Abstract: A method for manufacturing a wiring board is capable of forming a metal layer included in a wiring layer to have an even thickness. The method includes preparing a conductive first underlayer on a surface of a substrate; a conductive second underlayer on a surface of the first underlayer; and a seed layer on a surface of the second underlayer and containing metal. The method disposes a solid electrolyte membrane between an anode and the seed layer as a cathode; applies voltage between the anode and the first underlayer to form a metal layer on the surface of the seed layer; removes an exposed portion of the second underlayer without the seed layer from the substrate; and removes an exposed portion of the first underlayer without the seed layer from the substrate. The first underlayer is a material having a higher electrical conductivity than that of the second underlayer.

Abstract: Provided is a method for manufacturing a wiring board that forms a wiring layer having favorable adhesion without a resin resist pattern. A method prepares a substrate with seed-layer including: a underlayer on the surface of an insulating substrate; and a seed layer on the surface of the underlayer, the seed layer having a predetermined pattern and containing metal; presses a solid electrolyte membrane against the seed layer and the underlayer, and applies voltage between an anode and the underlayer to reduce metal ions in the membrane and form a metal layer on the surface of the seed layer; and removes an exposed region without the seed layer and the metal layer of the underlayer to form a wiring layer including the underlayer, the seed layer and the metal layer on the surface of the substrate.

Abstract: A film deposition device (1A) of a metal film (F) includes a positive electrode (11), a solid electrolyte membrane (13), and a power supply part (14) that applies a voltage between the positive electrode (11) and a base material (B) to be a negative electrode. The solid electrolyte membrane (13) allows a water content to be 15% by mass or more and is capable of containing a metal ion. The power supply part (14) applies a voltage between the positive electrode and the base material in a state where the solid electrolyte membrane is disposed on a surface of the positive electrode such that metal made of metal ions contained inside the solid electrolyte membrane (13) is precipitated on a surface of the base material (B).

Abstract: Provided is a separator for fuel cell that can reduce the initial contact resistance and the contact resistance under the corrosive environment. A separator for fuel cell includes a metal substrate and a surface layer on the surface of the metal substrate. The surface layer includes CNT and a Si-based binder. The surface layer has the surface coverage of the CNT that is 90% or more and the ratio of the Si-based binder that is 40% or more.

Abstract: A nickel solution for forming a film that can suppress generation of hydrogen gas between a solid electrolyte membrane and a substrate while the solid electrolyte membrane and the substrate are brought into contact with each other. The pH of the nickel solution for forming a film is in the range of 4.2 to 6.1. The nickel solution for forming a film further contains a pH buffer solution that has a buffer function in the range of the pH and does not form insoluble salts or complexes with the nickel ions during formation of the film.

Abstract: A method of forming a metal coating includes: disposing a solid electrolyte membrane (13) between an anode (11) and a substrate (B) which forms a cathode; bringing a solution (L) containing metal ions into contact with an anode-side portion of the solid electrolyte membrane (13); and causing, in a state where the solid electrolyte membrane (13) is in contact with the substrate (B), a current to flow from the anode (11) to the cathode so as to form a metal coating formed of the metal on the surface of the substrate (B). The metal coating is formed by repeating a current-flowing period (T) in which a current flows from the anode (11) to the cathode and a non-current-flowing period (N) in which a current does not flow between the anode (11) and the cathode.

Abstract: A method of forming a wiring pattern includes: a) forming a metal underlayer including a first underlying wiring layer which is in contact with an electrode, a second underlying wiring layer which is not in contact with the electrode, and an underlying connection layer which connects the first underlying wiring layer to the second underlying wiring layer; b) forming a metal plating layer on the metal underlayer through electroplating; and c) removing a metal connection portion through etching. The metal connection portion is the underlying connection layer covered with the metal plating layer. The etching includes bringing a solid electrolyte material that contains a solution into which metal of the metal connection portion is dissolved, into contact with the metal connection portion and applying a voltage between the metal connection portion and the solid electrolyte material.

Abstract: A coating forming device for forming a metal coating on a surface of a substrate includes: an anode; a power supply; and a solid electrolyte membrane disposed between the anode and the substrate and contains metal ions. The solid electrolyte membrane includes: a contact surface that is a region contacting a coating-forming region where the metal coating is formed; and a concave portion recessed relative to the contact surface such that, when the contact surface contacts the coating-forming region, the solid electrolyte membrane is not in contact with a portion of the surface of the substrate excluding the coating-forming region. The metal ions are reduced to form the metal coating on the coating-forming region by the power supply applying a voltage between the anode and the substrate.

Abstract: A metallic conducting function member used for conducting electricity in a fuel cell stack comprises a conductive inorganic film on a surface of a metal base material. The inorganic film that is a thin film made of a conductive inorganic material includes a carbon-based conductive material dispersed at a weight ratio that is equal to or higher than 20%. Using this metallic conducting function member for a stack of fuel cells that is a stack of power generation cells each obtained by sandwiching an electrolyte membrane having proton conductivity with an anode electrode and a cathode electrode can lead to small contact resistance value and high corrosion resistance.

Abstract: A composite resin includes an acrylic resin constituent unit, an epoxy resin constituent unit, and a polysiloxane constituent unit. A proportion of the polysiloxane constituent unit in the composite resin is 1.5 weight % to 12 weight % in terms of SiO2. When the composite resin is used, it is possible to provide a coating film having high corrosion resistance.

Abstract: A metal-film forming apparatus includes: an anode; a resin substrate having a surface on which a conductor pattern layer that serves as a cathode is formed; a solid electrolyte membrane that contains metal ions and is between the anode and the resin substrate, the solid electrolyte membrane contacting a surface of the conductor pattern layer when a metal film is formed; a power supply; and a conductive member that is arranged contacting the conductor pattern layer when the metal film is formed, such that a negative electrode of the power supply is electrically connected to the conductor pattern layer, the conductive member being detachable from the conductor pattern layer, wherein the metal ions are reduced to deposit metal that forms the metal film on the surface of the conductor pattern layer when the voltage is applied.

Abstract: A method of producing plate-shaped silver nanoparticles includes: preparing a mixed liquid by adding, to a solution containing silver ions, a reducing agent having a standard electrode potential within a range from 0.03 V to 0.8 V and polyvinylpyrrolidone having a weight-average molecular weight of 10000 to 40000; and precipitating silver from the silver ions by irradiating the mixed liquid with a microwave.

Abstract: Provided are a film formation device and a film formation method for forming a metal film, with which metal films with a desired thickness can be continuously formed on surfaces of a plurality of substrates. A film formation device 1A includes at least a positive electrode 11, a negative electrode 12, a solid electrolyte membrane 13 arranged on a surface of the positive electrode 12, between. the positive electrode and a substrate to serve as the negative electrode, and a power supply unit E adapted to apply a voltage across the positive electrode 11 and the substrate B. A voltage is applied across the positive electrode 11 and the substrate B to deposit metal on a surface of the substrate from metal ions contained in the solid electrolyte membrane 13, whereby a metal film F made of metal is formed, The positive electrode 11 is made of a porous body that allows a solution L containing metal ions to pass therethrough and supplies the metal ions to the solid electrolyte membrane 13.

Abstract: A surface treatment method includes: roughening a surface region of a substrate corresponding to a through hole provided to a masking plate by supplying a solvent to a solid electrolyte film from a second surface of a masking plate through the through hole, in a state where: a first surface of the solid electrolyte film is arranged directly on the surface of the substrate; and a first surface of the masking plate is arranged directly on a second surface of the solid electrolyte film, wherein the supplied solvent penetrates the solid electrolyte film, and dissolves the surface of the substrate.

Abstract: Provided are a film formation device and a film formation method for forming a metal film, with which metal films with a desired thickness can be continuously formed on surfaces of a plurality of substrates. A film formation device 1A includes at least a positive electrode 11, a negative electrode 12, a solid electrolyte membrane 13 arranged on a surface of the positive electrode 12, between. the positive electrode and a substrate to serve as the negative electrode, and a power supply unit E adapted to apply a voltage across the positive electrode 11 and the substrate B. A voltage is applied across the positive electrode 11 and the substrate B to deposit metal on a surface of the substrate from metal ions contained in the solid electrolyte membrane 13, whereby a metal film F made of metal is formed, The positive electrode 11 is made of a porous body that allows a solution L containing metal ions to pass therethrough and supplies the metal ions to the solid electrolyte membrane 13.

Abstract: A solid electrolyte membrane (13) is arranged on a surface of an anode (11) between the anode (11) and a substrate (B) that serves as a cathode. The solid electrolyte membrane (13) is brought into contact with the substrate (B). At the same time, a metal film (F) is formed on the surface of the substrate (B) by causing metal to precipitate onto the surface of the substrate (B) from metal ions through application of voltage between the anode (11) and the substrate (B) in a first contact state where the solid electrolyte membrane (13) contacts the substrate (B). The metal ions are contained inside the solid electrolyte membrane (13).

Abstract: A film deposition device (1A) of a metal film includes: a solid electrolyte membrane (13) that allows metal ions to be contained; a positive electrode (11) made of a porous body; a power supply part (14) that applies a voltage between the positive electrode and a base material; and a contact pressurization part (20) that comes into contact with the positive electrode (11) and uniformly pressurizes a film deposition region of a surface of the base material by the solid electrolyte membrane (13) via the positive electrode (11). The positive electrode (11) made of the porous body is capable of transmitting a solution containing the metal ions such that the metal ions are supplied to the solid electrolyte membrane. The power supply part (14) applies a voltage between the positive electrode and the base material so that the metal film made of the metal is deposited.

Abstract: Provided is a metal coating film formation device capable of forming a film using a simple device configuration and in a short time, and capable of performing the formation of a film of metal coating continuously for a long period. A film formation device 1A is provided with an anode 11, a solid electrolyte film 13 disposed between the anode 11 and the base material B, and a power supply unit 16 that applies a voltage between the anode 11 and the base material B. The anode 11 is a non-porous anode comprising the same metal as the metal of the metal coating. Between the anode 11 and the solid electrolyte film 13, a porous material 14 is disposed in contact with the anode 11 and the solid electrolyte film 13. The porous material 14 includes a plurality of pores providing communication between the anode 11 and the solid electrolyte film 13 and being supplied with a metal solution L.

Abstract: Provided is film formation apparatus of a metal film and a film formation method therefor capable of forming a homogeneous metal film of a uniform thickness stably, while being less affected by the surface state of the anode. A film formation apparatus 1A includes: an anode 11; a solid electrolyte membrane 13 disposed between the anode 11 and a base B serving as a cathode; and a power supply unit 14 to apply voltage between the anode 11 and the base B, the film formation apparatus being configured so that, when the solid electrolyte membrane 13 is brought into contact with a surface of the base B, and voltage is applied between the anode 11 and the base B, metal is deposited on the surface of the base B from metal ions included inside of the solid electrolyte membrane 13, so that the metal film F made of the metal is formed.

Abstract: A film forming apparatus includes: an anode; a solid electrolyte membrane that is arranged between the anode and an substrate that serves as a cathode, and that contains metal ions; a power supply that applies a voltage between the anode and the substrate in a state in which the solid electrolyte membrane is in contact with the substrate from above; and an oscillating portion configured to oscillate at least the anode in the state in which the solid electrolyte membrane is in contact with the substrate.