Patents by Inventor Hiroyuki Kawashima
Hiroyuki Kawashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10253426Abstract: A method for manufacturing a diamond substrate, including: a first step of preparing patterned diamond on a foundation surface, a second step of growing diamond from the patterned diamond prepared in the first step to form the diamond in a pattern gap of the patterned diamond prepared in the first step, a third step of removing the patterned diamond prepared in the first step to form a patterned diamond composed of the diamond formed in the second step, and a fourth step of growing diamond from the patterned diamond formed in the third step to form the diamond in a pattern gap of the patterned diamond formed in the third step. There can be provided a method for manufacturing a diamond substrate which can sufficiently suppress dislocation defects, a high-quality diamond substrate, and a freestanding diamond substrate.Type: GrantFiled: February 28, 2017Date of Patent: April 9, 2019Assignees: SHIN-ETSU CHEMICAL CO., LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITYInventors: Hitoshi Noguchi, Shozo Shirai, Toshiharu Makino, Masahiko Ogura, Hiromitsu Kato, Hiroyuki Kawashima, Daisuke Kuwabara, Satoshi Yamasaki, Daisuke Takeuchi, Norio Tokuda, Takao Inokuma, Tsubasa Matsumoto
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Publication number: 20190093253Abstract: A method for manufacturing a diamond substrate, including: a first step of preparing patterned diamond on a foundation surface, a second step of growing diamond from the patterned diamond prepared in the first step to form the diamond in a pattern gap of the patterned diamond prepared in the first step, a third step of removing the patterned diamond prepared in the first step to form a patterned diamond composed of the diamond formed in the second step, and a fourth step of growing diamond from the patterned diamond formed in the third step to form the diamond in a pattern gap of the patterned diamond formed in the third step. There can be provided a method for manufacturing a diamond substrate which can sufficiently suppress dislocation defects, a high-quality diamond substrate, and a freestanding diamond substrate.Type: ApplicationFiled: November 2, 2018Publication date: March 28, 2019Applicants: SHIN-ETSU CHEMICAL CO., LTD., National Institute of Advanced Industrial Science and Technology, NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITInventors: Hitoshi NOGUCHI, Shozo SHIRAI, Toshiharu MAKINO, Masahiko OGURA, Hiromitsu KATO, Hiroyuki KAWASHIMA, Daisuke KUWABARA, Satoshi YAMASAKI, Daisuke TAKEUCHI, Norio TOKUDA, Takao INOKUMA, Tsubasa MATSUMOTO
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Patent number: 10100435Abstract: The present invention provides a method for manufacturing a diamond substrate, including: a first step of preparing patterned diamond on a foundation surface, a second step of removing a foreign substance adhered on a wall of the patterned diamond prepared in the first step, and a third step of growing diamond from the patterned diamond prepared in the first step to form the diamond in a pattern gap of the patterned diamond prepared in the first step. There can be provided a method for manufacturing a diamond substrate with few dislocation defects, in which generation of abnormal growth particles are suppressed.Type: GrantFiled: February 28, 2017Date of Patent: October 16, 2018Assignees: SHIN-ETSU CHEMICAL CO., LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITYInventors: Hitoshi Noguchi, Shozo Shirai, Toshiharu Makino, Masahiko Ogura, Hiromitsu Kato, Hiroyuki Kawashima, Daisuke Kuwabara, Satoshi Yamasaki, Daisuke Takeuchi, Norio Tokuda, Takao Inokuma, Tsubasa Matsumoto
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Publication number: 20180223447Abstract: It is an object to provide a method for producing a diamond substrate effective for reducing various defects including dislocation defects and a foundation substrate used for the same. This object is achieved by a foundation substrate for forming a diamond film by a chemical vapor deposition method, wherein an off angle is provided to the surface of the foundation substrate with respect to a predetermined crystal plane orientation.Type: ApplicationFiled: February 2, 2018Publication date: August 9, 2018Applicants: SHIN-ETSU CHEMICAL CO., LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITYInventors: Hitoshi NOGUCHI, Toshiharu MAKINO, Masahiko OGURA, Hiromitsu KATO, Hiroyuki KAWASHIMA, Satoshi YAMASAKI, Norio TOKUDA
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Patent number: 9917091Abstract: A method of manufacturing a semiconductor device, includes: forming an insulating film on a first surface of a semiconductor substrate; and forming a hydrogen supply film on a second surface facing the first surface of the semiconductor substrate, the hydrogen supply film containing one or more of silicon oxide, TEOS, BPSG, BSG, PSG, FSG, carbon-containing silicon oxide, silicon nitride, carbon-containing silicon nitride, and oxygen-containing silicon carbide.Type: GrantFiled: May 28, 2015Date of Patent: March 13, 2018Assignee: SONY CORPORATIONInventors: Katsuhisa Kugimiya, Kenichi Murata, Hitoshi Okano, Shigetaka Mori, Hiroyuki Kawashima, Takuma Matsuno
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Publication number: 20170247811Abstract: The present invention provides a method for manufacturing a diamond substrate, including: a first step of preparing patterned diamond on a foundation surface, a second step of growing diamond from the patterned diamond prepared in the first step to form the diamond in a pattern gap of the patterned diamond prepared in the first step, a third step of removing the patterned diamond prepared in the first step to form a patterned diamond composed of the diamond formed in the second step, and a fourth step of growing diamond from the patterned diamond formed in the third step to form the diamond in a pattern gap of the patterned diamond formed in the third step. There can be provided a method for manufacturing a diamond substrate which can sufficiently suppress dislocation defects, a high-quality diamond substrate, and a freestanding diamond substrate.Type: ApplicationFiled: February 28, 2017Publication date: August 31, 2017Applicants: SHIN-ETSU CHEMICAL CO., LTD., National Institute of Advanced Industrial Science and Technology, NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITYInventors: Hitoshi NOGUCHI, Shozo SHIRAI, Toshiharu MAKINO, Masahiko OGURA, Hiromitsu KATO, Hiroyuki KAWASHIMA, Daisuke KUWABARA, Satoshi YAMASAKI, Daisuke TAKEUCHI, Norio TOKUDA, Takao INOKUMA, Tsubasa MATSUMOTO
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Publication number: 20170247814Abstract: The present invention provides a method for manufacturing a diamond substrate, including: a first step of preparing patterned diamond on a foundation surface, a second step of removing a foreign substance adhered on a wall of the patterned diamond prepared in the first step, and a third step of growing diamond from the patterned diamond prepared in the first step to form the diamond in a pattern gap of the patterned diamond prepared in the first step. There can be provided a method for manufacturing a diamond substrate with few dislocation defects, in which generation of abnormal growth particles are suppressed.Type: ApplicationFiled: February 28, 2017Publication date: August 31, 2017Applicants: SHIN-ETSU CHEMICAL CO., LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITYInventors: Hitoshi NOGUCHI, Shozo SHIRAI, Toshiharu MAKINO, Masahiko OGURA, Hiromitsu KATO, Hiroyuki KAWASHIMA, Daisuke KUWABARA, Satoshi YAMASAKI, Daisuke TAKEUCHI, Norio TOKUDA, Takao INOKUMA, Tsubasa MATSUMOTO
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Publication number: 20170207223Abstract: A method of manufacturing a semiconductor device, includes: forming an insulating film on a first surface of a semiconductor substrate; and forming a hydrogen supply film on a second surface facing the first surface of the semiconductor substrate, the hydrogen supply film containing one or more of silicon oxide, TEOS, BPSG, BSG, PSG, FSG, carbon-containing silicon oxide, silicon nitride, carbon-containing silicon nitride, and oxygen-containing silicon carbide.Type: ApplicationFiled: May 28, 2015Publication date: July 20, 2017Inventors: KATSUHISA KUGIMIYA, KENICHI MURATA, HITOSHI OKANO, SHIGETAKA MORI, HIROYUKI KAWASHIMA, TAKUMA MATSUNO
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Publication number: 20170162048Abstract: A collision determination apparatus used in a mobile body includes: a receiver receiving radio waves from reference stations; a pseudo range identifying unit identifying a pseudo range to a captured reference station; a self-single difference calculation unit calculating a self-single difference between a first reference station and a second reference station; a transmission unit transmitting a pseudo range associated information into surrounding the mobile body; a reception unit receiving the pseudo range associated information of an external apparatus; an external single difference identifying unit identifying an external single difference between the pseudo ranges to the first and second reference stations; a double difference calculating unit calculating a double difference between the self-single difference and the external single difference; and an approaching relationship determination unit determining whether or not the double difference tends to decrease and determining an approaching relationship whType: ApplicationFiled: November 30, 2016Publication date: June 8, 2017Inventors: Yasunobu Sugiura, Hiroyuki Kawashima
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Patent number: 9484368Abstract: A solid-state imaging device includes a semiconductor substrate configured to include a solid-state imaging element that is provided with a photoelectric conversion region, and a scribe line region that is provided along a periphery of the solid-state imaging element, a wiring layer that is formed to be layered on the semiconductor substrate, a support substrate that is formed to be layered on the wiring layer, and a groove that is provided between a blade region in the scribe line region and the solid-state imaging element, in the semiconductor substrate and penetrates through the semiconductor substrate.Type: GrantFiled: June 2, 2014Date of Patent: November 1, 2016Assignee: Sony CorporationInventor: Hiroyuki Kawashima
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Patent number: 9187233Abstract: There is provided a brightening ink composition for printing intended for realizing a heat insulating foamed paper container produced by foaming a low-melting point film by a heat treatment, such as a heat insulating foamed paper cup, the brightening ink composition conforming to the foaming without the occurrence of ink splits (cracks) upon foaming, having very small differences in level between the brightening printed areas and other printed areas at the container surface after foaming, making the container surface almost smooth, and having excellent design applicability and aesthetic properties as well as excellent heat resistance and print quality. A brightening ink composition containing a brightening material that imparts a sense of brightness, silicon dioxide, a binder resin and a solvent is prepared, and the brightening ink composition is used to form a printed layer of a paper container material for producing a heat insulating foamed paper container.Type: GrantFiled: March 30, 2009Date of Patent: November 17, 2015Assignees: NISSIN FOODS HOLDINGS CO., LTD., Toyo Ink Mfg. Co., Ltd.Inventors: Manabu Matsuzaki, Hiroshi Tsukawaki, Mitsuaki Hirata, Shinya Sugiura, Hiroyuki Kawashima
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Patent number: 8944198Abstract: A vehicle generally includes a motor that drives wheels of the vehicle, a high voltage battery that supplies electric power to the motor, and an exhaust system that exhausts a gas generated by the high voltage battery from the vehicle. The exhaust system for a battery includes an exhaust fan that exhausts the gas generated by the high voltage battery, a control unit that controls operation of the exhaust fan, and a collision detection unit that detects a collision of the vehicle. The control unit has a structure that operates the exhaust fan when the collision detection unit detects a collision of a vehicle.Type: GrantFiled: September 20, 2011Date of Patent: February 3, 2015Assignee: Suzuki Motor CorporationInventors: Shogo Miyazaki, Hiroyuki Kawashima, Tomoaki Morikawa
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Publication number: 20140284670Abstract: A solid-state imaging device includes a semiconductor substrate configured to include a solid-state imaging element that is provided with a photoelectric conversion region, and a scribe line region that is provided along a periphery of the solid-state imaging element, a wiring layer that is formed to be layered on the semiconductor substrate, a support substrate that is formed to be layered on the wiring layer, and a groove that is provided between a blade region in the scribe line region and the solid-state imaging element, in the semiconductor substrate and penetrates through the semiconductor substrate.Type: ApplicationFiled: June 2, 2014Publication date: September 25, 2014Inventor: Hiroyuki Kawashima
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Patent number: 8786055Abstract: A solid-state imaging device includes a semiconductor substrate configured to include a solid-state imaging element that is provided with a photoelectric conversion region, and a scribe line region that is provided along a periphery of the solid-state imaging element, a wiring layer that is formed to be layered on the semiconductor substrate, a support substrate that is formed to be layered on the wiring layer, and a groove that is provided between a blade region in the scribe line region and the solid-state imaging element, in the semiconductor substrate and penetrates through the semiconductor substrate.Type: GrantFiled: November 17, 2010Date of Patent: July 22, 2014Assignee: Sony CorporationInventor: Hiroyuki Kawashima
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Patent number: 8431195Abstract: An ink composition having a colorant; a binder resin; and a solvent; wherein the elongation ratio of the binder resin is 400% to 3,000%; wherein the binder resin comprises a urethane resin and a vinyl chloride/vinyl acetate copolymer, and the mixing ratio of the urethane resin:vinyl chloride/vinyl acetate copolymer relative to the total weight of the urethane resin and the vinyl chloride/vinyl acetate copolymer is 50:50 to 99:1; and wherein the urethane resin comprises a urethane-urea resin that is obtained by a process comprising reacting dibutylamine and a urethane prepolymer obtained by a process comprising reacting a polymeric polyol component having a number average molecular weight of 500 to 10,000 and an organic diisocyanate component having terminal isocyanate groups. A heat insulating foamed paper container material having at least one print pattern formed from said ink composition.Type: GrantFiled: March 27, 2009Date of Patent: April 30, 2013Assignees: Nissin Foods Holdings Co., Ltd., Toyo Ink Mfg. Co., Ltd.Inventors: Manabu Matsuzaki, Hiroshi Tsukawaki, Mitsuaki Hirata, Shinya Sugiura, Hiroyuki Kawashima
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Publication number: 20120070706Abstract: A vehicle generally includes a motor that drives wheels of the vehicle, a high voltage battery that supplies electric power to the motor, and an exhaust system that exhausts a gas generated by the high voltage battery from the vehicle. The exhaust system for a battery includes an exhaust fan that exhausts the gas generated by the high voltage battery, a control unit that controls operation of the exhaust fan, and a collision detection unit that detects a collision of the vehicle. The control unit has a structure that operates the exhaust fan when the collision detection unit detects a collision of a vehicle.Type: ApplicationFiled: September 20, 2011Publication date: March 22, 2012Applicant: SUZUKI MOTOR CORPORATIONInventors: Shogo MIYAZAKI, Hiroyuki KAWASHIMA, Tomoaki MORIKAWA
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Publication number: 20110127631Abstract: A solid-state imaging device includes a semiconductor substrate configured to include a solid-state imaging element that is provided with a photoelectric conversion region, and a scribe line region that is provided along a periphery of the solid-state imaging element, a wiring layer that is formed to be layered on the semiconductor substrate, a support substrate that is formed to be layered on the wiring layer, and a groove that is provided between a blade region in the scribe line region and the solid-state imaging element, in the semiconductor substrate and penetrates through the semiconductor substrate.Type: ApplicationFiled: November 17, 2010Publication date: June 2, 2011Applicant: SONY CORPORATIONInventor: Hiroyuki Kawashima
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Publication number: 20110111150Abstract: There is provided a brightening ink composition for printing intended for realizing a heat insulating foamed paper container produced by foaming a low-melting point film by a heat treatment, such as a heat insulating foamed paper cup, the brightening ink composition conforming to the foaming without the occurrence of ink splits (cracks) upon foaming, having very small differences in level between the brightening printed areas and other printed areas at the container surface after foaming, making the container surface almost smooth, and having excellent design applicability and aesthetic properties as well as excellent heat resistance and print quality. A brightening ink composition containing a brightening material that imparts a sense of brightness, silicon dioxide, a binder resin and a solvent is prepared, and the brightening ink composition is used to form a printed layer of a paper container material for producing a heat insulating foamed paper container.Type: ApplicationFiled: March 30, 2009Publication date: May 12, 2011Applicants: Nissin Foods Holdings Co., Ltd., Toyo Ink Mfg. Co., Ltd.Inventors: Manabu Matsuzaki, Hiroshi Tsukawaki, Mitsuaki Hirata, Shinya Sugiura, Hiroyuki Kawashima
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Publication number: 20110101083Abstract: There is provided a printing ink to be used in the production of a heat insulating foamed paper container obtained by heating a paper container which has a container body unit laminated with a high-melting point thermoplastic synthetic resin film on the inner surface and with a low-melting point thermoplastic synthetic resin film (low-Mp resin film) on the outer surface, and thereby foaming the low-Mp resin film, the printing ink being printed on the laminated low-Mp resin film upon the production of the paper container but inhibiting the occurrence of differences in level at the foamed surface of the low-Mp resin film. In an ink composition for printing on foamed paper containers, which contains a colorant, a binder resin and a solvent, a resin having an elongation ratio (elongation ratio as measured with a small-size tensile tester manufactured by Intesco Co., Ltd., under the conditions of a tensile speed of 100 mm/min and room temperature (25° C.)) of 400% to 3,000% is used as the binder resin.Type: ApplicationFiled: March 27, 2009Publication date: May 5, 2011Applicants: Nissin Foods Holdings Co., Ltd., Toyo Ink Mfg., Co., Ltd.Inventors: Manabu Matsuzaki, Hiroshi Tsukawaki, Mitsuaki Hirata, Shinya Sugiura, Hiroyuki Kawashima
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Patent number: 7780291Abstract: A wavefront aberration compensating apparatus includes: a deformable mirror which compensates a wavefront aberration of a light flux entered, the deformable mirror including a plurality of electrodes, and a thin-film mirror which changes a configuration thereof in accordance with a voltage value applied to each of the electrodes; an optical system provided with the deformable mirror, and including an object subjected to aberration compensation; a wavefront sensor which receives the light flux traveled through the object and the deformable mirror, and which measures the wavefront aberration of the light flux; and a controller configured to calculate the voltage value applied to each of the electrodes, on the basis of differences, from a signal outputted from the wavefront sensor, between application points on the thin-film mirror and target points both corresponding to the electrodes, respectively, and to repeat compensation of the configuration of the thin-film mirror of the deformable mirror on the basis ofType: GrantFiled: March 13, 2008Date of Patent: August 24, 2010Assignee: Kabushiki Kaisha TOPCONInventors: Noriko Saito, Akio Kobayashi, Hiroyuki Kawashima