Abstract: In a method of manufacturing a hollow stabilizer, a pipe compressing step of compressing an electroseamed pipe in a temperature range of a hot state or a warm state so as to make a rate of a thickness with respect to an outer diameter between 18 and 35% is performed, and a forming step of forming the compressed electroseamed pipe in a stabilizer shape in a cold state is executed. Next, a step of applying a heat treatment to a half-finished stabilizer is performed, a shot peening step of impacting a shot on the half-finished stabilizer is performed, and a step of coating the half-finished stabilizer is performed.

Abstract: The thickness of a tape carrier package having a semiconductor chip is made uniform where bonding pads are concentrated on one side of the semiconductor chip. The tape carrier package is such that dummy pads 6b are arranged on one side opposite to the side on which bonding pads (effective pins) 6a are arranged in the semiconductor chip. Dummy leads 5 are formed on an insulating tape 4. The semiconductor chip is supported with inner lead portions 5a connected to the corresponding bonding pads 6a and the inner lead portions 5a of the dummy leads 5 connected to the corresponding dummy pads 6b.

Abstract: An optically semi-transmission reflection material comprises a resinous film comprising a thermoplastic resin, wherein the sum of total light ray transmittance, T%, and total light ray reflectance, R%, i.e., T+R, is 80 to 100%; an absolute value of their difference is |(T−R)|<50% when displayed value a and displayed value b in transmitted light are designated as aT and bT, respectively, and when in reflected light, displayed value b is designated as br, in the transmitted light, aT and bT are in the range of −2≦aT≦2, and −2≦bT≦1.3 and the difference between the displayed value b to the transmitted light and the reflected light is |(bT−br)|<10.

Abstract: A semiconductor device including a semiconductor chip having connection terminals in a peripheral part of a main surface thereof; an elastic body disposed on the main surface leaving the connection terminals exposed; an insulating tape formed on the elastic body and having openings in areas where the connection terminals are situated; plural leads formed on the top surface of the insulating tape, one end of each lead being connected to one of the connection terminals and the other end being disposed on the elastic body; plural bump electrodes formed on the other ends of the plural leads; and a resin body for sealing the connection terminals and one end of each of the leads, wherein the insulating tape protrudes beyond the chip where the plural connection terminals are arranged, and wherein the shape of the resin body is restricted by the protruding part of the insulating tape.

Abstract: A semiconductor device including a semiconductor chip having connection terminals in a peripheral part of a main surface thereof; an elastic body disposed on the main surface leaving the connection terminals exposed; an insulating tape formed on the elastic body and having openings in areas where the connection terminals are situated; plural leads formed on the top surface of the insulating tape, one end of each lead being connected to one of the connection terminals and the other end being disposed on the elastic body; plural bump electrodes formed on the other ends of the plural leads; and a resin body for sealing the connection terminals and one end of each of the leads, wherein the insulating tape protrudes beyond the chip where the plural connection terminals are arranged, and wherein the shape of the resin body is restricted by the protruding part of the insulating tape.

Abstract: A support which contains a base layer (B) composed of a biaxially stretched film of a thermoplastic resin containing an inorganic fine powder; and a surface layer (A) provided at least on one side of such base layer (B), which is composed of a biaxially stretched film of a thermoplastic resin having a three dimensional center plane average roughness of about 0.3 &mgr;m or below and a 60 degrees surface glossiness of about 80% or above is disclosed. A thermal transfer image-recording material using such support can produce a clear image having an excellent glossiness and no external waviness.

Abstract: A process for producing toner particles, comprising polymerizing in an aqueous dispersion medium a polymerizable monomer composition containing at least a polymerizable monomer and a colorant, to form colored polymer particles, followed by washing and then dehydration to obtain toner particles, and feeding the toner particles into an inside-evacuatable and heatable container to make vacuum heat treatment while introducing into the container an injection medium having a temperature lower than glass transition temperature Tg of the toner particles and selected from the group consisting of i) saturated steam, ii) superheated steam and iii) high-humidity air having an enthalpy of 2,500 kJ/kg (dry air) or higher. Also disclosed is a system which carries out the above process.

Abstract: An insert is held in a cavity within a die set by a movable hold member. Molten resin is injected into the cavity when the insert is held by the hold member. The hold member is separated from the insert at a given timing. A surface of the hold member is heated to a temperature higher than a temperature of an inner surface of the die set. The hold-member surface contacts the molten resin. The die-set inner surface is exposed in the cavity.

Abstract: A light reflector comprising a biaxially stretched film containing a polyolefinic resin and a filler, wherein said filler is an inorganic filler having an average grain size of 0.1 to 8 &mgr;m and/or an organic filler having a mean dispersion grain size of 0.1 to 8 &mgr;m, and said biaxially stretched film has an area stretched factor of 16 to 80, and having a luminance of 1,200 cd/m2 or above is disclosed. A specific feature of such light reflector of the present invention resides in that improvement in the luminance achieved at low cost is ascribable to the structural feature thereof rather than to the composition.

Abstract: Improvement is affected in uniformizing the thickness of a tape carrier package having a semiconductor chip in which bonding pads are disposed in such a way that the bonding pads are arranged concentratedly on one side of the semiconductor chip.

Abstract: When input equipment is instructed by a remote control unit on the basis of a display of a monitor, a data signal is transmitted from a microcomputer of an AV amplifier to a microcomputer of a CD changer. When the signal is received by a microcomputer of the CD changer, display data is formed in the microcomputer of the CD changer on the basis of data in a memory and is outputted. In the AV amplifier, a switch is switched to the CD changer side. A cursor is formed by the microcomputer of the AV amplifer, the cursor and display data from the CD changer are synthesized by an image synthesizing circuit and displayed on the monitor. When an instruction is generated by the remote control unit on the basis of the display on the monitor, position coordinates of the cursor on the picture plane are generated from the microcomputer of the A/V amplifier to the microcomputer of the CD changer. On the basis of the display data and the position coordinates, the CD changer is controlled by its microcomputer.

Abstract: An insert is held in a cavity within a die set by a movable hold member. Molten resin is injected into the cavity when the insert is held by the hold member. The hold member is separated from the insert at a given timing. A surface of the hold member is heated to a temperature higher than a temperature of an inner surface of the die set. The hold-member surface contacts the molten resin. The die-set inner surface is exposed in the cavity.

Abstract: A semiconductor device including a semiconductor chip having connection terminals in a peripheral part of a main surface thereof; an elastic body disposed on the main surface leaving the connection terminals exposed; an insulating tape formed on the elastic body and having openings in areas where the connection terminals are situated; plural leads formed on the top surface of the insulating tape, one end of each lead being connected to one of the connection terminals and the other end being disposed on the elastic body; plural bump electrodes formed on the other ends of the plural leads; and a resin body for sealing the connection terminals and one end of each of the leads, wherein the insulating tape protrudes beyond the chip where the plural connection terminals are arranged, and wherein the shape of the resin body is restricted by the protruding part of the insulating tape.

Abstract: The thickness of a tape carrier package having a semiconductor chip is made uniform where bonding pads are concentrated on one side of the semiconductor chip. The tape carrier package is such that dummy pads 6b are arranged on one side opposite to the side on which bonding pads (effective pins) 6a are arranged in the semiconductor chip. Dummy leads 5 are formed on an insulating tape 4. The semiconductor chip is supported with inner lead portions 5a connected to the corresponding bonding pads 6a and the inner lead portions 5a of the dummy leads 5 connected to the corresponding dummy pads 6b.

Abstract: An artificial satellite navigation system and method. The artificial satellite navigation system includes a global positioning system (GPS) receiver, local satellite, and remote satellite absolute navigation units estimating the position and velocity of a local satellite or a remote satellite and bias and drift of a clock in the receiver. A difference calculation unit calculates differences in position and velocity from the local satellite and remote satellite absolute navigation units. A relative navigation unit estimates the relative position and velocity of the local satellite with respect to the remote satellite. The relative navigation unit navigates the local satellite relative to the remote satellite.

Abstract: Angular deformation is caused in a portion of offset-printed web paper corresponding to an adjacent portion of each of side edges of two blankets of a blanket cylinder so that paper wrinkles are caused. To prevent the paper wrinkles from being caused, a contact roller 10 is arranged in a paper wrinkle preventing device such that a circumferential face of the contact roller can rotatably come in contact with the running web paper W in a rotary printing press having an offset printing portion P for printing the web paper W coming in contact with surfaces of two blankets B2 having side edges adjacent to each other at an approximately axial center of a blanket cylinder B. The contact roller 10 is arranged between the offset printing portion P and a drag roller D1. An equal diameter portion 101c is formed by a roller portion coming in contact with an area of the running web paper W coming in contact with an adjacent portion B1 of each of the two blankets B2 and a portion near this adjacent portion.

Abstract: An insert is held in a cavity within a die set by a movable hold member. Molten resin is injected into the cavity when the insert is held by the hold member. The hold member is separated from the insert at a given timing. A surface of the hold member is heated to a temperature higher than a temperature of an inner surface of the die set. The hold-member surface contacts the molten resin. The die-set inner surface is exposed in the cavity.

Abstract: The thickness of a tape carrier package having a semiconductor chip is made uniform where bonding pads are concentrated on one side of the semiconductor chip. The tape carrier package is such that dummy pads 6b are arranged on one side opposite to the side on which bonding pads (effective pins) 6a are arranged in the semiconductor chip. Dummy leads 5 are formed on an insulating tape 4. The semiconductor chip is supported with inner lead portions 5a connected to the corresponding bonding pads 6a and the inner lead portions 5a of the dummy leads 5 connected to the corresponding dummy pads 6b.

Abstract: A TV set includes a tuner circuit that selects a channel and outputs video and audio signals from the channel, a first external output terminal for outputting the video signals a second external output terminal for outputting the audio signals a first external input terminal to which video signals are supplied from external AV devices, a first switch means for taking out video signals from the tuner circuit and video signals from the first external input terminal selectively, a second switch teamed with the first switch and taking out audio signals from the tuner circuit when the first switch selects the video signals from the tuner circuit, a display for displaying video signals output from the first switch as images, a speaker for outputting audio signals output from the second switch as sounds, and a control circuit for holding both first and second switches in the status for selecting video signals from the first external input terminal.

Abstract: 1-aminopropanediol-2,3 containing 2-aminopropanediol-1,3 of less than 0.30% by weight can be prepared by the present purification process, which comprises distilling a 1-aminopropanediol-2,3 containing at least 0.3% of 2-aminopropanediol-1,3 based on the weight of 1-aminopropanediol-2,3 with a distillation column, said distillation column having low pressure loss.