Abstract: A soft magnetic alloy including a composition having a formula of ((Fe(1?(?+?))X1?X2?)(1?(a+b+d+e))MaBbCrdCue)1?fCf. X1 is one or more elements selected from a group of Co and Ni. X2 is one or more elements selected from a group of W, Al, Mn, Ag, Zn, Sn, As, Sb, Bi, N, O, and rare earth elements. M is one or more elements selected from a group of Nb, Hf, Zr, Ta, Ti, Mo, and V. 0.030?a?0.14, 0.028?b?0.15, 0.005?d?0.020, 0<e?0.030, 0?f?0.040, ??0, ??0, and 0??+??0.50 are satisfied.

Abstract: A semiconductor device including: an insulating substrate having a conductor layer on the upper face and the lower face and a semiconductor element mounted on the upper conductor layer; a base plate bonded to the lower conductor layer; a case member surrounding the insulating substrate and bonded to the surface of the base plate to which the conductor layer bonded to the lower face; a first filler being a silicone composition filled in a region surrounded by the base plate and the case member; and a second filler being injected into a region below the first filler and surrounding a peripheral edge portion of the insulating substrate, whose height from the base plate is higher than the upper face and is lower than a bonding face between the semiconductor element and the upper conductor layer.

Abstract: Information related to a vehicle can be displayed by projecting an image based on the information on a road surface or the like. An image projection apparatus that projects an image includes: an acquisition unit that acquires information to be displayed; and an image projection unit that projects the image based on the information to be displayed acquired by the acquisition unit.

Abstract: A semiconductor device includes: an insulating substrate having an upper surface on which a semiconductor element is mounted; a base plate joined to a lower surface of the insulating substrate; a case member that surrounds the insulating substrate and that is in contact with a surface of the base plate to which the insulating substrate is joined; a sealing resin provided in a region surrounded by the base plate and the case member; a cover member facing a surface of the sealing resin and fixed to the case member; and a holding plate, a lower surface of the holding plate and a portion of a side surface of the holding plate being in close contact with the surface of the sealing resin, an upper surface of the holding plate being fixed to and protruding from a surface of the cover member facing the surface of the sealing resin.

Abstract: An object of the present invention is to suppress a crack in a sealing resin and a warpage in a semiconductor device in a power semiconductor device. A power semiconductor device includes: a semiconductor element; a terminal; a chassis; and a sealing resin sealing the semiconductor element and the terminal in the chassis. The sealing resin includes: a first sealing resin covering at least the semiconductor element; and a second sealing resin formed on an upper portion of the first sealing resin, and in an operation temperature of the semiconductor element, the first sealing resin has a smaller linear expansion coefficient than the second sealing resin, and a difference of a linear expansion coefficient between the first sealing resin and the terminal is smaller than a difference of a linear expansion coefficient between the second sealing resin and the terminal.

Abstract: A terminal is disclosed that includes a receiver that receives, in a first cell, information indicating a measurement object including information regarding a parameter of a discovery or measurement signal. The terminal also includes a processor that performs a measurement using the discovery or measurement signal based on the information indicating the measurement object and a transmitter that transmits a result of the measurement, where when the information indicating the measurement object designates a timing that is synchronous with the first cell, the processor performs the measurement in a second cell based on the timing that is synchronous with the first cell. In other aspects, a radio communication method and a base station are also disclosed.

Abstract: A semiconductor device includes: semiconductor elements and; a lead frame including a mount having an upper surface over which the semiconductor elements and are mounted; a sealing resin sealing the lead frame and the semiconductor elements and so that outer leads and of the lead frame protrude outwardly; and a resin wall located on an inner lead between the outer lead and the mount of the lead frame. A vertical thickness of the resin wall is greater than a vertical thickness from a lower surface of the sealing resin to a lower end of the lead frame.

Abstract: An image processor includes a first converter to convert input images into images in a different coordinate system from that of the input images according to first conversion data based on a projection model, a position detector to detect a connecting position of the images converted by the converter, a corrector to correct the first conversion data on the basis of a result of the detection by the position detector, and a data generator to generate second conversion data for image synthesis from the conversion data corrected by the corrector on the basis of coordinate conversion, the second conversion data defining the conversion of the input images.

Abstract: Herein provided are: a ceramic board; a semiconductor element for electric power, on one surface of which an electrode is formed, and the other surface of which is bonded to the ceramic board; a lead terminal, one end side of which is bonded to the electrode, and the other end side of which is to be electrically connected to an outside thereof; and a sealing member by which the semiconductor element for electric power is sealed together with a part, in the lead terminal, bonded to the electrode; wherein, near an end in said one end side of the lead terminal, an inclined surface is formed which becomes farther from the circuit board as it becomes closer to the end.

Abstract: An optical system includes a central portion having a magnification per unit angle of view which increases from a center to an outside at an increase rate and a circumferential portion being outside the central portion and having a magnification per unit of view which increases from the central portion to an outside at an increase rate smaller than the increase rate of the central portion.

Abstract: Information related to a vehicle can be displayed by projecting an image based on the information on a road surface or the like. An image projection apparatus that projects an image includes: an acquisition unit that acquires information to be displayed; and an image projection unit that projects the image based on the information to be displayed acquired by the acquisition unit.

Abstract: A absorbent member manufacturing method of the invention is a method for manufacturing an absorbent member (100) including synthetic fibers (10b). The method involves: a transporting step of transporting a plurality of sheet fragments (10bh) including synthetic fibers (10b) to an accumulating depression (41) by using a duct 3; an accumulating step of accumulating, in the accumulating depression (41), the plurality of sheet fragments (10bh) transported in the transporting step, and forming an accumulation (100a?) which is a constituent member of the absorbent member (100); and a pressing step of pressing the accumulation (100a?) over its entirety in the thickness direction.

Abstract: An absorbent member manufacturing method of the present invention is a method for manufacturing an absorbent member (100) for an absorbent article and including synthetic fibers (10b) and hydrophilic fibers (10a). The method involves: a transporting step of transporting the hydrophilic fibers (10a) and a plurality of sheet fragments (10bh) to an accumulating depression (41) by using a duct (3); an accumulating step of accumulating, in the accumulating depression (41), the plurality of sheet fragments (10bh) and the hydrophilic fibers (10a), and obtaining an accumulation (100a) which is a constituent member of the absorbent member (100); and a depression forming step of forming a depression (100e) in the accumulation (100a) by applying pressure to a portion thereof.

Abstract: An image processing apparatus includes a visible code area searching unit and a color replacement processing unit. The visible code area searching unit searches for a visible code area in a color document image corresponding to a document, and the visible code area includes a visible code. The color replacement processing unit (a) generates as a local color histogram a color histogram of the visible code area in a predetermined color space and determines whether removal of a stain image should be performed or not on the basis of a ratio of a pixel classified into a bin that includes a color of the stain image in the local color histogram, and (b) replaces the color of the stain image in the visible code area with a background color of the document if it is determined that the removal of the stain image should be performed.

Abstract: A semiconductor chip (6) is disposed on the insulation substrate (2). A lead frame (8) is bonded to an upper surface of the semiconductor chip (6). A sealing resin (12) covers the semiconductor chip (6), the insulation substrate (2), and the lead frame (8). A stress mitigation resin (13) having a lower elastic modulus than that of the sealing resin (12) is partially applied to an end of the lead frame (8).

Abstract: A reading device (100) includes a reading section (143), a casing (160), a cover section (110), a conveyance section (130), an interposed member (170), a controller (153), a cable (180), and a linking member (190). The casing (160) houses the reading section (143) therein. It is possible to place the cover section (110) on the casing (160). The conveyance section (130) is housed in the cover section (110) and conveys a sheet. The interposed member (170) is interposed between the cover section (110) and the casing (160). The controller (153) is housed in the casing (160) and controls the conveyance section (130). The cable (180) is connected to the controller (153), is also connected to the conveyance section (130), and transfers a control signal output by the controller (153) to the conveyance section (130). The linking member (190) is linked to the cover section (110) and is also linked to the casing (160).

Abstract: A synthetic quartz glass cavity member (1) is bonded to a substrate (6) having an optical device (7) mounted thereon such that the device may be accommodated in the cavity member. The cavity member (1) has an inside surface consisting of a top surface (2a) opposed to the device (7) and a side surface (3a). The top surface (2a) is a mirror surface and the side surface (3a) is a rough surface.

Abstract: A soft magnetic alloy including a main component having a compositional formula of (Fe(1?(?+?))X1?X2?)(1?(a+b+c))MaBbPc, and a sub component including at least C, S and Ti, wherein X1 is one or more selected from the group including Co and Ni, X2 is one or more selected from the group including Al, Mn, Ag, Zn, Sn, As, Sb, Bi, and rare earth elements, “M” is one or more selected from the group including Nb, Hf, Zr, Ta, Mo, W, and V, 0.020?a?0.14, 0.020?b?0.20, 0?c?0.040, ??0, ??0, and 0??+??0.50 are satisfied, when entire said soft magnetic alloy is 100 wt %, a content of said C is 0.001 to 0.050 wt %, a content of said S is 0.001 to 0.050 wt %, and a content of said Ti is 0.001 to 0.080 wt %, and when a value obtained by dividing the content of said C by the content of said S is C/S, then C/S satisfies 0.10?C/S?10.

Abstract: An exhaust gas latent-heat recovery device includes: a heat transfer tube disposed inside a duct through which exhaust gas flows, the heat transfer tube having a water supply inlet into which water to be heated for recovering latent heat of the exhaust gas is supplied and a water supply outlet through which the water to be heated is discharged; and a water supply control part configured to control supply of the water to be heated to the water supply inlet. The water supply control part is configured to control supply of the water to be heated from the water supply inlet so that an outlet temperature being a temperature of the water to be heated at the water supply outlet is at a set temperature.

Abstract: An object of the present invention is to provide a highly reliable semiconductor device that allows voids remaining in a bonding material to be reduced. The semiconductor device includes a semiconductor chip, an insulation substrate, a metal base plate, a resin section, and a bump. The semiconductor chip is warped into a concave shape. On the insulation substrate, the semiconductor chip is mounted by bonding. The metal base plate has the insulation substrate mounted thereon and has a heat dissipation property. The resin section seals the insulation substrate and the semiconductor chip. The bump is disposed in a joint between the semiconductor chip and the insulation substrate. A warp amount of the semiconductor chip warped into a concave shape is equal to or greater than 1 ?m and less than a height of the bump.