Abstract: A display device for displaying information about substrate processing executed in a substrate processing apparatus, includes: a display control part configured to, in response to a first instruction from a user, allow the display screen to display a first image based on first capturing data obtained by capturing an image of a display target substrate among the substrates in the substrate processing apparatus, and configured to, in response to a second instruction from the user, allow the display screen to display a second image based on second capturing data obtained by capturing the image of the display target substrate in the substrate processing apparatus, wherein the first capturing data is obtained by capturing the image of the display target substrate at a different timing from the second capturing data, or by capturing the image of the display target substrate in a different capturing region from the second capturing data.

Abstract: According to one embodiment, a power generation element includes a first conductive region including a first surface, a plurality of second conductive regions, and a plurality of insulating structure regions. The second conductive regions are arranged along the first surface. A gap is provided between the second conductive regions and the first surface. One of the structure regions is provided between one of the second conductive regions and the first surface. An other one of the structure regions is provided between an other one of the second conductive regions and the first surface.

Abstract: According to one embodiment, a power generation element, includes a first conductive layer, a second conductive layer, and a crystal member. A direction from the second conductive layer toward the first conductive layer is along a first direction. The crystal member is provided between the first conductive layer and the second conductive member. The crystal member includes a crystal pair. The crystal pair includes a first crystal part and a second crystal part. A second direction from the first crystal part toward the second crystal part crosses the first direction. A gap is provided between the first crystal part and the second crystal part. The first conductive layer is electrically connected to the first crystal part. The second conductive layer is electrically connected to the second crystal part.

Abstract: According to one embodiment, an electron emitting element includes a first region, a second region, and a third region. The first region includes a semiconductor including a first element of an n-type impurity. The second region includes diamond. The diamond includes a second element including at least one selected from the group consisting of nitrogen, phosphorous, arsenic, antimony, and bismuth. The third region is provided between the first region and the second region. The third region includes Alx1Ga1-x1N (0<x1?1) including a third element including at least one selected from the group consisting of Si, Ge, Te and Sn. A +c-axis direction of the third region includes a component in a direction from the first region toward the second region.

Abstract: An optical module that has a structure ensuring reduction in size. The optical module has a structure where a part of a fiber block is protruded from a housing. By including a thin plate, this optical module can avoid entering of dust in the housing, allows a position shift of the fiber block due to a mounting position error of an optical component in the housing, a position shift of an opening portion due to a dimensional error of the housing, or a displacement due to a temperature change, and can reduce the coupling loss due to the optical axis misalignment.

Abstract: A photoelectric conversion element having a photoelectric conversion layer formed between a first electrode layer and a second electrode layer, in which the photoelectric conversion layer contains Cu and Ag, which are Group I elements, In and Ga, which are Group III elements, and Se and S, which are Group VI elements. A portion at which a minimum value of a band gap appears in a thickness direction of the photoelectric conversion layer is included in the intermediate region. When a ratio of a mole amount of Ag to a sum of mole amounts of the Group I elements other than Ag, the Group III elements, and the Group VI elements is defined as an Ag concentration, a portion at which a maximum value of the Ag concentration appears in the thickness direction of the photoelectric conversion layer is included in the intermediate region.

Abstract: For an easy calibration using calibration particles, provided is a measuring device to capture images of target objects. An image analyzer acquires multiple images obtained at a predetermined time interval, (a) specifies the mean-square displacement of a bright point of a calibration particle based on the displacement of the bright point of the calibration particle in the multiple images in a calibration mode, and (b) specifies the mean-square displacement of a bright point of the target particle based on the displacement of the bright point of the target particle in the multiple images in a measurement mode. A particle size analyzer (c) derives the particle size of the target particle from the mean-square displacement of the bright point of the target particle based on the mean-square displacement of the bright point of the calibration particle and the particle size of the calibration particle in an analysis mode.

Abstract: An object of the present invention is to provide a modified channel rhodopsin capable of opening and closing an ion channel by irradiation with light at different wavelengths, and/or having high ion permeability (photoreactivity). The solution is to substitute a C-terminal region of a channel rhodopsin obtained by substituting an N-terminal region of a Volvox carteri-derived channel rhodopsin by an N-terminal region of a Chlamydomonas reinhardtii-derived channel rhodopsin-1, by a C-terminal region of a Chlamydomonas reinhardtii-derived channel rhodopsin-2 or a C-terminal region of a Tetraselmis striata-derived channel rhodopsin.

Abstract: A sensor protector configured including a mount, a plate shaped cover, and an electromagnetic wave shield is provided. The mount is mounted at a bracket configured to fix a sensor, provided at an inner side of a bumper cover, to a body of a vehicle. The plate shaped cover that extends from a lower portion of the mount toward the bumper cover with an end portion of the cover, at an outer side in a vehicle front-rear direction, separated from the bumper cover, and covers a lower portion of the sensor as viewed from a lower side of the vehicle. The electromagnetic wave shield is provided to at least a portion of the cover.

Abstract: According to one embodiment, a particle measuring method is disclosed. The method includes irradiating a detection liquid with light. The detection liquid contains methyl salicylate. The method further includes converting scattered light from the detection liquid into an electric signal by using photoelectric conversion after irradiating the detection liquid with the light. The method further includes performing a particle measurement on the detection liquid by using the electric signal.

Abstract: Provided is a head-mounted video presentation device which has a visible light wavelength conversion and is designed for a user having degraded sensitivity to a first wavelength band as a part of a visible light wavelength band as compared with a second wavelength band as the remaining part of the visible light wavelength band.

Abstract: An optical module that has a structure ensuring reduction in size. The optical module has a structure where a part of a fiber block is protruded from a housing. By including a thin plate, this optical module can avoid entering of dust in the housing, allows a position shift of the fiber block due to a mounting position error of an optical component in the housing, a position shift of an opening portion due to a dimensional error of the housing, or a displacement due to a temperature change, and can reduce the coupling loss due to the optical axis misalignment.

Abstract: This method includes: a step of imaging, by an imaging apparatus in a substrate treatment system, a reference substrate which is a reference for condition setting and acquiring a captured image of the reference substrate; a step of imaging, by the imaging apparatus, a treated substrate on which the predetermined treatment has been performed under a current treatment condition and acquiring a captured image of the treated substrate; a step of calculating a deviation amount in color information between the captured image of the treated substrate and the captured image of the reference substrate; a step of calculating a correction amount of the treatment condition based on a correlation model acquired in advance and on the deviation amount in the color information; and a step of setting the treatment condition based on the correction amount, wherein steps other than the step of acquiring a captured image of the reference substrate are performed for each of the treatment apparatuses.

Abstract: A method of inspecting a substrate, includes: creating a model indicating a relation between a pixel value in a captured image of the substrate and a feature amount of a film on the substrate, based on a measured feature amount of a film on a creating substrate and a captured image generated by imaging the creating substrate by an apparatus in a first system; imaging an object substrate by an apparatus in a second system to generate a captured image, and calculating an estimated feature amount of a film on the object substrate, based on the captured image and the model; calculating a statistical value of the estimated feature amounts of the object substrates; and calculating an offset amount for the estimated feature amount from a measured feature amount of a film formed by performing a same treatment on an offset substrate in the second system and the statistical value.

Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.

Abstract: According to one embodiment, a particle measuring method is disclosed. The method includes irradiating a detection liquid with light. The detection liquid contains methyl salicylate. The method further includes converting scattered light from the detection liquid into an electric signal by using photoelectric conversion after irradiating the detection liquid with the light. The method further includes performing a particle measurement on the detection liquid by using the electric signal.

Abstract: A reactor includes a coil body, an exterior case, and a filler. The coil body includes a core and a coil wound around the core. The exterior case includes a metal structure and a resin frame. The metal structure has a bottom surface and a side wall provided to stand upright from the bottom surface. The bottom surface and the side wall of the metal structure are unitarily formed with each other. The frame is disposed at an opposite side to the bottom surface of the metal structure. The exterior case houses the core and the coil. The filler is filled between the exterior case and the coil body.

Abstract: According to one embodiment, a method for fabricating a semiconductor device includes performing a back surface processing to remove at least one of a scratch and a foreign material formed on a back surface of a substrate to be processed, a front surface of the substrate being retained in a non-contact state, contacting the back surface of the substrate to a stage to be retained, and providing a pattern on the front surface of the substrate by using lithography.

Abstract: In one embodiment, a surface treatment apparatus for a semiconductor substrate includes a holding unit, a first supply unit, a second supply unit, a third supply unit, a drying treatment unit, and a removal unit. The holding unit holds a semiconductor substrate with a surface having a convex pattern formed thereon. The first supply unit supplies a chemical solution to the surface of the semiconductor substrate, to perform cleaning and oxidation. The second supply unit supplies pure water to the surface of the semiconductor substrate, to rinse the semiconductor substrate. The third supply unit supplies a water repelling agent to the surface of the semiconductor substrate, to form a water repellent protective film on the surface of the convex pattern. The drying treatment unit dries the semiconductor substrate. The removal unit removes the water repellent protective film while making the convex pattern remain.