Abstract: A fixing structure of a wiring member includes: an electrical wire bundle; an exterior member externally mounted to the electrical wire bundle; and an adherend having a main surface as a flat surface, wherein the exterior member has an outer surface as a flat surface, and the outer surface and the main surface have surface contact with and are bonded to each other while the electrical wire bundle is disposed on the main surface of the adherend.

Abstract: A multicore cable according to one embodiment of the present disclosure includes a core wire including a plurality of core electric wires stranded together; and a sheath layer disposed around the core wire, wherein each of the core wires includes a conductor including a plurality of elemental wires twisted together and an insulating layer that covers an outer periphery of the conductor, wherein the sheath layer includes an inner sheath layer and an outer sheath layer covering the inner sheath layer, wherein a main component of the inner sheath layer is a copolymer of ethylene and (meth) acrylic acid alkyl ester, and wherein a content of the (meth) acrylic acid alkyl ester in the copolymer is more than 7 mass %.

Abstract: There is provided a composite material having a composite film on a substrate, the composite film including a silver layer that contains carbon particles, wherein a crystallite size of silver of the composite film is 30 to 100 nm and Vickers hardness Hv of the composite film is 75 or more.

Abstract: A fixing structure of a wiring member includes: a wiring member including at least one wire-like transmission member; a joint member including an adhesive layer, a heat generation layer, and a joint layer; and an adherend to which the wiring member is fixed, wherein the heat generation layer is a layer which can generate heat by induction heating and is provided between the adhesive layer and the joint layer, the joint layer is a layer having bond properties when heat is transmitted from the heat generation layer at a time of induction heating, the adhesive layer is fixed to one of the wiring member and the adherend, and the joint layer is fixed to another one of the wiring member and the adherend.

Abstract: A technique disclosed by this specification relates to a wiring harness unit 10 to be attached to an case 60 and including a wiring harness 30 having a plurality of coated wires 11 fixed to sheet-like base members 20 and a protector 40 including a pair of sandwiching portions for sandwiching and holding a margin portion 34 different from a part fixed to the plurality of coated wires 11 in the base members 20 and a fitting portion to be fit to a fit portion provided on the case 60 in a lateral direction and locked to the fit portion in a front-back direction.

Abstract: Provided is a wire harness routing device that includes a rail in which an insertion hole through which a wire harness is to be inserted is formed, and a slider that performs a sliding movement together with the wire harness with respect to the rail, the wire harness routing device including a harness regulating portion that is arranged along the wire harness in the insertion hole, and is configured to regulate the movement of the wire harness in a direction different from a direction of performing the sliding movement, and move in the insertion hole accompanying the sliding movement of the slider.

Abstract: A travel controller detects a non-lane zone within a predetermined distance ahead of a current position of a vehicle. The non-lane zone lacks lanes. The travel controller controls travel of the vehicle in the non-lane zone so as to keep the position of the vehicle relative to the width of a whole road. When an expected position of the vehicle at the end of the non-lane zone straddles a lane line, the travel controller controls travel of the vehicle so as to move to a lane having a larger overlap with the vehicle, prior to control of travel of the vehicle to keep the position of the vehicle relative to the width of the whole road.

Abstract: A fixing structure of a wiring member includes: a wiring member including at least one wire-like transmission member; a heat generation layer provided to surround a periphery of the wiring member; an adherend to which the wiring member is fixed; and a joint layer provided on at least a portion between the heat generation layer and the adherend and a portion between the heat generation layer and the wiring member, wherein the heat generation layer is a layer which can generate heat by induction heating, the joint layer is a layer having bond properties by heat transmitted from the heat generation layer at a time of induction heating, and is joined to the heat generation layer and at least one of the adherend and the wiring member.

Abstract: A wire harness routing apparatus includes a case and a wire harness accommodated in the case. An axial portion is provided inside the case, and the wire harness is wound around the axial portion, and the wire harness includes at least one wire and a protective member that protects the wire. The protective member includes an insertion path through which the wire is inserted, and the insertion path is formed between a sheet-shaped base sheet and a sheet-shaped cover sheet that overlaps the base sheet, and the protective member includes joining portions where the base sheet and the cover sheet are joined together at both lateral edges of the insertion path.

Abstract: The wire harness 11 disclosed by the present specification includes: a sheet-shaped base member 12; and a plurality of covered electric wires W fixed side by side along the base member 12, in which the transverse cross-sectional area of at least one of the plurality of covered electric wires W is different from the transverse cross-sectional area of another covered electric wire W, and the thickness of the covered electric wire W is substantially the same as the thickness of the covered electric wire W adjacent thereto.

Abstract: A semiconductor wafer evaluation method includes acquiring a reflection image as a bright-field image by receiving reflected light which is obtained when irradiating one surface side of a semiconductor wafer to be evaluated with light; acquiring a scattered image as a dark-field image by receiving scattered light which is obtained when irradiating the surface side of the semiconductor wafer with light; and obtaining a distance between a bright zone that is observed in the reflection image and a bright zone that is observed in the scattered image. The semiconductor wafer to be evaluated is a semiconductor wafer in which a chamfered surface is formed in a wafer outer peripheral edge section, and the method includes evaluating a shape of a boundary part between a main surface on the surface side irradiated with the light of the semiconductor wafer to be evaluated and a chamfered surface adjacent to the main surface.

Abstract: A route selection device includes a processor configured to identify a position of a lane on which a vehicle is traveling; search for candidate partial routes leading from a current position of the vehicle to a waypoint on a route leading from a start point to a destination, the waypoint being located between the current position and the destination; determine a lane change location where a lane change will be made for each of the candidate partial routes found by searching; and select, as a partial route, a candidate partial route having a minimum total score regarding the lane change location from the candidate partial routes found by searching. The score is weighted depending on the position of the determined lane change location or whether a lane change at the lane change location can be controlled by a travel controller.

Abstract: A multicore cable includes a plurality of covered wires having a lubricant powder provided on surfaces thereof, and an outer sheath layer covering outer surfaces of the plurality of covered wires. The outer surfaces of the plurality of covered wires, and the outer sheath layer, make contact with one another via the lubricant powder. A coverage of the outer surfaces of the plurality of covered wires by the lubricant powder is greater than or equal to 15%.

Abstract: A cable includes a core including a plurality of electrical wires and a first resin layer configured to cover the core. The plurality of electrical wires is twisted together. The first resin layer includes a resin material and a filler. The content of the filler in the first resin layer is 10% by mass or more and 40% by mass or less. The filler is a chemical substance produced from a biological material.

Abstract: A screen is attached to the saddle riding vehicle to face forward with respect to the saddle-riding vehicle, and permits passage of incoming air while preventing passage of foreign objects. The screen includes: a plurality of vertical fins extending in a vertical direction and arranged next to one another in a vehicle widthwise direction; and a lower fin connecting lower ends of the vertical fins and inclined downward towards a front. A first vertical fin located in an outermost position has a lower portion extending in an inwardly inclined manner in the vehicle widthwise direction towards a lower end thereof, and a front end portion extending in a downwardly inclined manner towards an outer end of the lower fin in the vehicle widthwise direction. The lower end of the first vertical fin and the outer end of the lower fin are connected by a connecting part.

Abstract: A multicore cable includes a plurality of covered wires having a lubricant powder provided on surfaces thereof, and an outer sheath layer covering outer surfaces of the plurality of covered wires. The outer surfaces of the plurality of covered wires, and the outer sheath layer, make contact with one another via the lubricant powder. A coverage of the outer surfaces of the plurality of covered wires by the lubricant powder is greater than or equal to 15%.

Abstract: A fixing structure of a wiring member includes: a wiring member including at least one wire-like transmission member; a joint member including an adhesive layer, a heat generation layer, and a joint layer; and an adherend to which the wiring member is fixed, wherein the heat generation layer is a layer which can generate heat by induction heating and is provided between the adhesive layer and the joint layer, the joint layer is a layer having bond properties when heat is transmitted from the heat generation layer at a time of induction heating, the adhesive layer is fixed to one of the wiring member and the adherend, and the joint layer is fixed to another one of the wiring member and the adherend.

Abstract: A fixing structure of a wiring member includes: a wiring member including at least one wire-like transmission member; a heat generation layer provided to surround a periphery of the wiring member; an adherend to which the wiring member is fixed; and a joint layer provided on at least a portion between the heat generation layer and the adherend and a portion between the heat generation layer and the wiring member, wherein the heat generation layer is a layer which can generate heat by induction heating, the joint layer is a layer having bond properties by heat transmitted from the heat generation layer at a time of induction heating, and is joined to the heat generation layer and at least one of the adherend and the wiring member.

Abstract: A wire harness routing apparatus includes a case and a wire harness accommodated in the case. An axial portion is provided inside the case, and the wire harness is wound around the axial portion, and the wire harness includes at least one wire and a protective member that protects the wire. The protective member includes an insertion path through which the wire is inserted, and the insertion path is formed between a sheet-shaped base sheet and a sheet-shaped cover sheet that overlaps the base sheet, and the protective member includes joining portions where the base sheet and the cover sheet are joined together at both lateral edges of the insertion path.

Abstract: A method of manufacturing a wiring member equipped-adherend includes: a step (a) providing at least one heat generation body generating heat by induction heating between a wiring member including at least one wire-like transmission member and a fixation surface of an adherend; a step (b) providing a magnetic field generation source on a side of the adherend with respect to the wiring member; a step (c) generating a magnetic field fluctuating by the magnetic field generation source; a step (d) making the heat generation body generate heat by induction heating caused by the magnetic field fluctuating by the magnetic field generation source; and a step (e) fixing the wiring member to the fixation surface of the adherend by heat generation in the heat generation body.