Abstract: A device-incorporated substrate and a method of manufacturing a device-incorporated substrate, as well as a printed circuit board and a method of manufacturing a printed circuit board in which a fine-pitch conductor pattern can be formed on an insulating layer with high precision while securing the dimensional stability of the conductor pattern, are provided. A transfer sheet (61) has a structure that includes two layers, a metal base material (62) and a dissolvee metal layer (64), and a conductor pattern (55) is formed on the dissolvee metal layer (64) through electroplating. Then, after the transfer sheet (61) on which the conductor pattern (55) is formed is adhered onto an insulating base material (51), the transfer sheet (61) is removed through a step of separating the metal base material (62) from the dissolvee metal layer (64), and a step of selectively dissolving and removing the dissolvee metal layer (64) with respect to the conductor pattern (55).

Abstract: To provide a junction structure and a junction method for conductive projection advantageous in that a required reinforcement strength can be obtained while suppressing the amount of a reinforcing resin material supplied to prevent warpage due to curing shrinkage. A conductive projection is joined to the surface of a conductor portion formed at the same level as that of the surface of the insulating layer so that a root portion of the projection is surrounded by a fillet-form resin material. The resin material contains an activator which assists in the junction between the conductive projection and the conductor portion when the resin material is in an uncured state, and is fused by heating to wet and rise the root portion of the conductive projection so as to be in a fillet form. The resin material is cured by an ultraviolet light while excluding the resin material on the conductor portion.

Abstract: The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiring substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.

Abstract: To provide a junction structure and a junction method for conductive projection advantageous in that a required reinforcement strength can be obtained while suppressing the amount of a reinforcing resin material supplied to prevent warpage due to curing shrinkage. A conductive projection is joined to the surface of a conductor portion formed at the same level as that of the surface of the insulating layer so that a root portion of the projection is surrounded by a fillet-form resin material. The resin material contains an activator which assists in the junction between the conductive projection and the conductor portion when the resin material is in an uncured state, and is fused by heating to wet and rise the root portion of the conductive projection so as to be in a fillet form. The resin material is cured by an ultraviolet light while excluding the resin material on the conductor portion.

Abstract: A circuit substrate device composed of a circuit unit 2 and a multi-layer wiring substrate 3 in which a pattern conductor of the circuit unit 2 may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit 2 having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate 3 having a connecting terminal portion 14 exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate 3 so that the pattern conductor is connected to the connecting terminal portion 14. The dummy substrate is then removed to give a structure comprised of the circuit unit 2 formed on the multi-layer wiring substrate 3. The pattern conductor of the circuit unit 2 is freed of warping or inundations along the direction of thickness of the circuit unit 2.

Abstract: A circuit substrate device composed of a circuit unit 2 and a multi-layer wiring substrate 3 in which a pattern conductor of the circuit unit 2 may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit 2 having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate 3 having a connecting terminal portion 14 exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate 3 so that the pattern conductor is connected to the connecting terminal portion 14. The dummy substrate is then removed to give a structure comprised of the circuit unit 2 formed on the multi-layer wiring substrate 3. The pattern conductor of the circuit unit 2 is freed of warping or inundations along the direction of thickness of the circuit unit 2.

Abstract: The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiring substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.

Abstract: A circuit substrate device composed of a circuit unit 2 and a multi-layer wiring substrate 3 in which a pattern conductor of the circuit unit 2 may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit 2 having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate 3 having a connecting terminal portion 14 exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate 3 so that the pattern conductor is connected to the connecting terminal portion 14. The dummy substrate is then removed to give a structure comprised of the circuit unit 2 formed on the multi-layer wiring substrate 3. The pattern conductor of the circuit unit 2 is freed of warping or inundations along the direction of thickness of the circuit unit 2.

Abstract: A gate top member 23 is placed to a gate 22 opened toward the circumferential edge of a molding spectacle-lens cavity 13 formed between inserts 11 and 12. The plural gate top members 23 each having a different height are previously prepared, and attached with a bolt to be exchanged. In pilot production, it is checked for each of various lenses which opening configuration of the gate 22 can form a spectacle lens with defined great-precision by exchanging the gate top member 23 in order to obtain each gate opening configuration changed by exchanging the gate top member 23.

Abstract: A cavity 22 in an injection molding assembly includes a lower mold insert 21 for shaping a lens convex surface and an upper mold insert 20 for shaping a lens concave surface. When the heated injection molding assembly is cooled and a lens is ejected after a molten resin is pressurized by the upper mold insert 20, the temperature of the lower mold insert 21 is lowered below the temperature of the upper mold insert 20, which prevents the molded lens from bending at a central portion and enable high transfer precision of insert shapes.

Abstract: In an injection compression molding method of a lens, in which a mold is closed to preserve a predetermined compressing margin in a cavity 3 for a lens, molten resin is injected and fed into the cavity 3 for the lens, and compressed for the aforementioned predetermined compressing margin before or after the injection and the feed of the molten resin is completed, the predetermined compressing margin (the degree of slightly opening S.sub.(-)) for producing a minus lens is molded is defined to be larger than the predetermined compressing margin (the degree of slightly opening S.sub.(+)) for producing a plus lens is molded. As a result, even when the minus lens is molded, the larger area of the cavity can be ensure and a flow property of the molten resin in the cavity is improved, so that the molten resin reached the inside of the cavity 3 flow through the central portion of the cavity 3 into the peripheral portion, with the result that the appearance of a weld mark in the central portion is avoided.

Abstract: In an injection step, actual injection speed V is closed-controlled so that the actual injection speed V becomes equal to first or second preset speed V.sub.1 or V.sub.2 while comparing the actual injection speed V with the first or second preset speed V.sub.1 or V.sub.2 in the section between S.sub.0 and S.sub.1 from the time when injection of molten resin is started up to the time when the molten resin reaches this side of a gate portion 46 or the section between S.sub.1 and S.sub.2 from the time when the molten resin reaches this side of the gate portion 46 up to the time when the molten resin reaches the inside of a cavity 3. The injection speed V is open- controlled to third preset speed V.sub.3 in the section between S.sub.2 and S.sub.3 from the time when the molten resin reaches the inside of the cavity 3 up to the time when injection of the molten resin is completed.

Abstract: A refrigerator with a regenerator is provided which is supported by a holder. The refrigerator has a cylinder having an inner circumferential surface matching a circular tube shape, a displacer being disposed in the cylinder and forming an expansion space near at one end of the inside of the cylinder, a groove pattern having a groove formed along the direction intersecting the axial direction of the displacer, the groove allowing a gas flowing through a gap between the cylinder and displacer from one end to the other end of the outer circumferential surface of the displacer to positively heat-exchange with the cylinder and displacer, and a main gas passage for supplying gas to the expansion space of the cylinder and recovering the gas from the expansion space.

Abstract: A refrigerator with a regenerator having a good and stable cooling function comprises: a cylinder having a circular inner surface and being made of a material having a low heat conductivity and a high hermetic sealing performance; a displacer having a circular outer surface having a slightly smaller diameter than the inner surface of the cylinder, forming a main gas passage there through, and containing regeneration material therein, the displacer being disposed in the cylinder to be reciprocally movable in the axial direction the cylinder and forming an expansion space at one end of the cylinder; a groove pattern formed on one of the outer surface of the displacer and the inner surface of the cylinder, for forming an auxiliary gas passage for supplying gas into and recovering the gas from the expansion space, the groove pattern including a groove at least partially formed along the direction intersecting the axial direction of the displacer, such as a helical groove, the groove allowing a gas flowing through

Abstract: In a cryogenic refrigerator using a Gifford MacMahon (GM) cycle, a rotary valve device (RV) for controlling the supply and discharge of refrigerant gas with respect to the refrigerator (2) is adapted by a reversible motor (15) to be rotated in normal and reverse directions, and during the rotation in the normal direction, a cooling mode operation for producing cold by an adiabatic expansion is effected, and during the rotation in the reverse direction, a temperature-raising mode operation for producing heat by an adiabatic compression is effected. In order that the optimum efficiency can be obtained in each of the cooling mode operation and the temperature-raising mode operation, the timing of opening and closing of the rotary valve device (RV) with respect to the reciprocal movement of displacers (3a, 3b) during the rotation in the normal direction is made different from said timing during the rotation in the reverse direction.

Abstract: A temperature testing device in which a sample-receiving sealable chamber from which a specimen can be easily detached and a cooling portion of a refrigeration unit are inserted into a single vacuum vessel, and in which a gaseous refrigerant is circulated between the cooling portion of the refrigeration unit and the sample-receiving chamber so that the sample-receiving chamber can be cooled.

Abstract: A cold reserving apparatus having a specimen accommodation chamber capable of being closed and inserted and disposed in a vacuum vessel. A cooling stage of the refrigerator is inserted into this vacuum vessel, and a cooling stage provided on the specimen accommodation chamber in the vacuum vessel and the cooling stage of the refrigerator are connected by a solid heat-conductive material.

Abstract: A data input unit has a monitor display unit with a display screen and a manual input device such as a keyboard. Plural transaction items for at least one transaction type are displayed selectively on one portion of the display screen. A second portion of the screen provides for display of manually entered data corresponding to each item. When data which corresponds to a predetermined item displayed on the screen of the monitor display unit is supplied as an input by said manual input devices, said input data is displayed initially in a prearranged common display area comprising a third portion of the screen of the monitor display unit. After an operator confirms the accuracy of the displayed data, and actuation of an item select key causes the data displayed on the common display area to be transferred and displayed on the second portion of the screen in a position directly relating that data to its corresponding transaction item.

Abstract: In the present plating method the bath contains an electrolyte solution having a uniform ion concentration. A common electrode, a plating electrode and a standard electrode are arranged in the bath. A direct current source is connected between the common electrode and the plating electrode. A further, constant, direct current source is connected between the common electrode and the standard electrode. A potentiometer device is arranged for detecting resistance changes between these electrodes due to variations in the ion concentration and in the mobility of the electrolyte solution between the electrodes. A control is responsive to the potentiometer device for regulating the plating current supplied by the direct current source as a function of the potential difference detected by the potentiometer device, whereby a constant plating current density is achieved.

Abstract: A cavity 22 in an injection molding assembly includes a lower mold insert 21 for shaping a lens convex surface and an upper mold insert 20 for shaping a lens concave surface. When the heated injection molding assembly is cooled and a lens is ejected after a molten resin is pressurized by the upper mold insert 20, the temperature of the lower mold insert 21 is lowered below the temperature of the upper mold insert 20, which prevents the molded lens from bending at a central portion and enable high transfer precision of insert shapes.