Abstract: When an addition power at a position corresponding to a fitting point within a prescription addition power is greater than a target addition power set according to a target distance, the target addition power is set as an addition power between a progression-start point and a progression-end point on a principal meridian, and in addition the average gradient of an addition power between the progression-start point and the fitting point is set to differ from an average gradient of an addition power between the fitting point and the progression-end point. When the addition power at the position corresponding to the fitting point within the prescription addition power is equal to or smaller than the target addition power, a gradient of the addition power is made constant in a partial region including at least the fitting point between the progression-start point and the progression-end point on the principal meridian.

Abstract: A vision simulation, on assumption that spectacles are worn, is performed for a first model designed by setting a target additional power of a desirable value at a position corresponding to a fitting point on a principal meridian. A correction amount is computed for correcting the difference between a simulation value obtained for the additional power at the position corresponding to the fitting point on the principal meridian through the vision simulation and the target additional power. A second model is designed by replacing the additional power with a value obtained by the addition of the calculated correction amount to the target additional power.

Abstract: A circuit substrate includes: a mounting region having an exposed surface that is planarized, and in which a predetermined chip is to be mounted; patterns provided in the mounting region, and including respective top faces that form a part of the exposed surface; and solder bumps provided on the respective patterns, and having substantially same shape as one another.

Abstract: A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

Abstract: Progressive addition lens includes a near portion having a power for viewing a near field, a distance portion having a power for viewing a distance field further than the near field, and an intermediate portion connecting the distance portion and the near portion. The progressive addition lens includes an aspherical object-side surface and an aspherical eyeball-side surface and is formed in rotational symmetry with respect to a center of design of the progressive addition lens. The object-side surface includes a first stable region formed in rotational symmetry with respect to the center of design and including the center of design, and an aspherical region arranged outside of the first stable region to contact the first stable region and formed in rotational symmetry with respect to the center of design. A Peak to Valley value of a mean surface refractive power in the first stable region is 0.12 D or less.

Abstract: A progressive addition lens includes a portion having a power for viewing a near field, a portion having a power for viewing a distance field further than the near field, and an portion connecting the distance portion and the near portion. The progressive addition lens includes an aspherical object-side surface and an aspherical eyeball-side surface and is formed in rotational symmetry with respect to a center of design of the progressive addition lens. The object-side surface includes a first stable region formed in rotational symmetry with respect to the center of design and including the center of design, and an aspherical region arranged outside of the first stable region to contact the first stable region and formed in rotational symmetry with respect to the center of design. A PV value (Peak to Valley) of a mean surface refractive power in the first stable region is 0.12 D or less.

Abstract: A semiconductor device including a semiconductor substrate having oppositely facing first and second surfaces, the first surface being an active surface and provided with an electronic element thereon, a pad electrode to be connected to the electronic element in a peripheral portion of the electronic element on the active surface, a first opening extending from the second surface toward the pad electrode so as not to reach the first surface of the semiconductor substrate, a second opening formed to reach the pad electrode from a bottom surface of the first opening and having a diameter smaller than that of the first opening, an insulating layer formed to cover sidewall surfaces of the first opening and the second opening, and a conductive layer formed, inside of the insulating layer, to cover at least an inner wall surface of the insulating layer and a bottom surface of the second opening.

Abstract: A semiconductor device including a semiconductor substrate having oppositely facing first and second surfaces, the first surface being an active surface and provided with an electronic element thereon, a pad electrode to be connected to the electronic element in a peripheral portion of the electronic element on the active surface, a first opening extending from the second surface toward the pad electrode so as not to reach the first surface of the semiconductor substrate, a second opening formed to reach the pad electrode from a bottom surface of the first opening and having a diameter smaller than that of the first opening, an insulating layer formed to cover sidewall surfaces of the first opening and the second opening, and a conductive layer formed, inside of the insulating layer, to cover at least an inner wall surface of the insulating layer and a bottom surface of the second opening.

Abstract: A semiconductor device including a semiconductor substrate having oppositely facing first and second surfaces, the first surface being an active surface and provided with an electronic element thereon, a pad electrode to be connected to the electronic element in a peripheral portion of the electronic element on the active surface, a first opening extending from the second surface toward the pad electrode so as not to reach the first surface of the semiconductor substrate, a second opening formed to reach the pad electrode from a bottom surface of the first opening and having a diameter smaller than that of the first opening, an insulating layer formed to cover sidewall surfaces of the first opening and the second opening, and a conductive layer formed, inside of the insulating layer, to cover at least an inner wall surface of the insulating layer and a bottom surface of the second opening.

Abstract: A semiconductor device including a semiconductor substrate having oppositely facing first and second surfaces, the first surface being an active surface and provided with an electronic element thereon, a pad electrode to be connected to the electronic element in a peripheral portion of the electronic element on the active surface, a first opening extending from the second surface toward the pad electrode so as not to reach the first surface of the semiconductor substrate, a second opening formed to reach the pad electrode from a bottom surface of the first opening and having a diameter smaller than that of the first opening, an insulating layer formed to cover sidewall surfaces of the first opening and the second opening, and a conductive layer formed, inside of the insulating layer, to cover at least an inner wall surface of the insulating layer and a bottom surface of the second opening.

Abstract: A circuit board includes: an electrode portion which has a copper layer, a copper oxide layer formed thereon, and a removal portion formed by partially removing the copper oxide layer so as to partially expose the copper layer from the copper oxide layer; and a solder bump for flip chip mounting formed on the copper layer exposed by the removal portion.

Abstract: A circuit substrate includes: a mounting region having an exposed surface that is planarized, and in which a predetermined chip is to be mounted; patterns provided in the mounting region, and including respective top faces that form a part of the exposed surface; and solder bumps provided on the respective patterns, and having substantially same shape as one another.

Abstract: A semiconductor device including a semiconductor substrate having oppositely facing first and second surfaces, the first surface being an active surface and provided with an electronic element thereon, a pad electrode to be connected to the electronic element in a peripheral portion of the electronic element on the active surface, a first opening extending from the second surface toward the pad electrode so as not to reach the first surface of the semiconductor substrate, a second opening formed to reach the pad electrode from a bottom surface of the first opening and having a diameter smaller than that of the first opening, an insulating layer formed to cover sidewall surfaces of the first opening and the second opening, and a conductive layer formed, inside of the insulating layer, to cover at least an inner wall surface of the insulating layer and a bottom surface of the second opening.

Abstract: A spectacle lens includes a first region which is located in at least part of a portion of a lens where a pivotal angle of an eyeball of a wearer ranges from 20 to 60 degrees and in which correcting astigmatism has priority over correcting average power based on prescribed power, and a second region which is formed inside the first region and in which correcting the average power has priority over correcting the astigmatism.

Abstract: A semiconductor device includes a semiconductor substrate having a first electronic circuit and a second electronic circuit formed on an active surface, a pad electrode formed on the active surface by being connected to the first electronic circuit and/or the second electronic circuit, a first opening formed to some point along a depth of the semiconductor substrate toward the pad electrode from a surface opposite to the active surface of the semiconductor substrate, a second opening formed so as to reach the pad electrode from a bottom surface of the first opening, an insulating layer formed by covering sidewall surfaces of the first opening and the second opening, a conductive layer formed by covering at least an inner wall surface of the insulating layer and a bottom surface of the second opening, a third opening formed to some point along the depth of the semiconductor substrate from the surface opposite to the active surface of the semiconductor substrate, and a heat insulator imbedded in the third openi

Abstract: A semiconductor device including a semiconductor substrate having oppositely facing first and second surfaces, the first surface being an active surface and provided with an electronic element thereon, a pad electrode to be connected to the electronic element in a peripheral portion of the electronic element on the active surface, a first opening extending from the second surface toward the pad electrode so as not to reach the first surface of the semiconductor substrate, a second opening formed to reach the pad electrode from a bottom surface of the first opening and having a diameter smaller than that of the first opening, an insulating layer formed to cover sidewall surfaces of the first opening and the second opening, and a conductive layer formed, inside of the insulating layer, to cover at least an inner wall surface of the insulating layer and a bottom surface of the second opening.

Abstract: A spectacle lens includes a first region which is located in at least part of a portion of a lens where a pivotal angle of an eyeball of a wearer ranges from 20 to 60 degrees and in which correcting astigmatism has priority over correcting average power based on prescribed power, and a second region which is formed inside the first region and in which correcting the average power has priority over correcting the astigmatism.

Abstract: A circuit board includes: an electrode portion which has a copper layer, a copper oxide layer formed thereon, and a removal portion formed by partially removing the copper oxide layer so as to partially expose the copper layer from the copper oxide layer; and a solder bump for flip chip mounting formed on the copper layer exposed by the removal portion.

Abstract: A mount board includes a laminated wiring section including a plurality of wiring layers formed on a surface of a substrate in a laminated manner, wherein a portion of an inner wiring layer is exposed to the outside, the inner wiring layer being any of the plurality of wiring layers excluding an uppermost wiring layer.

Abstract: A semiconductor device includes a semiconductor substrate having first and second surfaces opposite each other, the first surface being an active surface by provided with an electronic element thereon, a pad electrode formed to be connected to the electronic element in a peripheral portion of the electronic element on the active surface, a first opening extending from the second surface toward the pad electrode so as not to reach the first surface of the semiconductor substrate, a second opening, formed to reach the pad electrode from a bottom surface of the first opening, having a diameter smaller than that of the first opening, an insulating layer formed to cover sidewall surfaces of the first opening and the second opening, and a conductive layer formed, inside of the insulating layer, to cover at least an inner wall surface of the insulating layer and a bottom surface of the second opening.