Patents by Inventor Hiroyuki Ban

Hiroyuki Ban has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220396561
    Abstract: A crystal of a 1,3,5-triazine derivative or a solvate thereof, and a method for producing the same are provided. The present invention relates to a crystal of a compound represented by Formula (I) or a solvate thereof: and relates to a pharmaceutical composition containing the same. The present invention also relates to a crystal of a compound represented by Formula (I), or a solvate thereof.
    Type: Application
    Filed: September 18, 2020
    Publication date: December 15, 2022
    Applicant: Shionogi & Co., Ltd.
    Inventors: Hiroyuki KAI, Toshikatsu MAKI, Shinichi ODA, Kazunori BAN, Koichi TSUBONE, Masahiro HOSOYA, Yuki MURAKAMI
  • Patent number: 11180835
    Abstract: A steel sheet has a predetermined chemical composition, and a surface exhibits an absorption peak at which a reflectance is not less than 50% nor more than 85% in a range of wave numbers of 1200 cm?1 to 1300 cm?1 by a Fourier transform-infrared spectroscopy analysis by a reflection absorption spectrometry method, and does not exhibit an absorption peak in a range of wave numbers of 1000 cm?1 to 1100 cm?1, or exhibits an absorption peak at which a reflectance is 85% or more in the range of wave numbers of 1000 cm?1 to 1100 cm?1, wherein Ni of 3 mg/m2 to 100 mg/m2 adheres to the surface.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: November 23, 2021
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Kohei Ueda, Hiroyuki Kawata, Takayuki Kitazawa, Takeshi Yasui, Hiroyuki Ban
  • Patent number: 10874018
    Abstract: A printed wiring board includes a laminate including first conductor pads on first surface side of the laminate and second conductor pads on second surface side of the laminate, and a solder resist layer formed on the first surface side of the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has first surface on the first surface side and second surface on the second surface side on the opposite side with respect to the first surface of the laminate, and the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces exposed from the second surfaces of the laminate respectively and that the surfaces of the second conductor pads are protruding from the second surface of the laminate.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: December 22, 2020
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Hiroyuki Ban, Haiying Mei
  • Patent number: 10674604
    Abstract: A printed wiring board includes a multilayer body, a first wiring layer formed on first surface of the body and including first pads, a second wiring layer embedded into second surface of the body and including second and third pads, conductor posts formed on the third pads, and via conductors formed in the body and having diameter reducing toward the second surface of the body. Each third pad has metal foil formed thereon such that each post is formed on the foil, the second wiring layer is formed such that the second pads are positioned to connect an electronic component in central portion of the second surface of the body and the third pads are positioned to connect another board in outer edge portion of the second surface of the body, and the second pads are formed such that each second pad has exposed surface recessed from the second surface.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: June 2, 2020
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Hiroyuki Ban, Haiying Mei
  • Publication number: 20190327830
    Abstract: A printed wiring board includes a laminate including first conductor pads on first surface side of the laminate and second conductor pads on second surface side of the laminate, and a solder resist layer formed on the first surface side of the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has first surface on the first surface side and second surface on the second surface side on the opposite side with respect to the first surface of the laminate, and the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces exposed from the second surfaces of the laminate respectively and that the surfaces of the second conductor pads are protruding from the second surface of the laminate.
    Type: Application
    Filed: July 3, 2019
    Publication date: October 24, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Hiroyuki BAN, Haiying MEI
  • Publication number: 20190139877
    Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on a first surface side of the laminate and second conductor pads on a second surface side of the laminate, and a solder resist layer interposed between the support plate and the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side with respect to the first surface of the laminate, the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces recessed from the second surface of the laminate respectively.
    Type: Application
    Filed: December 28, 2018
    Publication date: May 9, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Hiroyuki BAN, Haiying MEI
  • Patent number: 10271430
    Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and first via conductors on second surface side of the laminate, and a solder resist layer interposed between the plate and the laminate and having openings formed such that the openings are exposing the first pads. The laminate has first surface on the first surface side and second surface on the second surface side on the opposite side and includes a first resin insulating layer forming the second surface of the laminate, and the first conductors are formed through the first insulating layer such that the first vias are tapering from the first surface side toward the second surface side of the laminate and have end surfaces recessed from the second surface of the laminate on the second surface side of the laminate.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: April 23, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Hiroyuki Ban, Haiying Mei
  • Patent number: 10256175
    Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on a first surface side of the laminate and second conductor pads on a second surface side of the laminate, and a solder resist layer interposed between the support plate and the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side with respect to the first surface of the laminate, the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces recessed from the second surface of the laminate respectively.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: April 9, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Hiroyuki Ban, Haiying Mei
  • Patent number: 10249561
    Abstract: A printed wiring board includes a support plate, and a build-up wiring layer including resin insulating layers and conductor layers and having a first surface and a second surface on the opposite side with respect to the first surface such that the support plate is positioned on the first surface of the build-up wiring layer. The resin insulating layers in the build-up wiring layer include a first resin insulating layer that forms the second surface of the build-up wiring layer, and the build-up wiring layer includes first conductor pads embedded in the first resin insulating layer such that each of the first conductor pads has an exposed surface exposed from the second surface of the build-up wiring layer.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: April 2, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Haiying Mei, Hiroyuki Ban
  • Publication number: 20180274069
    Abstract: A steel sheet has a predetermined chemical composition, and a surface exhibits an absorption peak at which a reflectance is not less than 50% nor more than 85% in a range of wave numbers of 1200 cm?1 to 1300 cm?1 by a Fourier transform-infrared spectroscopy analysis by a reflection absorption spectrometry method, and does not exhibit an absorption peak in a range of wave numbers of 1000 cm?1 to 1100 cm?1, or exhibits an absorption peak at which a reflectance is 85% or more in the range of wave numbers of 1000 cm?1 to 1100 cm?1, wherein Ni of 3 mg/m2 to 100 mg/m2 adheres to the surface.
    Type: Application
    Filed: September 25, 2015
    Publication date: September 27, 2018
    Applicant: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Kohei UEDA, Hiroyuki KAWATA, Takayuki KITAZAWA, Takeshi YASUI, Hiroyuki BAN
  • Patent number: 10004143
    Abstract: A printed wiring board includes a first circuit substrate having a first surface and a second surface on the opposite side, and a second circuit substrate having a third surface and a fourth surface on the opposite side such that the first circuit substrate is laminated on the third surface and that the first surface and the third surface are opposing each other. The second circuit substrate has a mounting area on the third surface and includes pads positioned to mount an electronic component in the mounting area and a connection wire structure connected to the pads, and the first circuit substrate includes through-hole conductors extending from the first surface to the second surface and connected to the pads through the connection wire structure and has an opening portion formed through the first circuit substrate such that the opening portion is exposing the pads formed in the mounting area.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: June 19, 2018
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Haiying Mei, Hiroyuki Ban
  • Patent number: 9949372
    Abstract: A printed wiring board includes a laminate, a wiring layer formed on first main surface of the laminate and including conductor pads, via conductors including first and second via conductors and formed in the laminate such that each via conductor has diameter gradually reducing from the first main surface toward second main surface of the laminate, and conductor post formed on the first via conductors such that each conductor post includes a metal foil and a plating layer formed on the metal foil. The via conductors are formed such that the first via conductors are positioned in an outer edge portion of the laminate and have minimum-diameter-side surfaces positioned to form a same plane with the second main surface of the laminate and that the second via conductors are positioned in a central portion of the laminate and have minimum-diameter-side surfaces recessed from the second main surface of the laminate.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: April 17, 2018
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Hiroyuki Ban, Haiying Mei
  • Publication number: 20180054891
    Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and second conductor pads on second surface side of the laminate, and a solder resist layer interposed between the support plate and laminate and having openings formed such that the openings are exposing the first pads. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side, and a via conductor structure penetrating from the first surface to the second surface of the laminate such that the via structure includes via conductors formed in the insulating layer and tapering from the first surface side toward second surface side of the laminate, and the second pads are protruding from the second surface of the laminate.
    Type: Application
    Filed: August 22, 2017
    Publication date: February 22, 2018
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Hiroyuki BAN, Haiying MEI
  • Publication number: 20180054890
    Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and first via conductors on second surface side of the laminate, and a solder resist layer interposed between the plate and the laminate and having openings formed such that the openings are exposing the first pads. The laminate has first surface on the first surface side and second surface on the second surface side on the opposite side and includes a first resin insulating layer forming the second surface of the laminate, and the first conductors are formed through the first insulating layer such that the first vias are tapering from the first surface side toward the second surface side of the laminate and have end surfaces recessed from the second surface of the laminate on the second surface side of the laminate.
    Type: Application
    Filed: August 22, 2017
    Publication date: February 22, 2018
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Hiroyuki BAN, Haiying MEI
  • Publication number: 20180053715
    Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on a first surface side of the laminate and second conductor pads on a second surface side of the laminate, and a solder resist layer interposed between the support plate and the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side with respect to the first surface of the laminate, the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces recessed from the second surface of the laminate respectively.
    Type: Application
    Filed: August 21, 2017
    Publication date: February 22, 2018
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Hiroyuki Ban, Haiying Mei
  • Publication number: 20180054888
    Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on a first surface side of the laminate and second conductor pads on a second surface side of the laminate, and a solder resist layer interposed between the support plate and the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side with respect to the first surface of the laminate, the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces exposed from the second surface of the laminate respectively.
    Type: Application
    Filed: August 21, 2017
    Publication date: February 22, 2018
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Hiroyuki BAN, Haiying MEI
  • Publication number: 20170317017
    Abstract: A printed wiring board includes a support plate, and a build-up wiring layer including resin insulating layers and conductor layers and having a first surface and a second surface on the opposite side with respect to the first surface such that the support plate is positioned on the first surface of the build-up wiring layer. The resin insulating layers in the build-up wiring layer include a first resin insulating layer that forms the second surface of the build-up wiring layer, and the build-up wiring layer includes first conductor pads embedded in the first resin insulating layer such that each of the first conductor pads has an exposed surface exposed from the second surface of the build-up wiring layer.
    Type: Application
    Filed: April 28, 2017
    Publication date: November 2, 2017
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Haiying MEI, Hiroyuki BAN
  • Publication number: 20170263571
    Abstract: An electronic component built-in substrate includes an insulating substrate having a through hole and an inner wall surrounding the through hole, an electronic component accommodated in the through hole of the substrate, a sealing member filling the through hole such that the sealing member is covering the electronic component in the through hole of the substrate and exposing a terminal of the electronic component on a first side of the substrate, and a shield layer structure including a first metal film and a second metal film formed such that the first metal film is formed on the inner wall of the substrate and surrounding the through hole of the substrate and that the second metal film is formed on a second side of the substrate on the opposite side with respect to the first side and covering an opening of the through hole on the second side of the substrate.
    Type: Application
    Filed: March 9, 2017
    Publication date: September 14, 2017
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Hiroyuki BAN, Kosuke IKEDA, Haiying MEI
  • Publication number: 20170245365
    Abstract: A printed wiring board includes a laminate, a wiring layer formed on first main surface of the laminate and including conductor pads, via conductors including first and second via conductors and formed in the laminate such that each via conductor has diameter gradually reducing from the first main surface toward second main surface of the laminate, and conductor post formed on the first via conductors such that each conductor post includes a metal foil and a plating layer formed on the metal foil. The via conductors are formed such that the first via conductors are positioned in an outer edge portion of the laminate and have minimum-diameter-side surfaces positioned to form a same plane with the second main surface of the laminate and that the second via conductors are positioned in a central portion of the laminate and have minimum-diameter-side surfaces recessed from the second main surface of the laminate.
    Type: Application
    Filed: February 24, 2017
    Publication date: August 24, 2017
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Hiroyuki BAN, Haiying MEI
  • Patent number: 9713802
    Abstract: The present invention provides microsphere manufacturing method and apparatus capable of stable obtaining microspheres of a desired size and reducing facility cost. According to the method and the apparatus, to manufacture microspheres made of a second liquid in a first liquid, the first liquid is supplied into a first channel to flow therein and the second liquid is supplied to an intermediate part of the first channel through a second channel. The supply velocities of the first and second liquids are set such that the second liquid closes the first channel and the closing part of the second liquid is cut off due to a pressure difference between an upstream side and a downstream side to form microspheres.
    Type: Grant
    Filed: May 28, 2009
    Date of Patent: July 25, 2017
    Assignee: Kobe Steel, Ltd.
    Inventors: Hiroyuki Ban, Koji Noishiki, Kazuto Okada, Seiichi Yamamoto