Abstract: A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose lower surface forming an outer surface, a protruding portion disposed in the recess, a light emitting element mounted in the recess and electrically connected to the conductive member, and a sealing member disposed in the recess to cover the light emitting element. The base body has a bottom portion and a side wall portion integrally formed of a resin, an inner surface of the side wall portion is the side wall defining the recess and has a curved portion, and the protruding portion is disposed in close vicinity to the curved surface. With this arrangement, a thin and small-sized light emitting device excellent in light extraction efficiency and reliability can be obtained.

Abstract: A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device.

Abstract: A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose lower surface forming an outer surface, a protruding portion disposed in the recess, a light emitting element mounted in the recess and electrically connected to the conductive member, and a sealing member disposed in the recess to cover the light emitting element. The base body has a bottom portion and a side wall portion integrally formed of a resin, an inner surface of the side wall portion is the side wall defining the recess and has a curved portion, and the protruding portion is disposed in close vicinity to the curved surface. With this arrangement, a thin and small-sized light emitting device excellent in light extraction efficiency and reliability can be obtained.

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

Abstract: A wave-length conversion inorganic member can includes a base body and an inorganic particle layer on the base body. The inorganic particle layer can include particles of an inorganic wave-length conversion substance which is configured to absorb light of a first wave-length and to emit light of a second wave-length different from the first wave-length. The inorganic particle layer can include an agglomerate of a plurality of the particles. Each of the plurality of the particles are in contact with at least one of the other particles or the base body. A cover layer comprises an inorganic material, and the cover layer continuously covers a surface of the base body and surfaces of the particles. The inorganic particle layer has an interstice enclosed by the particles, or by the particles and one of the base body and the cover layer.

Abstract: A light-emitting device includes a light-emitting element on a molded part. The molded part is formed by molding and curing a thermosetting epoxy resin composition comprising (A) the reaction product of a triazine derived epoxy resin with an acid anhydride, (B) an internal parting agent having m.p. 50-90° C., (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst.

Abstract: A noise filter can reliably reject an in-phase component included in a differential signal without generating anti-resonance at a target frequency reject and, a transmission device including such a noise filter. Ends of a pair of coils are connected to a pair of transmission lines in the vicinity of the transmitting circuit, and other ends are short-circuited. The coils are magnetically coupled so that the magnetic flux is cancelled regarding the in-phase component that transmits the pair of transmission lines, and the magnetic flux is increased regarding an opposite-phase component that transmits the pair of transmission lines. A series circuit, which includes an inductor and a capacitor connected in series, is connected to the pair of coils and ground. Each value of the pair of coils, the inductor, and the capacitor is set so that a resonance frequency of the in-phase component is a target frequency.

Abstract: A light emitting device includes a substantially cuboid package and a light emitting element. The package is made up of a molded article, and first and second leads each embedded in the molded article. The first lead has a first terminal component exposed at the boundary between a first side face, a bottom face, and a rear face contiguous with the bottom face and opposite a light emission face. The second lead has a second terminal component exposed at the boundary between a second side face opposite the first side face, the bottom face, and the rear face. The first terminal component has a first terminal concavity whose opening is contiguous with the first side face, the bottom face, and the rear face. The second terminal component has a second terminal concavity whose opening is contiguous with the second side face, the bottom face, and the rear face.

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

Abstract: A shielded cable includes at least one electric wire and a shielding layer covering the electric wire, which is formed by helically winding a tape-shaped shield member. The shielding layer is formed by winding the tape-shaped shield member laminating and integrating an insulating layer and a metal layer such that one side end portions along a lengthwise direction overlap with each other to form an overlapping portion and a non-overlapping portion of the shield member. A first one side end portion forming the overlapping portion is a folding portion formed by folding the insulating layer inward, and a second one side end portion forming the non-overlapping portion is a non-folding portion that is not folded. In the overlapping portion, the metal layer at the folding portion and the metal layer at the non-folding portion are electrically connected. The shielding layer has notches formed along the second one side end portion.

Abstract: A light emitting device includes an excitation light source that emits excitation light, a wavelength conversion member, a light guide, and a light guide distal end member. The wavelength conversion member absorbs the excitation light emitted from the excitation light source, converts its wavelength, and releases light of a predetermined wavelength band. The light guide in which the center part (core) of its cross section has a refractive index that is higher than the refractive index of the peripheral portion (cladding) guides the excitation light emitted from the excitation light source to the wavelength conversion member. The light guide distal end member supports a distal end of the light guide on the wavelength conversion member side. The light guide distal end member is formed from a material that reflects the excitation light and/or the light that has undergone wavelength conversion.

Abstract: A light emitting device comprises a light emitting element and a package constituted by a molded article and a first lead and a second lead embedded in the molded article, and having a bottom face, a top face disposed opposite to the bottom face, and a light emission face connected to the bottom face and the top face. The first lead has a first terminal part exposed at the bottom face exposed at the top face. The exposed part is provided more toward the center of the package than the first terminal part.

Abstract: A lamp includes a light-emitting body that converts electric energy into light energy and a translucent glass covering the light-emitting body, wherein a phosphor layer is provided on at least inner or outer surface of the translucent glass. The phosphor layer includes a fluorescent material including a first phosphor that at least partially converts energy emitted by an excitation source, which emits ultraviolet having a wavelength of about 365 nm, to a first emission spectrum that is different from the energy, and a second phosphor that at least partially converts the first emission spectrum to a second emission spectrum. Peak wavelengths of the emission spectrum of the first and second phosphors have a relation of complementary colors so that when the light created due to the peak wavelengths of the first and second phosphors are mixed, the resulting light is in the white region.

Abstract: A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose lower surface forming an outer surface, a protruding portion disposed in the recess, a light emitting element mounted in the recess and electrically connected to the conductive member, and a sealing member disposed in the recess to cover the light emitting element. The base body has a bottom portion and a side wall portion integrally formed of a resin, an inner surface of the side wall portion is the side wall defining the recess and has a curved portion, and the protruding portion is disposed in close vicinity to the curved surface. With this arrangement, a thin and small-sized light emitting device excellent in light extraction efficiency and reliability can be obtained.

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

Abstract: To provide a phosphor containing a comparatively much red component and having high light emitting efficiency, high brightness and further high durability, the nitride phosphor is represented by the general formula LXMYN((2/3)X+(4/3)Y):R or LXMYOZN((2/3)X+(4/3)Y?(2/3)Z):R (wherein L is at least one or more selected from the Group II Elements consisting of Mg, Ca, Sr, Ba and Zn, M is at least one or more selected from the Group IV Elements in which Si is essential among C, Si and Ge, and R is at least one or more selected from the rare earth elements in which Eu is essential among Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er and Lu.); contains the another elements.

Abstract: To provide a phosphor containing a comparatively much red component and having high light emitting efficiency, high brightness and further high durability, the nitride phosphor is represented by the general formula LXMYN((2/3)X+(4/3)Y):R or LXMYOZN((2/3)X+(4/3)Y?(2/3)Z):R (wherein L is at least one or more selected from the Group II Elements consisting of Mg, Ca, Sr, Ba and Zn, M is at least one or more selected from the Group IV Elements in which Si is essential among C, Si and Ge, and R is at least one or more selected from the rare earth elements in which Eu is essential among Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er and Lu.); contains the another elements.

Abstract: A light emitting device includes a wavelength converting member for absorbing light emitted by an exciting light source and emitting light of a different wavelength. With a wavelength at which the light from the exciting light source has a maximum energy intensity denoted as a first wavelength, a wavelength at which the light from the wavelength converting member has a maximum energy intensity denoted as a second wavelength, a wavelength lying between the first and second wavelengths at which the light from the light emitting device has a minimum energy intensity denoted as a third wavelength, and 650 nm denoted as a fourth wavelength, then the light emitting device has an emission spectrum such that the proportion of the energy intensity at the first wavelength to the energy intensity at the third wavelength is in a range from 100:15 to 100:150, and the proportion of the energy intensity at the first wavelength to the energy intensity at the fourth wavelength is in a range from 100:45 to 100:200.

Abstract: A red nitride phosphor of formula (I) or (II), and two green phosphors of formulas (III) and/or (IV) are included. MwAlxSiyBzN((2/3)w+x+(4/3)y+z):Eu2+??(I) M is any of Mg, Ca, Sr and Ba, and 0.5?w?3, x=1, 0.5?y?3 and 0?z?0.5, MpSiqN((2/3)p+(4/3)q):EU2+??(II) 1.5?p?2.5 and 4.5?q?5.5, MxMgSizOaXb:Eu2+??(III) M is any of Ca, Sr, Ba, Zn and Mn, X is any of F, Cl, Br and I, and 6.5?x<8.0, 3.7?z?4.3, a=x+1+2z?b/2 and 1.0?b?1.9, SicAldOfNg:Eu2+??(IV) c+d=6, 5.0?c<6, 0<d?1.0, 0.001<f?1, 7?g<8.