Patents by Inventor Hiroyuki Harada

Hiroyuki Harada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10748688
    Abstract: A soft magnetic alloy including a composition having a formula of ((Fe(1?(?+?))X1?X2?)(1?(a+b+d+e))MaBbCrdCue)1?fCf. X1 is one or more elements selected from a group of Co and Ni. X2 is one or more elements selected from a group of W, Al, Mn, Ag, Zn, Sn, As, Sb, Bi, N, O, and rare earth elements. M is one or more elements selected from a group of Nb, Hf, Zr, Ta, Ti, Mo, and V. 0.030?a?0.14, 0.028?b?0.15, 0.005?d?0.020, 0<e?0.030, 0?f?0.040, ??0, ??0, and 0??+??0.50 are satisfied.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: August 18, 2020
    Assignee: TDK CORPORATION
    Inventors: Akihiro Harada, Hiroyuki Matsumoto, Kenji Horino, Kazuhiro Yoshidome, Akito Hasegawa, Hajime Amano, Kensuke Ara, Masahito Koeda, Seigo Tokoro
  • Patent number: 10727145
    Abstract: A semiconductor device including: an insulating substrate having a conductor layer on the upper face and the lower face and a semiconductor element mounted on the upper conductor layer; a base plate bonded to the lower conductor layer; a case member surrounding the insulating substrate and bonded to the surface of the base plate to which the conductor layer bonded to the lower face; a first filler being a silicone composition filled in a region surrounded by the base plate and the case member; and a second filler being injected into a region below the first filler and surrounding a peripheral edge portion of the insulating substrate, whose height from the base plate is higher than the upper face and is lower than a bonding face between the semiconductor element and the upper conductor layer.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: July 28, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hiroyuki Harada, Kozo Harada, Hiroki Shiota, Yoshihiro Yamaguchi, Koji Yamada
  • Publication number: 20200231085
    Abstract: Information related to a vehicle can be displayed by projecting an image based on the information on a road surface or the like. An image projection apparatus that projects an image includes: an acquisition unit that acquires information to be displayed; and an image projection unit that projects the image based on the information to be displayed acquired by the acquisition unit.
    Type: Application
    Filed: April 1, 2020
    Publication date: July 23, 2020
    Inventors: Yasuhiko KUNII, Nobuyuki KAKU, Toshinori SUGIYAMA, Hiroyuki NAKAMURA, Hiroshi CHIBA, Masahiro KISHIGAMI, Hiroyuki KAJIKAWA, Chohei ONO, Megumi KURACHI, Noriaki HARADA
  • Patent number: 10720368
    Abstract: A semiconductor device includes: an insulating substrate having an upper surface on which a semiconductor element is mounted; a base plate joined to a lower surface of the insulating substrate; a case member that surrounds the insulating substrate and that is in contact with a surface of the base plate to which the insulating substrate is joined; a sealing resin provided in a region surrounded by the base plate and the case member; a cover member facing a surface of the sealing resin and fixed to the case member; and a holding plate, a lower surface of the holding plate and a portion of a side surface of the holding plate being in close contact with the surface of the sealing resin, an upper surface of the holding plate being fixed to and protruding from a surface of the cover member facing the surface of the sealing resin.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: July 21, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hiroyuki Harada, Kozo Harada, Yasumichi Hatanaka, Takashi Nishimura, Masaki Taya
  • Publication number: 20200194324
    Abstract: An object of the present invention is to suppress a crack in a sealing resin and a warpage in a semiconductor device in a power semiconductor device. A power semiconductor device includes: a semiconductor element; a terminal; a chassis; and a sealing resin sealing the semiconductor element and the terminal in the chassis. The sealing resin includes: a first sealing resin covering at least the semiconductor element; and a second sealing resin formed on an upper portion of the first sealing resin, and in an operation temperature of the semiconductor element, the first sealing resin has a smaller linear expansion coefficient than the second sealing resin, and a difference of a linear expansion coefficient between the first sealing resin and the terminal is smaller than a difference of a linear expansion coefficient between the second sealing resin and the terminal.
    Type: Application
    Filed: August 25, 2017
    Publication date: June 18, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Taishi SASAKI, Yuki YOSHIOKA, Hiroyuki HARADA, Yusuke KAJI
  • Publication number: 20200187104
    Abstract: A terminal is disclosed that includes a receiver that receives, in a first cell, information indicating a measurement object including information regarding a parameter of a discovery or measurement signal. The terminal also includes a processor that performs a measurement using the discovery or measurement signal based on the information indicating the measurement object and a transmitter that transmits a result of the measurement, where when the information indicating the measurement object designates a timing that is synchronous with the first cell, the processor performs the measurement in a second cell based on the timing that is synchronous with the first cell. In other aspects, a radio communication method and a base station are also disclosed.
    Type: Application
    Filed: February 18, 2020
    Publication date: June 11, 2020
    Applicant: NTT DOCOMO, INC.
    Inventors: Hiroki Harada, Kazuaki Takeda, Satoshi Nagata, Hiroyuki Ishii
  • Publication number: 20200176366
    Abstract: A semiconductor device includes: semiconductor elements and; a lead frame including a mount having an upper surface over which the semiconductor elements and are mounted; a sealing resin sealing the lead frame and the semiconductor elements and so that outer leads and of the lead frame protrude outwardly; and a resin wall located on an inner lead between the outer lead and the mount of the lead frame. A vertical thickness of the resin wall is greater than a vertical thickness from a lower surface of the sealing resin to a lower end of the lead frame.
    Type: Application
    Filed: October 2, 2019
    Publication date: June 4, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hiroyuki HARADA, Akira KOSUGI, Takamasa IWAI
  • Patent number: 10666860
    Abstract: An image processor includes a first converter to convert input images into images in a different coordinate system from that of the input images according to first conversion data based on a projection model, a position detector to detect a connecting position of the images converted by the converter, a corrector to correct the first conversion data on the basis of a result of the detection by the position detector, and a data generator to generate second conversion data for image synthesis from the conversion data corrected by the corrector on the basis of coordinate conversion, the second conversion data defining the conversion of the input images.
    Type: Grant
    Filed: September 10, 2013
    Date of Patent: May 26, 2020
    Assignee: RICOH COMPANY, LTD.
    Inventors: Hirokazu Takenaka, Noriyuki Terao, Yoshiaki Irino, Tomonori Tanaka, Nozomi Imae, Toru Harada, Hideaki Yamamoto, Kensuke Masuda, Yoichi Ito, Satoshi Sawaguchi, Daisuke Bessho, Hiroyuki Satoh, Makoto Shohara, Shusaku Takasu
  • Patent number: 10658284
    Abstract: Herein provided are: a ceramic board; a semiconductor element for electric power, on one surface of which an electrode is formed, and the other surface of which is bonded to the ceramic board; a lead terminal, one end side of which is bonded to the electrode, and the other end side of which is to be electrically connected to an outside thereof; and a sealing member by which the semiconductor element for electric power is sealed together with a part, in the lead terminal, bonded to the electrode; wherein, near an end in said one end side of the lead terminal, an inclined surface is formed which becomes farther from the circuit board as it becomes closer to the end.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: May 19, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Junji Fujino, Mikio Ishihara, Masayoshi Shinkai, Hiroyuki Harada
  • Patent number: 10649185
    Abstract: An optical system includes a central portion having a magnification per unit angle of view which increases from a center to an outside at an increase rate and a circumferential portion being outside the central portion and having a magnification per unit of view which increases from the central portion to an outside at an increase rate smaller than the increase rate of the central portion.
    Type: Grant
    Filed: January 4, 2016
    Date of Patent: May 12, 2020
    Assignee: RICOH COMPANY, LTD.
    Inventors: Kensuke Masuda, Noriyuki Terao, Yoshiaki Irino, Tomonori Tanaka, Nozomi Imae, Toru Harada, Hirokazu Takenaka, Hideaki Yamamoto, Satoshi Sawaguchi, Hiroyuki Satoh
  • Patent number: 10647248
    Abstract: Information related to a vehicle can be displayed by projecting an image based on the information on a road surface or the like. An image projection apparatus that projects an image includes: an acquisition unit that acquires information to be displayed; and an image projection unit that projects the image based on the information to be displayed acquired by the acquisition unit.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: May 12, 2020
    Assignee: MAXELL, LTD.
    Inventors: Yasuhiko Kunii, Nobuyuki Kaku, Toshinori Sugiyama, Hiroyuki Nakamura, Hiroshi Chiba, Masahiro Kishigami, Hiroyuki Kajikawa, Chohei Ono, Megumi Kurachi, Noriaki Harada
  • Publication number: 20200138636
    Abstract: A absorbent member manufacturing method of the invention is a method for manufacturing an absorbent member (100) including synthetic fibers (10b). The method involves: a transporting step of transporting a plurality of sheet fragments (10bh) including synthetic fibers (10b) to an accumulating depression (41) by using a duct 3; an accumulating step of accumulating, in the accumulating depression (41), the plurality of sheet fragments (10bh) transported in the transporting step, and forming an accumulation (100a?) which is a constituent member of the absorbent member (100); and a pressing step of pressing the accumulation (100a?) over its entirety in the thickness direction.
    Type: Application
    Filed: October 3, 2017
    Publication date: May 7, 2020
    Applicant: KAO CORPORATION
    Inventors: Tomoyuki MOTEGI, Yuki KATO, Ryuji MATSUNAGA, Takuaki HARADA, Hiroyuki IWASA
  • Publication number: 20200138637
    Abstract: An absorbent member manufacturing method of the present invention is a method for manufacturing an absorbent member (100) for an absorbent article and including synthetic fibers (10b) and hydrophilic fibers (10a). The method involves: a transporting step of transporting the hydrophilic fibers (10a) and a plurality of sheet fragments (10bh) to an accumulating depression (41) by using a duct (3); an accumulating step of accumulating, in the accumulating depression (41), the plurality of sheet fragments (10bh) and the hydrophilic fibers (10a), and obtaining an accumulation (100a) which is a constituent member of the absorbent member (100); and a depression forming step of forming a depression (100e) in the accumulation (100a) by applying pressure to a portion thereof.
    Type: Application
    Filed: November 28, 2017
    Publication date: May 7, 2020
    Applicant: Kao Corporation
    Inventors: Yuki KATO, Ryuji MATSUNAGA, Takuaki HARADA, Tomoyuki MOTEGI, Hiroyuki IWASA
  • Publication number: 20200117870
    Abstract: An image processing apparatus includes a visible code area searching unit and a color replacement processing unit. The visible code area searching unit searches for a visible code area in a color document image corresponding to a document, and the visible code area includes a visible code. The color replacement processing unit (a) generates as a local color histogram a color histogram of the visible code area in a predetermined color space and determines whether removal of a stain image should be performed or not on the basis of a ratio of a pixel classified into a bin that includes a color of the stain image in the local color histogram, and (b) replaces the color of the stain image in the visible code area with a background color of the document if it is determined that the removal of the stain image should be performed.
    Type: Application
    Filed: October 11, 2019
    Publication date: April 16, 2020
    Inventor: Hiroyuki Harada
  • Publication number: 20200098701
    Abstract: A semiconductor chip (6) is disposed on the insulation substrate (2). A lead frame (8) is bonded to an upper surface of the semiconductor chip (6). A sealing resin (12) covers the semiconductor chip (6), the insulation substrate (2), and the lead frame (8). A stress mitigation resin (13) having a lower elastic modulus than that of the sealing resin (12) is partially applied to an end of the lead frame (8).
    Type: Application
    Filed: February 9, 2017
    Publication date: March 26, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hiroyuki HARADA, Naoki YOSHIMATSU, Osamu USUI, Yuji IMOTO, Yuki YOSHIOKA
  • Publication number: 20200036848
    Abstract: A reading device (100) includes a reading section (143), a casing (160), a cover section (110), a conveyance section (130), an interposed member (170), a controller (153), a cable (180), and a linking member (190). The casing (160) houses the reading section (143) therein. It is possible to place the cover section (110) on the casing (160). The conveyance section (130) is housed in the cover section (110) and conveys a sheet. The interposed member (170) is interposed between the cover section (110) and the casing (160). The controller (153) is housed in the casing (160) and controls the conveyance section (130). The cable (180) is connected to the controller (153), is also connected to the conveyance section (130), and transfers a control signal output by the controller (153) to the conveyance section (130). The linking member (190) is linked to the cover section (110) and is also linked to the casing (160).
    Type: Application
    Filed: October 24, 2018
    Publication date: January 30, 2020
    Applicant: KYOCERA Document Solutions Inc.
    Inventor: Hiroyuki HARADA
  • Publication number: 20200028031
    Abstract: A synthetic quartz glass cavity member (1) is bonded to a substrate (6) having an optical device (7) mounted thereon such that the device may be accommodated in the cavity member. The cavity member (1) has an inside surface consisting of a top surface (2a) opposed to the device (7) and a side surface (3a). The top surface (2a) is a mirror surface and the side surface (3a) is a rough surface.
    Type: Application
    Filed: July 22, 2019
    Publication date: January 23, 2020
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Harunobu Matsui, Daijitsu Harada, Daiyu OKAFUJI, Hiroyuki YAMAZAKI, Masaki TAKEUCHI
  • Patent number: 10535455
    Abstract: A soft magnetic alloy including a main component having a compositional formula of (Fe(1?(?+?))X1?X2?)(1?(a+b+c))MaBbPc, and a sub component including at least C, S and Ti, wherein X1 is one or more selected from the group including Co and Ni, X2 is one or more selected from the group including Al, Mn, Ag, Zn, Sn, As, Sb, Bi, and rare earth elements, “M” is one or more selected from the group including Nb, Hf, Zr, Ta, Mo, W, and V, 0.020?a?0.14, 0.020?b?0.20, 0?c?0.040, ??0, ??0, and 0??+??0.50 are satisfied, when entire said soft magnetic alloy is 100 wt %, a content of said C is 0.001 to 0.050 wt %, a content of said S is 0.001 to 0.050 wt %, and a content of said Ti is 0.001 to 0.080 wt %, and when a value obtained by dividing the content of said C by the content of said S is C/S, then C/S satisfies 0.10?C/S?10.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: January 14, 2020
    Assignee: TDK CORPORATION
    Inventors: Akihiro Harada, Hiroyuki Matsumoto, Kenji Horino, Kazuhiro Yoshidome, Akito Hasegawa, Hajime Amano, Kensuke Ara, Seigo Tokoro, Shota Otsuka
  • Patent number: 10514183
    Abstract: An exhaust gas latent-heat recovery device includes: a heat transfer tube disposed inside a duct through which exhaust gas flows, the heat transfer tube having a water supply inlet into which water to be heated for recovering latent heat of the exhaust gas is supplied and a water supply outlet through which the water to be heated is discharged; and a water supply control part configured to control supply of the water to be heated to the water supply inlet. The water supply control part is configured to control supply of the water to be heated from the water supply inlet so that an outlet temperature being a temperature of the water to be heated at the water supply outlet is at a set temperature.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: December 24, 2019
    Assignee: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
    Inventors: Naoki Koumoto, Tomohiro Harada, Hiroyuki Yagita, Akitoshi Sugiyama, Tarou Ichihara, Kimio Konno, Yukimitsu Sasaki
  • Publication number: 20190378810
    Abstract: An object of the present invention is to provide a highly reliable semiconductor device that allows voids remaining in a bonding material to be reduced. The semiconductor device includes a semiconductor chip, an insulation substrate, a metal base plate, a resin section, and a bump. The semiconductor chip is warped into a concave shape. On the insulation substrate, the semiconductor chip is mounted by bonding. The metal base plate has the insulation substrate mounted thereon and has a heat dissipation property. The resin section seals the insulation substrate and the semiconductor chip. The bump is disposed in a joint between the semiconductor chip and the insulation substrate. A warp amount of the semiconductor chip warped into a concave shape is equal to or greater than 1 ?m and less than a height of the bump.
    Type: Application
    Filed: November 21, 2016
    Publication date: December 12, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yuki YOSHIOKA, Taishi SASAKI, Hiroyuki HARADA