Abstract: Out-of-stock commodity is flexibly managed according to a change in shelf assignment. Each of sensor units (101-1 to 101-N) is configured by at least one pressure sensor and outputs an analog signal corresponding to a weight of a commodity detected by at least one pressure sensor. Sensor output unit (103) converts an analog signal output from each of a plurality of sensor units into a digital signal indicating whether or not the number of commodities in regions where respective sensor units are installed is equal to or less than a predetermined number. Combination setter (104) sets one or more groups obtained by grouping a plurality of sensor units. Output integrator (105) integrates a digital signal for each group. Out-of-stock commodity manager (106) manages an out-of-stock commodity state of commodities in each group, based on an integrated digital signal.

Abstract: In a semiconductor memory device 100, a non-volatile element section 4 stores information necessary for rescuing a main memory cell, as storage information, in a non-volatile element. When rescue information S3 is newly outputted by a redundancy rescue section, a rescue determination section 5 determines whether or not a main memory cell is to be rescued, based on storage information S4 stored in the non-volatile element section 4, and the rescue information S3 which is newly outputted. The non-volatile element section 4 renews the storage information based on a determination result from the rescue determination section 5. Thus, on the assumption that power is turned off each time a voltage condition is changed, the semiconductor memory device 100 is capable of determining whether or not the rescue is to be performed, based on results of testings performed under a plurality of voltage conditions.

Abstract: A semiconductor memory device includes a memory cell having a circuit configuration in which a potential supplied to sources of load transistors 108 and 111 included in a latch section is different from at least one of a potential supplied to a word line 105 and a potential supplied to bit lines 106 and 107; a latch potential control circuit 101 for switching a normal operation mode and a test mode to each other in accordance with a signal applied to a test mode setting pin 102; and a read/write control circuit 103 for controlling the potential supplied to the sources of the load transistors 108 and 111 to be lower than at least one of the potential supplied to the word line 105 and the potential supplied to the bit lines 106 and 107, during an arbitrary period of at least a read operation in the test mode.

Abstract: A semiconductor memory device includes a memory cell having a circuit configuration in which a potential supplied to sources of load transistors 108 and 111 included in a latch section is different from at least one of a potential supplied to a word line 105 and a potential supplied to bit lines 106 and 107; a latch potential control circuit 101 for switching a normal operation mode and a test mode to each other in accordance with a signal applied to a test mode setting pin 102; and a read/write control circuit 103 for controlling the potential supplied to the sources of the load transistors 108 and 111 to be lower than at least one of the potential supplied to the word line 105 and the potential supplied to the bit lines 106 and 107, during an arbitrary period of at least a read operation in the test mode.

Abstract: In a semiconductor memory device 100, a non-volatile element section 4 stores information necessary for rescuing a main memory cell, as storage information, in a non-volatile element. When rescue information S3 is newly outputted by a redundancy rescue section, a rescue determination section 5 determines whether or not a main memory cell is to be rescued, based on storage information S4 stored in the non-volatile element section 4, and the rescue information S3 which is newly outputted. The non-volatile element section 4 renews the storage information based on a determination result from the rescue determination section 5. Thus, on the assumption that power is turned off each time a voltage condition is changed, the semiconductor memory device 100 is capable of determining whether or not the rescue is to be performed, based on results of testings performed under a plurality of voltage conditions.

Abstract: The present invention provides a semiconductor integrated circuit having area efficiency and repair efficiency improved by sharing a redundant memory macro among a plurality of SRAM macros. Each of the plurality of memory macros 1A1 and 1A2 includes a memory cell array 1A-3 connected to word lines WL1 to WL32 and bit lines and a redundant circuit that replaces a defective bit line of the memory cell array to a normal bit line and a redundant bit line BLA65 and outputs defect information to a redundant signal line RA. The redundant memory macro 2A includes a redundant memory cell array connected to redundant word lines and the redundant bit line, and a first word line connection circuit that connects a word line corresponding to a memory macro to be repaired and disconnects a word line corresponding to a normal memory macro from the redundant word line.

Abstract: A semiconductor memory device includes a memory cell having a circuit configuration in which a potential supplied to sources of load transistors 108 and 111 included in a latch section is different from at least one of a potential supplied to a word line 105 and a potential supplied to bit lines 106 and 107; a latch potential control circuit 101 for switching a normal operation mode and a test mode to each other in accordance with a signal applied to a test mode setting pin 102; and a read/write control circuit 103 for controlling the potential supplied to the sources of the load transistors 108 and 111 to be lower than at least one of the potential supplied to the word line 105 and the potential supplied to the bit lines 106 and 107, during an arbitrary period of at least a read operation in the test mode.

Abstract: A semiconductor memory device includes a memory cell having a circuit configuration in which a potential supplied to sources of load transistors 108 and 111 included in a latch section is different from at least one of a potential supplied to a word line 105 and a potential supplied to bit lines 106 and 107; a latch potential control circuit 101 for switching a normal operation mode and a test mode to each other in accordance with a signal applied to a test mode setting pin 102; and a read/write control circuit 103 for controlling the potential supplied to the sources of the load transistors 108 and 111 to be lower than at least one of the potential supplied to the word line 105 and the potential supplied to the bit lines 106 and 107, during an arbitrary period of at least a read operation in the test mode.

Abstract: The present invention provides a semiconductor integrated circuit having area efficiency and repair efficiency improved by sharing a redundant memory macro among a plurality of SRAM macros. Each of the plurality of memory macros includes a memory cell array connected to word lines and bit lines and a redundant circuit that replaces a defective bit line of the memory cell array to a normal bit line and a redundant bit line and outputs defect information to a redundant signal line. The redundant memory macro includes a redundant memory cell array connected to redundant word lines and the redundant bit line, and a first word line connection circuit that connects a word line corresponding to a memory macro to be repaired and disconnects a word line corresponding to a normal memory macro from the redundant word line.

Abstract: The present invention provides a semiconductor integrated circuit having area efficiency and repair efficiency improved by sharing a redundant memory macro among a plurality of SRAM macros. Each of the plurality of memory macros 1A1 and 1A2 includes a memory cell array 1A-3 connected to word lines WL1 to WL32 and bit lines and a redundant circuit that replaces a defective bit line of the memory cell array to a normal bit line and a redundant bit line BLA65 and outputs defect information to a redundant signal line RA. The redundant memory macro 2A includes a redundant memory cell array connected to redundant word lines and the redundant bit line, and a first word line connection circuit that connects a word line corresponding to a memory macro to be repaired and disconnects a word line corresponding to a normal memory macro from the redundant word line.

Abstract: A static random access memory (SRAM) includes a memory array, a sense amplifier circuit, a replica circuit and a dummy cell. The replica circuit has the same elements as memory cells, and includes plural replica cells which output a signal whose level corresponds to the number of stages provided to a common replica bit line. The dummy cell is connected as a load with the common replica bit line. The source of a drive transistor of the dummy cell is connected with a power source which is at the High level. This suppresses a leak current flowing from a replica bit line to the dummy cell.

Abstract: A semiconductor memory device includes a memory cell having a circuit configuration in which a potential supplied to sources of load transistors 108 and 111 included in a latch section is different from at least one of a potential supplied to a word line 105 and a potential supplied to bit lines 106 and 107; a latch potential control circuit 101 for switching a normal operation mode and a test mode to each other in accordance with a signal applied to a test mode setting pin 102; and a read/write control circuit 103 for controlling the potential supplied to the sources of the load transistors 108 and 111 to be lower than at least one of the potential supplied to the word line 105 and the potential supplied to the bit lines 106 and 107, during an arbitrary period of at least a read operation in the test mode.

Abstract: A memory circuit 10 includes: a feed-through input terminal 13 for inputting a signal different from a signal to be inputted when reading and writing memory cells; an intermediate buffer circuit 14 provided between regions where the memory cells are arranged, for relaying the signal inputted through the feed-through input terminal 13; and a feed-through output terminal 15 for outputting the signal relayed by the intermediate buffer circuit 14. Connections between the feed-through input terminal 13 and the intermediate buffer circuit 14 and between the intermediate buffer circuit 14 and the feed-through output terminal 15 are established by feed-through wires 16, 17, respectively. The feed-through wires 16, 17 are not connected to either a wire to be used when reading and wiring the memory cells, or the memory cells.

Abstract: A dummy cell includes two series-connected OFF-state transistors, one end of the series circuit which is formed by these two transistors is connected with a constant voltage source, and the other end of the series circuit is connected with a replica bit line. This suppresses a leak current flowing from the replica bit line to the dummy cell and therefore gives optimal start-up timing to a sense amplifier circuit.

Abstract: A semiconductor memory device may include: (1) a word line drive circuit, having a drive transistor disposed between a positive power supply and a word line, (2) a circuit for turning the drive transistor OFF after an output of the word line drive circuit reaches a high level, and (3) a word-line-voltage increasing circuit for increasing a voltage of the word line after the drive transistor turns OFF. The word-line-voltage increasing circuit includes a coupling capacitor, one end of which is connected to the word line, and a capacitor drive circuit, an output end of which is connected to the other end of the coupling capacitor. The capacitor drive circuit switches its output from a low level to a high level at a timing when the drive transistor is OFF.

Abstract: A memory array, a sense amplifier circuit, a replica circuit and a dummy cell are disposed. The replica circuit has the same elements as memory cells, and includes plural replica cells which output a signal whose level corresponds to the number of stages provided to a common replica bit line. The dummy cell is connected as a load with the common replica bit line. The source of a drive transistor of the dummy cell is connected with a power source which is at the High level. This suppresses a leak current flowing from a replica bit line to the dummy cell.

Abstract: A dummy cell includes two series-connected OFF-state transistors, one end of the series circuit which is formed by these two transistors is connected with a constant voltage source, and the other end of the series circuit is connected with a replica bit line. This suppresses a leak current flowing from the replica bit line to the dummy cell and therefore gives optimal start-up timing to a sense amplifier circuit.

Abstract: A semiconductor memory device capable of enhancing a production yield is provided. A dummy control circuit activates a first dummy column including a plurality of dummy cells placed at a position close to a row decoder in a row direction and a second dummy column including a plurality of dummy cells placed at a position farthest from the row decoder in a row direction with a plurality of memory cells interposed between the first dummy column and the second dummy column, through first and second dummy word lines. A dummy column selector selects either one of a signal on a first dummy bit line connected to the first dummy column and a signal on a second dummy bit line connected to the second dummy column, and outputs the selected signal to an amplifier control circuit. The amplifier control circuit generates an amplifier startup signal with respect to an amplifier circuit based on a signal from the dummy column selector.

Abstract: A first semiconductor integrated circuit is connected to a second semiconductor integrated circuit with a cable. In the first semiconductor integrated circuit, when a power supply voltage becomes less than a set voltage detection level, a voltage-detecting circuit outputs a voltage-detected signal to lower the voltage of the cable and to stop the operation. The second semiconductor integrated circuit detects the decrease in the voltage of the cable to recognize the halt of the operation of the first semiconductor integrated circuit. In the first semiconductor integrated circuit thus configured, in testing the operation under low-voltage conditions in which the power supply voltage is less than the set voltage detection level, the voltage-detecting circuit receives a control signal from an external terminal to stop the operation forcibly.

Abstract: A network apparatus is provided, which allows another network apparatus to recognize the disconnection with reliability, if a power supply to the network apparatus is interrupted. A control unit operating with a first power supply outputs a first signal, which is level-converted and supplied as a second signal to an intermediate potential supply unit operating with a second power supply. In the intermediate potential supply unit, a switch receives a reset signal as a switch signal and outputs, when the power supply is interrupted, a ground potential to a driver instead of the second signal. As a result, an intermediate potential supplied to a cable is forcibly set to the ground potential.