Patents by Inventor Hiroyuki Kono

Hiroyuki Kono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060200280
    Abstract: A rail non-contact vehicle includes wheels, a vehicle main body supported by the wheels, and a steering control system. The steering control system includes a control section configured to control a steering of the wheels in a non-mechanical manner, and a drive section configured to mechanically drive the steering of the wheels. The control section includes a first detector configured to detect 1-dimensional coordinate data of a target route, a steering angle holding section configured to hold a target steering angle corresponding to the 1-dimensional coordinate data, a second detector configured to detect a current deviation between the target route and a current position of the vehicle main body, and a control steering angle calculating section configured to generate a control steering angle corresponding to the current deviation and the target steering angle.
    Type: Application
    Filed: October 30, 2003
    Publication date: September 7, 2006
    Applicant: Mitsubishi Heavy Industries, Ltd.
    Inventors: Hiroyuki Kono, Masahiro Yamaguchi, Hiroshi Yamashita, Masahisa Masukawa, Shunji Morhichika, Hiroyuki Mochidome, Koki Fukuda
  • Publication number: 20050250918
    Abstract: A catalyst for olefin polymerization comprising (A) a solid catalyst component which is prepared by causing (a) a magnesium compound, (b) a tetravalent titanium halide compound, and (c) an electron donor compound to come in contact with each other, (B) an organoaluminum compound of the formula R1pAlQ3-p, and (C) an organosilicon compound of the formula SiR2R3(OR4)(OR5), and (D) an organosilicon compound of the formula R6xSi(OR7)4-x exhibits a higher hydrogen activity than conventional catalysts.
    Type: Application
    Filed: May 4, 2005
    Publication date: November 10, 2005
    Applicant: TOHO CATALYST CO., LTD.
    Inventors: Motoki Hosaka, Hiroyuki Kono, Hayashi Ogawa
  • Publication number: 20030162744
    Abstract: A novel chondroitin sulfate which can be produced more economically in a large amount and is expected as being useful for various purposes and processes for producing the same. Namely, a novel chondroitin sulfate which has an intermediate structure between the conventionally known whale-origin chondroitin sulfate and shark-origin chondroitin sulfate and is expected as useful for various purposes in the fields of drugs, cosmetics, food additives, etc. A process for producing the above-described chondroitin sulfate comprises grinding salmon nasal cartilage at a low temperature, defatting the ground matter, then treating it with an alkali and pronase, centrifuging the thus obtained liquid digested matter and then precipitating it from ethanol; and another process wherein the precipitate thus obtained is further treated with a cation exchange resin.
    Type: Application
    Filed: December 17, 2002
    Publication date: August 28, 2003
    Inventors: Mitsuo Takai, Hiroyuki Kono
  • Patent number: 6472930
    Abstract: A current generator (CG) is composed of a constant-current-source transistor M1, and transistors (M2, M3). On receipt of control signals (VG2, VG3) respectively from a driver circuit (not shown), the transistors (M2, M3) complementarily operate to function as current switches. Then, damping resistance (R3) is provided between the drain electrode of the transistor (M3) and an output terminal ({overscore (IT)}). The output terminal ({overscore (IT)}) is connected to a ground (GND), while an output terminal (IT) is grounded via an external terminal (R2). Such a structure allows a semiconductor integrated circuit device to reduce its output ringing and further to suppress imperfections resulting from the adoption of the structure to reduce the ringing.
    Type: Grant
    Filed: October 23, 1998
    Date of Patent: October 29, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yasuo Morimoto, Hiroyuki Kono, Takahiro Miki
  • Patent number: 6417264
    Abstract: Provided is a cationic polymer-modified silica dispersion which comprises silica fine particles having an average particle diameter of less than 200 nm and a cationic polymer and which does not bring about coagulation of the silica particles. The above dispersion which is diluted to a solid concentration of 1.5% by weight is characterized by having a light scattering index (n value) of 2.0 or more. The above dispersion can be produced by oppositely-colliding a mixed solution obtained by mixing silica with a cationic polymer in a polar solvent at a treating pressure of 300 kgf/cm2 or more or passing it through an orifice under a condition that a pressure difference between the inlet side and the outlet side of the orifice is 300 kgf cm2 or more.
    Type: Grant
    Filed: December 22, 1999
    Date of Patent: July 9, 2002
    Assignee: Tokuyama Corporation
    Inventors: Hiroyuki Kono, Kenji Fukunaga, Kenichi Ishizu, Yoshinori Tagashira
  • Patent number: 6340374
    Abstract: A polishing slurry having a high polishing rate is provided. A polishing slurry comprising water, fumed silica having an average primary particle size of 9 to 60 nm and spherical silica having an average primary particle size of 40 to 600 nm excluding the fumed silica, wherein a content of the whole silicas obtained by totaling the fumed silica and the spherical silica falls in a range of 1 to 40% by weight, and a process for polishing a semiconductor device using the polishing slurry described above.
    Type: Grant
    Filed: March 27, 2000
    Date of Patent: January 22, 2002
    Assignee: Tokuyama Corporation
    Inventors: Hiroshi Kato, Naoto Mochizuki, Hiroyuki Kono
  • Patent number: 6338744
    Abstract: Provided is a high purity polishing slurry which provides a material to be polished with a high scratch resistance and has a high polishing efficiency and which less contaminates the material to be polished. The polishing slurry comprises water and silica particles dispersed in water, wherein the above silica particles have an average primary particle size of 50 to 300 nm and a refractive index of 1.41 to 1.44 and are synthesized in a liquid phase and produced without passing through a drying step; and the K value is 5×10−6 mol/m2 or more. Further, a polishing process for a semiconductor wafer using the above polishing slurry is provided.
    Type: Grant
    Filed: January 11, 2000
    Date of Patent: January 15, 2002
    Assignees: Tokuyama Corporation, Toshiba Corporation
    Inventors: Yoshikuni Tateyama, Katsumi Yamamoto, Hiroshi Kato, Kazuhiko Hayashi, Hiroyuki Kono