Abstract: An excellent image pickup device whose size and thickness are reduced is realized with a simple structure, and thus the slimming down of a mobile terminal device is accomplished. A slim image pickup device in which a plate-like member 8 having a stepped portion 8A around an opening portion 9, an optical filter 5 arranged on an inside of the stepped portion 8A to cover the opening portion, a wiring substrate 7 arranged on an outside of the stepped portion to be fitted, a semiconductor image pickup element 6 flip-chip mounted on the wiring substrate 7, and a lens 2 positioned/fitted on the plate-like member 8 are provided is realized.

Abstract: Degradation of a picked-up image quality occurs because of entry or a move of dust in the internal space of an image pickup apparatus. An image pickup apparatus for decreasing degradation of the image quality by capturing dust is provided. An image pickup apparatus 18 having a lens block 19 containing a lens 2, a semiconductor image pickup device 4 mounted on one face of a board 1, and a translucent member 5 mounted on an opposite face is characterized in that it has a gap 24 to allow a solution 23 with an adhesive dissolved to penetrate outside an optically effective range outside the space surrounded by the semiconductor image pickup device 4, the translucent member 5, and the board 1.

Abstract: An imaging device includes a lens (3), an optical filter (5), a semiconductor imaging element (4) having a light receiving section, and a tridimensional substrate (2) on which the semiconductor imaging element (4) and the optical filter (5) are mounted, wherein the tridimensional substrate (2) has an opening (14) corresponding to the light receiving section of the semiconductor imaging element (4), the semiconductor imaging element (4) and the optical filter (5) are located on one side of the opening (14), the lens (3) is located on the other side of the opening (14), and the semiconductor imaging element (4) and the optical filter (5) are fixed to the tridimensional substrate (2) under the condition that the semiconductor imaging element (4) and the optical filter (5) are curved, and have respective centers moved in a direction away from the lens (3).

Abstract: A core is divided by alternately arranging plural magnetic material portions and plural non-magnetic material portions in a circumferential direction of the core through which a primary conductor penetrates. A conductor is wound around the core under conditions in which each core cross section of the core intersects the magnetic material portion and the non-magnetic material portion, each core cross section including a cut end surface of each conductor of a secondary winding wound around the core, and a ratio of a magnetic material portion cross-sectional area of the magnetic material portion to a non-magnetic material portion cross-sectional area of the non-magnetic material portion at the core cross section is kept constant at each core cross section.

Abstract: A core is divided by alternately arranging plural magnetic material portions and plural non-magnetic material portions in a circumferential direction of the core through which a primary conductor penetrates. A conductor is wound around the core under conditions in which each core cross section of the core intersects the magnetic material portion and the non-magnetic material portion, each core cross section including a cut end surface of each conductor of a secondary winding wound around the core, and a ratio of a magnetic material portion cross-sectional area of the magnetic material portion to a non-magnetic material portion cross-sectional area of the non-magnetic material portion at the core cross section is kept constant at each core cross section.

Abstract: There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.

Abstract: It is an object of the present invention to provide an imaging device that, even if the optical axis of the multifocal lens has a deviation resulting from its decentered surfaces, can prevent an image from being deteriorated by the low precision lens. The imaging device 1 comprises a solid state image sensor 6 for taking an image of an object to produce an image signal indicative of the image, an aspherical single focus lens 2, a bifocal lens 3 disposed in front of the solid state image sensor 6, the bifocal lens 3 having two focal distances, and an aperture diaphragm 4 located just before the bifocal lens 3.

Abstract: A lens is provided which is configured so that the dimensional accuracy of the lens surface can be evaluated easily and accurately, and the control of the accuracy of the lens can be easily performed. The lens comprises a lens effective part having lens surfaces formed around an optical axis as the center and an edge part in a doughnut shape as viewed in a plan view, which is extended along the outer periphery of the lens effective part. The edge part and the lens effective part are molded simultaneously, and annular indices around the optical axis as the center, with which the dimensional accuracy of the lens surfaces can be detected, are formed on both the surfaces of the edge part.

Abstract: An imaging apparatus includes: a three-dimensional substrate in which a partition wall (11) having an opening (10a) at a central portion is formed so as to cross an inner cavity; an optical filter (5) that is fixed on a first flat surface (12) of both surfaces of the partition wall so as to cover the opening; a semiconductor imaging device (4) that is face-down mounted on a second flat surface (13) of the partition wall with an imaging area (4a) facing the opening; and an optical system for forming images that is installed on a side of the optical filter in the inner cavity of the three-dimensional substrate. The opening of the partition wall is dosed on both sides with the optical filter and the semiconductor imaging device so as to form a cavity.

Abstract: An imaging apparatus comprises: a semiconductor imaging device having a plurality of photodiodes and a color filter; and an imaging optical system for guiding light from a subject to the semiconductor imaging device, where a diameter of an aperture (40) (41) of each photodiode of the semiconductor imaging device is determined in accordance with a wavelength of light that passes through a color filter provided on an incident surface side of the photodiode. Consequently, in a camera module using the semiconductor imaging device, image degradation in the imaging apparatus is prevented in a range where wave motion has an influence due to miniaturization of the pixel size, so that the imaging apparatus can be reduced in size and thickness.

Abstract: The imaging apparatus 1 comprises: a semiconductor imaging device 5 which converts incident light to an electrical signal; an optical filter 4 which is opposed to an incident surface of the semiconductor imaging device 5 and transmits light of a certain wavelength; and a three-dimensional substrate 2 fixing the optical filter 4 by means of adhesion using a filler-containing adhesive 6; wherein the diameter of the filler is smaller than or equal to the pixel size of the semiconductor imaging device 5. Degradation of image quality of the imaging apparatus 1 caused by the dropped filler can thus be reduced.

Abstract: An imaging apparatus includes: a three-dimensional substrate in which a partition wall (11) having an opening (10a) at a central portion is formed so as to cross an inner cavity; an optical filter (5) that is fixed on a first flat surface (12) of both surfaces of the partition wall so as to cover the opening; a semiconductor imaging device (4) that is face-down mounted on a second flat surface (13) of the partition wall with an imaging area (4a) facing the opening; and an optical system for forming images that is installed on a side of the optical filter in the inner cavity of the three-dimensional substrate. The opening of the partition wall is dosed on both sides with the optical filter and the semiconductor imaging device so as to form a cavity.

Abstract: The imaging apparatus 1 comprises: a semiconductor imaging device 5 which converts incident light to an electrical signal; an optical filter 4 which is opposed to an incident surface of the semiconductor imaging device 5 and transmits light of a certain wavelength; and a three-dimensional substrate 2 fixing the optical filter 4 by means of adhesion using a filler-containing adhesive 6; wherein the diameter of the filler is smaller than or equal to the pixel size of the semiconductor imaging device 5. Degradation of image quality of the imaging apparatus 1 caused by the dropped filler can thus be reduced.

Abstract: Light that has entered a lens held by a barrel portion of a three-dimensional circuit board transmitting virtually no visible light enters a semiconductor imaging device held inside the three-dimensional circuit board. On the side opposite to the barrel portion, the three-dimensional circuit board is provided with a flexible printed circuit for sending a signal to and receiving a signal from the semiconductor imaging device. The region of the flexible printed circuit facing the semiconductor imaging device has sufficient shielding characteristics in a range sensitive to light reception by the semiconductor imaging device. This makes it possible to provide a sufficient shield against a light beam entering from the back surface of the semiconductor imaging device, so that the image quality does not deteriorate even when a conventional shielding sheet is not used.

Abstract: There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.

Abstract: There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.

Abstract: A voltage detection circuit for detecting terminal-to-terminal voltages of a plurality of storage devices B1 and B2 connected in series. In the voltage detection circuit for storage devices, voltage judgment units VPL-1, VPL-2, VPH-1 and VPH-2 are provided between the terminals of the plurality of storage devices respectively, and the detection result of the initial-stage voltage judgment unit is transmitted to the next-stage voltage judgment unit without being isolated, so that the judgment result of the final-stage voltage judgment unit is obtained.

Abstract: An apparatus for measuring absorption dose distribution may be used for radiotherapy, such as intensity modulated radiotherapy and radiosurgery. In the apparatus, measurement or evaluation of the distribution of the radiated dose within a phantom can be achieved accurately and in a relatively short length of time. The apparatus includes a phantom with a plastic plate scintillator having a thickness within the range of 0.15 to 1 mm and plastic blocks sandwiching the plastic scintillator, and an image analyzer. At least one of the plastic blocks is transparent and the image analyzer measures a pattern of intensity distribution of light emitted from the plastic scintillator when the phantom is irradiated.

Abstract: Provided is a magnetic disk capable of reducing waves and realizing a high recording density. A main surface of the disk is made from a silicate glass substrate and has a magnetic recording layer and a shaft at its central portion. The sodium ions of the main surface of the disk are replaced with potassium ions so that the potassium ion concentration increases toward an outer circumference of the disk and the strength or rigidity of the disk increases accordingly toward the outer circumference of the disk. This can reduce waves which tend to occur on the outer circumferential side of the disk.

Abstract: Provided is a magnetic disk capable of reducing waves and realizing a high recording density. A main surface of the disk is made from a silicate glass substrate and has a magnetic recording layer and a shaft at its central portion. The sodium ions of the main surface of the disk are replaced with potassium ions so that the potassium ion concentration increases toward an outer circumference of the disk and the strength or rigidity of the disk increases accordingly toward the outer circumference of the disk. This can reduce waves which tend to occur on the outer circumferential side of the disk.