Patents by Inventor Hiroshi Tomita

Hiroshi Tomita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11003154
    Abstract: A motor control system includes motor control devices and a controller. The controller generates and transmits a communication signal including an operation command to the respective motor control devices. The motor control devices include two motor control devices in a first group, each of which includes a data transceiver, a motor controller, a corrector, and a synchronous timing generator, and a motor control device in a second group. The data transceiver receives an operation command issued to the motor control device, and receives operation information in the motor control device in the second group. Based on the operation command, the motor controller generates a torque command signal. The corrector generates a torque correction signal based on the operation information, and corrects the torque command signal. The synchronous timing generator generates a timing signal that matches pieces of process timing of the motor controllers in the first group with each other.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: May 11, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGENENT CO., LTD.
    Inventors: Mitsutaka Okura, Akinobu Tomita, Hiroshi Fujiwara, Yoshiaki Ikeuchi
  • Patent number: 10924719
    Abstract: Provided is a head-mounted video presentation device which has a visible light wavelength conversion and is designed for a user having degraded sensitivity to a first wavelength band as a part of a visible light wavelength band as compared with a second wavelength band as the remaining part of the visible light wavelength band.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: February 16, 2021
    Inventors: Hiroshi Tomita, Eriko Sugano, Tsuyoshi Fujii
  • Publication number: 20210003781
    Abstract: An optical module that has a structure ensuring reduction in size. The optical module has a structure where a part of a fiber block is protruded from a housing. By including a thin plate, this optical module can avoid entering of dust in the housing, allows a position shift of the fiber block due to a mounting position error of an optical component in the housing, a position shift of an opening portion due to a dimensional error of the housing, or a displacement due to a temperature change, and can reduce the coupling loss due to the optical axis misalignment.
    Type: Application
    Filed: December 19, 2018
    Publication date: January 7, 2021
    Inventors: Yuichi SUZUKI, Tomohiro NAKANISHI, Motoki MINAMI, Hiroshi TOMITA, Motohaya ISHII, Shuichiro ASAKAWA, Shunichi SOMA
  • Publication number: 20200393803
    Abstract: This method includes: a step of imaging, by an imaging apparatus in a substrate treatment system, a reference substrate which is a reference for condition setting and acquiring a captured image of the reference substrate; a step of imaging, by the imaging apparatus, a treated substrate on which the predetermined treatment has been performed under a current treatment condition and acquiring a captured image of the treated substrate; a step of calculating a deviation amount in color information between the captured image of the treated substrate and the captured image of the reference substrate; a step of calculating a correction amount of the treatment condition based on a correlation model acquired in advance and on the deviation amount in the color information; and a step of setting the treatment condition based on the correction amount, wherein steps other than the step of acquiring a captured image of the reference substrate are performed for each of the treatment apparatuses.
    Type: Application
    Filed: May 31, 2018
    Publication date: December 17, 2020
    Inventors: Takuya MORI, Tadashi NISHIYAMA, Akiko KIYOTOMI, Hiroshi TOMITA
  • Publication number: 20200388025
    Abstract: A method of inspecting a substrate, includes: creating a model indicating a relation between a pixel value in a captured image of the substrate and a feature amount of a film on the substrate, based on a measured feature amount of a film on a creating substrate and a captured image generated by imaging the creating substrate by an apparatus in a first system; imaging an object substrate by an apparatus in a second system to generate a captured image, and calculating an estimated feature amount of a film on the object substrate, based on the captured image and the model; calculating a statistical value of the estimated feature amounts of the object substrates; and calculating an offset amount for the estimated feature amount from a measured feature amount of a film formed by performing a same treatment on an offset substrate in the second system and the statistical value.
    Type: Application
    Filed: May 29, 2020
    Publication date: December 10, 2020
    Inventors: Toyohisa TSURUDA, Hiroshi TOMITA
  • Patent number: 10799917
    Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: October 13, 2020
    Assignees: EBARA CORPORATION, Toshiba Memory Corporation
    Inventors: Yu Ishii, Hiroyuki Kawasaki, Kenichi Nagaoka, Kenya Ito, Masako Kodera, Hiroshi Tomita, Takeshi Nishioka
  • Publication number: 20200284714
    Abstract: According to one embodiment, a particle measuring method is disclosed. The method includes irradiating a detection liquid with light. The detection liquid contains methyl salicylate. The method further includes converting scattered light from the detection liquid into an electric signal by using photoelectric conversion after irradiating the detection liquid with the light. The method further includes performing a particle measurement on the detection liquid by using the electric signal.
    Type: Application
    Filed: March 3, 2020
    Publication date: September 10, 2020
    Applicants: Kioxia Corporation, RION Co., Ltd.
    Inventors: Hiroshi TOMITA, Hidekazu HAYASHI, Eishi SHIOBARA, Kaoru KONDO, Takuya TABUCHI, Kazuna BANDO, Sota KONDO
  • Patent number: 10607763
    Abstract: A reactor includes a coil body, an exterior case, and a filler. The coil body includes a core and a coil wound around the core. The exterior case includes a metal structure and a resin frame. The metal structure has a bottom surface and a side wall provided to stand upright from the bottom surface. The bottom surface and the side wall of the metal structure are unitarily formed with each other. The frame is disposed at an opposite side to the bottom surface of the metal structure. The exterior case houses the core and the coil. The filler is filled between the exterior case and the coil body.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: March 31, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Nobuya Matsutani, Toshiyuki Asahi, Junichi Kotani, Hiroshi Tomita, Hidenori Uematsu
  • Patent number: 10586694
    Abstract: According to one embodiment, a method for fabricating a semiconductor device includes performing a back surface processing to remove at least one of a scratch and a foreign material formed on a back surface of a substrate to be processed, a front surface of the substrate being retained in a non-contact state, contacting the back surface of the substrate to a stage to be retained, and providing a pattern on the front surface of the substrate by using lithography.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: March 10, 2020
    Assignee: Toshiba Memory Corporation
    Inventors: Masako Kodera, Hiroshi Tomita, Takeshi Nishioka
  • Patent number: 10573508
    Abstract: In one embodiment, a surface treatment apparatus for a semiconductor substrate includes a holding unit, a first supply unit, a second supply unit, a third supply unit, a drying treatment unit, and a removal unit. The holding unit holds a semiconductor substrate with a surface having a convex pattern formed thereon. The first supply unit supplies a chemical solution to the surface of the semiconductor substrate, to perform cleaning and oxidation. The second supply unit supplies pure water to the surface of the semiconductor substrate, to rinse the semiconductor substrate. The third supply unit supplies a water repelling agent to the surface of the semiconductor substrate, to form a water repellent protective film on the surface of the convex pattern. The drying treatment unit dries the semiconductor substrate. The removal unit removes the water repellent protective film while making the convex pattern remain.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: February 25, 2020
    Assignee: Toshiba Memory Corporation
    Inventors: Tatsuhiko Koide, Shinsuke Kimura, Yoshihiro Ogawa, Hisashi Okuchi, Hiroshi Tomita
  • Patent number: 10529588
    Abstract: In accordance with an embodiment, a substrate treatment method includes bringing a first metallic film on a substrate into contact with a first liquid, mixing a second liquid into the first liquid, and bringing the first metallic film or a second metallic film different from the first metallic film into contact with a liquid in which the first liquid and the second liquid are mixed together to etch the first or second metallic film. The first liquid includes an oxidizing agent, a complexing agent, and water (H2O) of a first content rate to etch the first metallic film. The second liquid includes water (H2O) at a second content rate higher than the first content rate after the etching has started.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: January 7, 2020
    Assignee: Toshiba Memory Corporation
    Inventors: Yuya Akeboshi, Hiroshi Tomita, Hisashi Okuchi, Yasuhito Yoshimizu, Hiroaki Yamada
  • Publication number: 20190394439
    Abstract: Provided is a head-mounted video presentation device which has a visible light wavelength conversion and is designed for a user having degraded sensitivity to a first wavelength band as a part of a visible light wavelength band as compared with a second wavelength band as the remaining part of the visible light wavelength band.
    Type: Application
    Filed: December 20, 2017
    Publication date: December 26, 2019
    Inventors: Hiroshi Tomita, Eriko Sugano, Tsuyoshi Fujii
  • Publication number: 20190366963
    Abstract: A sensor protector configured including a mount, a plate shaped cover, and an electromagnetic wave shield is provided. The mount is mounted at a bracket configured to fix a sensor, provided at an inner side of a bumper cover, to a body of a vehicle. The plate shaped cover that extends from a lower portion of the mount toward the bumper cover with an end portion of the cover, at an outer side in a vehicle front-rear direction ,separated from the bumper cover, and covers a lower portion of the sensor as viewed from a lower side of the vehicle. The electromagnetic wave shield is provided to at least a portion of the cover.
    Type: Application
    Filed: May 7, 2019
    Publication date: December 5, 2019
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takuto KUMASHIRO, Kenji Furumoto, Hiroshi Tomita
  • Publication number: 20190262869
    Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.
    Type: Application
    Filed: May 7, 2019
    Publication date: August 29, 2019
    Inventors: Yu Ishii, Hiroyuki Kawasaki, Kenichi Nagaoka, Kenya Ito, Masako Kodera, Hiroshi Tomita, Takeshi Nishioka
  • Publication number: 20190262870
    Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.
    Type: Application
    Filed: May 7, 2019
    Publication date: August 29, 2019
    Inventors: Yu Ishii, Hiroyuki Kawasaki, Kenichi Nagaoka, Kenya Ito, Masako Kodera, Hiroshi Tomita, Takeshi Nishioka
  • Patent number: 10328465
    Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: June 25, 2019
    Assignee: EBARA CORPORATION
    Inventors: Yu Ishii, Hiroyuki Kawasaki, Kenichi Nagaoka, Kenya Ito, Masako Kodera, Hiroshi Tomita, Takeshi Nishioka
  • Patent number: 10249034
    Abstract: A method of adjusting a sensitivity parameter value for substrate defect inspection used in a substrate defect inspection apparatus compares, for each pixel value of a selected virtual inspection substrate, using reference pixel data to be used after adjustment, the deviation amount from an allowable range corresponding to the position thereof and the sensitivity parameter value before the adjustment when each pixel value is deviated from the allowable range, and updates the deviation amount as a new sensitivity parameter value when the deviation amount exceeds the sensitivity parameter value and a difference between the deviation amount and the sensitivity parameter value is equal to or less than a threshold value.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: April 2, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Yasuhiro Kitada, Izumi Hasegawa, Hiroshi Tomita, Kousuke Nakayama, Tadashi Nishiyama
  • Patent number: 10199240
    Abstract: A substrate processing method and apparatus which can remove an anti-drying liquid, which has entered a three-dimensional pattern with recessed portions formed in a substrate, in a relatively short time. The substrate processing method includes the steps of: carrying a substrate, having a three-dimensional pattern formed in a surface, into a processing container, said pattern being covered with an anti-drying liquid that has entered the recessed portions of the pattern; heating the substrate and supplying a pressurizing gas or a fluid in a high-pressure state into the processing container, thereby forming a high-pressure atmosphere in the processing container before the anti-drying liquid vaporizes to such an extent as to cause pattern collapse and bringing the anti-drying liquid into a high-pressure state while keeping the liquid in the recessed portions of the pattern; and thereafter discharging a fluid in a high-pressure state or a gaseous state from the processing container.
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: February 5, 2019
    Assignees: Toshiba Memory Corporation, Tokyo Electron Limited
    Inventors: Hidekazu Hayashi, Yohei Sato, Hisashi Okuchi, Hiroshi Tomita, Kazuyuki Mitsuoka, Mitsuaki Iwashita, Takehiko Orii, Gen You, Hiroki Ohno, Takayuki Toshima
  • Patent number: 10155246
    Abstract: A method for adjusting a chemical liquid supply device of supplying a chemical liquid through a nozzle for removing a coating film on a peripheral portion of a substrate having the coating film formed on a surface thereof and horizontally held by a holding table is provided. The method includes discharging the chemical liquid from the nozzle, performing, by an image pickup part, continuous image pickup on a region including a leading end of the nozzle and a region in which the chemical liquid discharged from the leading end forms a liquid stream in the air, acquiring area change data representing a temporal change in area of the chemical liquid in an image pickup region based on an image pickup result obtained by the image pickup part, and adjusting a supply control device installed in a chemical liquid supply path connected to the nozzle based on the area change data.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: December 18, 2018
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Hiroshi Tomita, Shinichi Mizushino
  • Patent number: D843076
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: March 12, 2019
    Assignee: KABUSHIKI-KAISHA TOMITAHAMONO
    Inventor: Hiroshi Tomita