440) planes, and has a ratio (I440/I222) of (440) peak intensity to (222) peak intensity of less than 0.2. The transparent conductive film of the invention has a crystalline thin coating with a low level of specific resistance and surface resistance.

Abstract: The present invention relates to a transparent conductive film which is excellent in dotting property under a heavy load and excellent in bending resistance. Provided is a transparent conductive film, comprising a flexible transparent base; and a transparent conductive layer formed on the flexible transparent base and including a crystalline indium/tin composite oxide, wherein a compressive residual stress of the transparent conductive layer is 0.4 to 2 GPa.

Abstract: An object of the present invention is to manufacture a long transparent conductive film comprising a transparent film substrate and a crystalline indium composite oxide film formed on the transparent film substrate. The manufacturing method of the present invention includes an amorphous laminate formation step of forming an amorphous film of an indium composite oxide containing indium and a tetravalent metal on the long transparent film substrate with a sputtering method, and a crystallization step of continuously feeding the long transparent film substrate on which the amorphous film is formed into a furnace and crystallizing the amorphous film. The temperature inside the furnace in the crystallization step is preferably 170 to 220° C. The change rate of the film length in the crystallization step is preferably +2.5% or less.

Abstract: Provided are a transparent film of an excellent visual quality and a pressure-sensitive adhesive film including the transparent film. Transparent film includes base layer formed of transparent resinous material and top coat layer provided on its first face. Top coat layer has an average thickness Dave of 2 nm to 50 nm and the thickness deviation ?D is 40% or smaller of the average thickness Dave.

Abstract: A transparent film whose back-face has excellent resistance to scratch, and a surface protection film having the transparent film are provided. A transparent film has a substrate layer formed of a transparent resin material, and a back-face layer with a thickness of 1 ?m or less provided on a first face thereof. In a scratch test of the transparent film, the failure initiation load of the back-face layer is 50 mN or greater and the friction coefficient of the back-face layer is 0.4 or less.

Abstract: The double-faced adhesive tape has a substrate, an acrylic pressure-sensitive adhesive layer, a rubber pressure-sensitive adhesive layer, and a first release liner that is formed on an external side of the rubber pressure-sensitive adhesive layer, and a second release liner that is formed on an external side of the acrylic pressure-sensitive adhesive layer. The first release liner each has a polymer layer and a paper substrate layer. Further, the second release liner each has a polymer layer and a paper substrate layer. Dynamic friction coefficient on the surface of each polymer layer is less than 1.0, when the coefficient is measured according to JIS K7125.

Abstract: The present invention aims at providing a composite semipermeable membrane excellent in water permeability and salt-blocking rate, and including an extremely small amount of unreacted polyfunctional amine components in the membrane, and at providing a process for producing the composite semipermeable membrane. A composite semipermeable membrane having a skin layer formed on the surface of a porous support, the skin layer comprising a polyamide resin obtained by interfacial polymerization of a polyfunctional amine component and a polyfunctional acid halide component, wherein the content of an unreacted polyfunctional amine component is 200 mg/m2 or less after formation of the skin layer and before a membrane washing treatment, and the content of the unreacted polyfunctional amine component after the membrane washing treatment is 20 mg/m2 or less.

Abstract: The present invention aims at providing a composite semipermeable membrane having outstanding water permeability and salt-blocking rate, and extremely small amount of unreacted polyfunctional amine components in the porous support, and at providing a process for producing the composite semipermeable membrane. A composite semipermeable membrane having a skin layer formed on the surface of a porous support, the skin layer comprising a polyamide resin obtained by interfacial polymerization of a polyfunctional amine component and a polyfunctional acid halide component, wherein the porous support has a microporous layer on a base material, and the content of an unreacted polyfunctional amine component in the base material after a membrane washing treatment is 0.5 mg/m2 or less.

Abstract: The present invention aims at providing a composite semipermeable membrane excellent in water permeability and salt-blocking rate, and including an extremely small amount of unreacted polyfunctional amine components in the membrane, and at providing a process for producing the composite semipermeable membrane. A composite semipermeable membrane having a skin layer formed on the surface of a porous support, the skin layer comprising a polyamide resin obtained by interfacial polymerization of a polyfunctional amine component and a polyfunctional acid halide component, wherein the content of an unreacted polyfunctional amine component is 200 mg/m2 or less after formation of the skin layer and before a membrane washing treatment, and the content of the unreacted polyfunctional amine component after the membrane washing treatment is 20 mg/m2 or less.