Abstract: A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.

Abstract: A pre-mold package of a semiconductor device is constituted of a lead frame, a mold resin having a box-like shape constituted of a side wall and a bottom for mounting at least one semiconductor chip, and a cover composed of a conductive material. The lead frame includes a shield plate embedded in the bottom of the mold resin, a plurality of arms, and a plurality of external terminals that are exposed on the backside of the bottom of the mold resin. The arms are embedded in the side wall so that the distal ends thereof are exposed on the upper end of the side wall and are electrically connected to the cover. Instead of the arms, a plurality of internal terminals is included in the lead frame so that the distal ends thereof are exposed on the upper surfaces of racks formed inside of the mold resin.

Abstract: A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon plastic deformation of the interconnecting members. When the frame is held in a metal mold and the stages are pressed, the interconnecting members are elastically deformed, so that the magnetic sensor chips are bonded onto the stages placed substantially in the same plane and are then wired with the leads. Thereafter, the stages are released from pressure, so that the interconnecting members are restored from the elastically deformed states thereof. When the magnetic sensor chips are combined together to realize three sensing directions, it is possible to accurately measure three-dimensional bearings of magnetism, and the magnetic sensor can be reduced in dimensions and manufactured with a reduced cost therefor.

Abstract: [Object]In recording materials of a video program or the like, the video materials are efficiently and optimally acquired so that processing steps in and after an editing step subsequent to a recording step can be reduced. Solving Means A recording support information (metadata) on a schedule of and a performer for an imaging operation, and the like, which are determined in advance is recorded in a first recording medium 16 by a program constitution input device 100. The first recording medium 16 is inserted in to an imaging device 200, materials to be recorded are classified and confirmed based on the metadata, and the materials which can constitute a desirable program as potentially as possible are acquired in the recording operation.

Abstract: The present invention aims to be capable of properly measuring the cycle of an external signal even where a timer clock and a CPU clock are operated asynchronously.

Abstract: A microphone package includes a housing, which has a cavity and a sound hole for allowing the cavity to communicate with the exterior, and a microphone chip, which is mounted on the mounting surface so as to detect sound within the cavity. The sound hole is opened in connection with the mounting surface and is surrounded by a projection wall projecting upwardly from the mounting surface at a prescribed position in proximity to the microphone chip.

Abstract: It is possible to solve the problem that a memory block of a group containing information frequently updated quickly reaches the rewrite service life end when the number of spare blocks prepared in a non-volatile semiconductor recording medium cannot be modified or when the memory block is divided into a plurality of groups so as to be processed alternately. The non-volatile semiconductor recording medium includes a partition management information area and a partition area. Partition area start position information is recorded in the partition management information area. The start position information contains a value assuring a predetermined area between the end of the partition management information area and the head of the partition area. The area assured between the end of the partition management information area and the head of the partition area is set to a state where data is physically erased.

Abstract: The present invention provides acid salts, such as sulfate, hydrochloride, and methanesulfonate, of 4-(1-((4-methylbenzothiophen-3-yl)methyl)benzimidazol-2-ylthio)butanoic acid and the crystals thereof. These benzimidazole derivatives and the crystals thereof have an in vivo chymase inhibitory activity and can be used as a preventive or therapeutic agent for inflammatory diseases, allergic diseases, respiratory diseases, circulatory diseases, or bone/cartilage metabolic diseases.

Abstract: A frame rate converting apparatus provided with: a frame rate converter performing conversion of frame rate information on a frame rate, on all, a single or a plurality of sections of a video signal having an input time code which video signal is externally inputted and generated by use of a frame rate that changes or does not change; a time code calculator performing calculation of an output time code to be replaced with the input time code, on all, single or plurality of sections where the conversion of the frame rate information is performed; and a time code generator assigning the calculated output time code to all, single or plurality of sections where the conversion of the frame rate information is performed.

Abstract: A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.

Abstract: A method for manufacturing a physical quantity sensor includes the steps of: preparing a lead frame comprising a rectangular frame portion, a plurality of leads protruding out from this rectangular frame portion in the inward direction, and a stage portion that is connected to the rectangular frame portion by connecting leads; fixing a physical quantity sensor chip to the stage portion; inclining the stage portion and the physical quantity sensor chip with respect to the rectangular frame portion; and integrating the inclined physical quantity sensor chip and the leads within a metallic mold using a resin.

Abstract: A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate.

Abstract: A semiconductor device includes a substrate, a semiconductor chip having a diaphragm, which vibrates in response to sound pressure variations, and a circuit chip that is electrically connected to the semiconductor chip so as to control the semiconductor chip, wherein the semiconductor chip is fixed to the surface of the circuit chip whose backside is mounted on the surface of the substrate. Herein, a plurality of connection terminals formed on the backside of the semiconductor chip are electrically connected to a plurality of electrodes running through the circuit chip. A ring-shaped resin sheet is inserted between the semiconductor chip and the circuit chip. The semiconductor chip and the circuit chip vertically joined together are stored in a shield case having a mount member (e.g., a stage) and a cover member, wherein connection terminals of the circuit chip are exposed to the exterior via through holes of the stage.

Abstract: An image forming apparatus in which a visible image is transferred to a transfer material includes a pre-transfer exposing unit that makes only a portion of a latent image carrier that corresponds to a leading edge of the transfer material expose, and a transfer-bias applying unit that applies a bias for transferring the visible image. The transfer-bias applying unit starts applying the bias to the transfer material, at least step-by-step, when a predetermined time is passed from a point of time at which the leading edge of the transfer material comes into a contact with the latent image carrier by controlling the pre-transfer exposing unit and a bias applying timing of the transfer-bias applying unit.

Abstract: A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon plastic deformation of the interconnecting members. When the frame is held in a metal mold and the stages are pressed, the interconnecting members are elastically deformed, so that the magnetic sensor chips are bonded onto the stages placed substantially in the same plane and are then wired with the leads. Thereafter, the stages are released from pressure, so that the interconnecting members are restored from the elastically deformed states thereof. When the magnetic sensor chips are combined together to realize three sensing directions, it is possible to accurately measure three-dimensional bearings of magnetism, and the magnetic sensor can be reduced in dimensions and manufactured with a reduced cost therefor.

Abstract: A data transfer bus system is provided which is able to carry out effective processing of interrupt. To an AHB (Advanced High performance Bus) of an AMBA (Advanced Micro-controller Bus Architecture) system, connected are an AHB bus interface connected to an ARM CPU, an AHB bus arbiter, an AHB-APB bridge, a high-performance peripheral device and a bus request priority determining circuit. Further, to the AHB-APB bridge, a timer and a UART device, etc., are connected via the peripheral bus (APB). The interrupt controller to which interrupt request signals are inputted outputs an interrupt signal to the ARM CPU and the bus request priority determining circuit, and decides whether to generate the bus request sent from the high-performance peripheral device, according to the priority ranking of the interrupt and the bus request.

Abstract: A semiconductor device is produced using a lead frame whose size is smaller than a prescribed center area of a semiconductor chip surrounded by its bonding pads, which are connected with electrodes supported by electrode supports and interconnected with outer frames and an intermediate frame of the lead frame via bonding wires. A series of projections and hollows are formed on the outer frames, wherein the electrode supports are interconnected with the hollows of the outer frames respectively. The semiconductor chip combined with the lead frame, is integrally enclosed in a resin under the condition where only the electrode surfaces are exposed to the exterior, thus forming a resin package. Then, the electrode supports locating the electrodes are cut out and partially removed, so that the electrodes are made electrically independent from each other.

Abstract: A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon plastic deformation of the interconnecting members. When the frame is held in a metal mold and the stages are pressed, the interconnecting members are elastically deformed, so that the magnetic sensor chips are bonded onto the stages placed substantially in the same plane and are then wired with the leads. Thereafter, the stages are released from pressure, so that the interconnecting members are restored from the elastically deformed states thereof. When the magnetic sensor chips are combined together to realize three sensing directions, it is possible to accurately measure three-dimensional bearings of magnetism, and the magnetic sensor can be reduced in dimensions and manufactured with a reduced cost therefor.

Abstract: An image forming apparatus in which a visible image is transferred to a transfer material includes a pre-transfer exposing unit that makes only a portion of a latent image carrier that corresponds to a leading edge of the transfer material expose, and a transfer-bias applying unit that applies a bias for transferring the visible image. The transfer-bias applying unit starts applying the bias to the transfer material, at least step-by-step, when a predetermined time is passed from a point of time at which the leading edge of the transfer material comes into a contact with the latent image carrier by controlling the pre-transfer exposing unit and a bias applying timing of the transfer-bias applying unit.

Abstract: A physical quantity sensor includes a pair of physical quantity sensor chips that are inclined with respect to the bottom of an exterior mold package whose side surfaces are each inclined in a thickness direction by an angle ranging from 0° to 5° and are formed in proximity to the outer ends of the physical quantity sensor chips. It is possible to realize the inclination of stages without using molds, wherein absorption devices are used to absorb prescribed portions related to stages, which rotate about axial lines and are thus inclined with respect to a prescribed base. In manufacturing, a thin metal plate having a plurality of lead frames is placed on a base delimited by a clamp; then, intersecting points of intermediate portions formed between the lead frames are subjected to pressing so as to realize the inclination of stages.