Abstract: A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.

Abstract: A polymeric compound having a repeated unit corresponding to an unsaturated carboxylic acid hemiacetal ester represented by the following formula (1); wherein Ra is a hydrogen atom, a halogen atom, an alkyl group of carbon number 1 to 6 or a haloalkyl group of carbon number 1 to 6, Rb is a hydrocarbon group having a hydrogen atom at a first poison, Rc is a hydrogen atom or a hydrocarbon group and Rd is an organic group having a cyclic skeleton. This polymeric compound, further, may have a repeated unit corresponding to at least one monomer selected from a monomer having a lactone skeleton, a monomer having a cyclic ketone skeleton, a monomer having an acid anhydride group and a monomer having an imide group [except for a repeated unit corresponding to the said unsaturated carboxylic acid hemiacetal ester] and/or a repeated unit corresponding to at least one monomer selected from a monomer having a hydroxyl group and others.

Abstract: A light reflector having a laminate film that comprises a substrate layer (A) containing a thermoplastic resin and a filler and stretch in at least one direction to have an areal draw ratio of from 1.3 to 80 times and a thermoplastic resin-containing layer (B), wherein the light reflector has a whole ray reflectance of at least 95% and a surface strength of at least 250 g. The light reflector has good optical properties and good workability in that, when stuck to various plates and shaped, it hardly looses, drops and peels from the substrate plates.

Abstract: Disclosed is a light reflector formed of a white polyolefin film which contains a polyolefin resin and a filler and is oriented at least monoaxially to have an areal draw ratio of from 1.3 to 80 times, which has a whole ray reflectance of at least 95% and undergoes a dimensional change of at most 1.5% when left at 70° C. for 300 hours, and which has a melting-starting temperature of 70° C. or higher. The light reflector hardly causes brightness unevenness of the planar light source when it is built in a planar light source device and used for a long period of time.

Abstract: A polymeric compound for photoresist of the present invention includes a monomer unit having 2,6-dioxabicyclo[3.3.0]octane skeleton in the structure. The monomer unit having 2,6-dioxabicyclo[3.3.0]octane skeleton includes a monomer unit represented by the following Formula (I): wherein R is a hydrogen atom or a methyl group. The polymeric compound for photoresist may include a monomer unit having 2,6-dioxabicyclo[3.3.0]octane skeleton, a monomer unit having a group of adhesion to substrate, and a monomer unit having an acid-eliminating group. The polymeric compound for photoresist of the present invention exhibits not only adhesion to substrate, acid-eliminating property and resistance to dry-etching but also has well-balanced solubility in solvents for photoresist and alkali-soluble property.

Abstract: A polymerizable monomer of the present invention is represented by the following formula (1); R1, R2 and R3 are each a hydrogen atom, a fluorine atom, an alkyl group or a fluoroalkyl group, W is a single bond or a linkage group and n is 0 or 1, where at least one of R1, R2 and R3 is a fluorine atom or a fluoroalkyl group when n=1; and the ring in the formula may have a substituent. The polymerizable monomer of the present invention can provide an appropriate hydrophilicity or hydrophilicity and transparency to a photoresist polymer.

Abstract: Provided is a planar light source device, which comprises a light guide having at least one side end serving as a light incident side and having one surface serving as a light-emitting side, a light source disposed in the vicinity of the side end of the light guide, and a light reflector disposed on the other side opposite to the light-emitting side, and which is characterized in that the light guide is essentially formed of a polyolefin resin, the light reflector is also essentially formed of a polyolefin resin, and when a piece of the light reflector having a face size of 1.5 cm×1.5 cm is prepared, and it is pressed against the surface of the light guide with its reflective face being in contact with the surface of the light guide under a load of 135 g/cm2 thereto, and, in that condition, when it is reciprocated 10 times on the surface of the light guide to a width of 5 cm every time at a speed of 2.5 cm/sec, then the surface of the light guide is not substantially scratched by it.

Abstract: A fluorine-atom-containing polymerizable unsaturated-monomer of the present invention is represented by the following formula (1a) or (1b): wherein each of a ring Z1 and a ring Z2 is an alicyclic carbon ring; when the alicyclic carbon ring is multi-cyclic, a part of atoms constituting the ring may be substituted by an oxygen atom, a sulfur atom or a nitrogen atom; an atom constituting the ring Z1 and the ring Z2 may have a substituent; each of R1, R2 and R3 is an alkyl group or a fluoroalkyl group; R is an specific unsaturated acyl group; provided that at least one of R1 and R2 is a fluorine atom or a fluoroalkyl group in the formula (1a), and in the formula (1b) (i) the ring Z2 is bonded by a fluorine atom or a fluoroalkyl group, or (ii) R3 is a fluoroalkyl group.

Abstract: 6-trifluoromethyl-2-vinyloxy-4-oxatricyclo[4.2.1.03,7]nonan-5-one of the present invention is represented by the following formula (1). This compound can be produced by reacting 6-trifluoromethyl-2-hydroxy-4-oxatricyclo[4.2.1.03,7]nonan-5-one represented by the following formula (2) with a compound represented by the following formula (3a) or (3b), wherein Ra and Rb are each a hydrogen atom or a hydrocarbon group.

Abstract: A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.

Abstract: A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.

Abstract: An object of the present invention is to provide a light reflector, which causes no unevenness in luminance in the surface direction due to deflection in use. The present invention is a light reflector comprising: an olefin-based resin film 1 comprising a filler and having a total ray reflectance of 90% or more, which is stretched at least monoaxially at an area stretch ratio of from 1.5 to 80; and at least one of the following substrates (1) to (4): (1) Film 2 comprising at least one of olefin-based resin and polyester-based resin as a main component; (2) Woven cloth 3 or non-woven cloth 4; (3) Metal plate 5; and (4) Molded material 6 comprising a thermoplastic resin composition (a1) containing a foaming agent and having a foaming ratio of from 1.05 to 10 as calculated by the following equation (1): Foaming ratio=?o/???(1) where ?o represents the density before foaming; and ? represents the density after foaming.

Abstract: Provided is a planar light source device, which comprises a light guide having at least one side end serving as a light incident side and having one surface serving as a light-emitting side, a light source disposed in the vicinity of the side end of the light guide, and a light reflector disposed on the other side opposite to the light-emitting side, and which is characterized in that the light guide is essentially formed of a polyolefin resin, the light reflector is also essentially formed of a polyolefin resin, and when a piece of the light reflector having a face size of 1.5 cm×1.5 cm is prepared, and it is pressed against the surface of the light guide with its reflective face being in contact with the surface of the light guide under a load of 135 g/cm2 thereto, and, in that condition, when it is reciprocated 10 times on the surface of the light guide to a width of 5 cm every time at a speed of 2.5 cm/sec, then the surface of the light guide is not substantially scratched by it.

Abstract: An insert is held in a cavity within a die set by a movable hold member. Molten resin is injected into the cavity when the insert is held by the hold member. The hold member is separated from the insert at a given timing. A surface of the hold member is heated to a temperature higher than a temperature of an inner surface of the die set. The hold-member surface contacts the molten resin. The die-set inner surface is exposed in the cavity.

Abstract: A light reflector formed of a biaxially-stretched film which contains a thermoplastic resin and a filler and has an opacity of at least 95%, a whiteness of at least 90%, a reflectance R0 of at least 92%, and an areal draw ratio of from 22 to 80 times, wherein the color difference ?EH, after irradiated with a metal halide lamp spaced from the light reflector by 10 cm under an environmental condition of 83° C. and a relative humidity of 50% and at an intensity of radiation of 90 mW/cm2 for 10 hours, is at most 10. The reflector is free from the trouble of yellowing as in white polyester films heretofore used in reflectors and is stable against color change for a long period of time.

Abstract: A polymerizable adamantane derivative of the present invention is represented by the following formula (1): wherein R1 is a fluorine atom or a fluoroalkyl group; and the adamantane ring in the formula may have a substituent. As the said fluoroalkyl group, there may be mentioned, for example, a trifluoromethyl, a pentafluoroethyl, a 2,2,2-trifluoroethyl, a 2,2,2-trifluoro-1-(trifluoromethyl)ethyl, a heptafluoropropyl group and so on.

Abstract: A method is provided for the preparation of high-purity 1,3-butylene glycol from acetaldehyde. In the method, acetaldehyde is condensed in the presence of base to form a mixture of acetaldols, and the acetaldols are then converted to 1,3-butylene glycol by hydrogenation. Chemical treatment and distillation processes are described which provide 1,3-butylene glycol of very high purity.

Abstract: A hollow stabilizer made of a steel pipe, comprises: a torsion portion extending in a width direction of a vehicle body; a pair of right and left arm portions positioned at both end sides of the torsion portion; and a plurality of curved portions which are bent in an arc shape in any of the torsion portion, the arm portions and portions therebetween. Bending radii of the plurality of curved portions are different from each other.

Abstract: For high density packaging of a semiconductor device, the semiconductor device has a multi-layer substrate, a first-stage chip connected electrically to the multi-layer substrate, other package substrates stacked in three stages on the multi-layer substrate and each connected to an underlying wiring substrate through solder balls, second-, third- and fourth-stage chips electrically connected respectively to the other package substrates, and solder balls provided on the bottom multi-layer substrate. The number of wiring layers in the bottom multi-layer substrate which has a logic chip is larger than that in the package substrates which have memory chips, whereby the semiconductor device can have a wiring layer not used for distribution of wires to the solder balls and wiring lines in the wiring layer can be used for the mounting of another semiconductor element or a passive component to attain high density packaging of the semiconductor device as a stacked type package.

Abstract: A polymeric compound for photoresist of the present invention includes a monomer unit having 2,6-dioxabicyclo[3.3.0]octane skeleton in the structure. The monomer unit having 2,6-dioxabicyclo[3.3.0]octane skeleton includes a monomer unit represented by the following Formula (I): wherein R is a hydrogen atom or a methyl group. The polymeric compound for photoresist may include a monomer unit having 2,6-dioxabicyclo[3.3.0]octane skeleton, a monomer unit having a group of adhesion to substrate, and a monomer unit having an acid-eliminating group. The polymeric compound for photoresist of the present invention exhibits not only adhesion to substrate, acid-eliminating property and resistance to dry-etching but also has well-balanced solubility in solvents for photoresist and alkali-soluble property.